JPS6452275U - - Google Patents
Info
- Publication number
- JPS6452275U JPS6452275U JP14743487U JP14743487U JPS6452275U JP S6452275 U JPS6452275 U JP S6452275U JP 14743487 U JP14743487 U JP 14743487U JP 14743487 U JP14743487 U JP 14743487U JP S6452275 U JPS6452275 U JP S6452275U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- solder paste
- mounted electronic
- printed circuit
- metal powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 4
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案に係る面実装型電子部品を使
用した基板装置の一例を示す要部の断面図、第２
図はその一部の拡大断面図、第３図はプリント基
板への実装状態を示す図、第４図はハンダペース
トによるマンハツタン現象の発生を示す図、第５
図は従来の他の実装状態を示す図、第６図はその
ときの平面図、第７図はセルフアライメント効果
の説明図である。
１……面実装部品、３，４……電極部、８，９
……ハンダペースト、１０……金属粉末。
Figure 1 is a cross-sectional view of the main parts of an example of a board device using surface-mounted electronic components according to this invention;
The figure is an enlarged cross-sectional view of a part of it, Figure 3 is a diagram showing how it is mounted on a printed circuit board, Figure 4 is a diagram showing the occurrence of Manhattan phenomenon due to solder paste, and Figure 5 is a diagram showing the occurrence of Manhattan phenomenon due to solder paste.
The figure shows another conventional mounting state, FIG. 6 is a plan view at that time, and FIG. 7 is an explanatory diagram of the self-alignment effect. 1... Surface mount component, 3, 4... Electrode part, 8, 9
...Solder paste, 10...Metal powder.
Claims (1)
つて、 面実装型電子部品がプリント基板上に実装され
るようになされたことを特徴とする面実装型電子
部品を使用した基板装置。[Scope of claim for utility model registration] Use of a surface-mounted electronic component characterized in that the surface-mounted electronic component is mounted on a printed circuit board using solder paste mixed with a predetermined amount of metal powder. board equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987147434U JPH0729662Y2 (en) | 1987-09-25 | 1987-09-25 | Substrate device using surface mount electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987147434U JPH0729662Y2 (en) | 1987-09-25 | 1987-09-25 | Substrate device using surface mount electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6452275U true JPS6452275U (en) | 1989-03-31 |
| JPH0729662Y2 JPH0729662Y2 (en) | 1995-07-05 |
Family
ID=31417829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987147434U Expired - Lifetime JPH0729662Y2 (en) | 1987-09-25 | 1987-09-25 | Substrate device using surface mount electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0729662Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5840895A (en) * | 1981-09-03 | 1983-03-09 | 株式会社東芝 | Method of producing flexible printed circuit board |
| JPS62259494A (en) * | 1986-05-06 | 1987-11-11 | 東芝エー・ブイ・イー株式会社 | Wiring board device |
-
1987
- 1987-09-25 JP JP1987147434U patent/JPH0729662Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5840895A (en) * | 1981-09-03 | 1983-03-09 | 株式会社東芝 | Method of producing flexible printed circuit board |
| JPS62259494A (en) * | 1986-05-06 | 1987-11-11 | 東芝エー・ブイ・イー株式会社 | Wiring board device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0729662Y2 (en) | 1995-07-05 |
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