JPS6448818A - Epoxy-modified silicon resin composition - Google Patents
Epoxy-modified silicon resin compositionInfo
- Publication number
- JPS6448818A JPS6448818A JP20485487A JP20485487A JPS6448818A JP S6448818 A JPS6448818 A JP S6448818A JP 20485487 A JP20485487 A JP 20485487A JP 20485487 A JP20485487 A JP 20485487A JP S6448818 A JPS6448818 A JP S6448818A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy
- resin
- modified silicon
- molecule
- silicon resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To obtain the title low-temperature curable composition which can give a film of an excellent appearance, by mixing a specified epoxy-modified silicon resin with a curing agent. CONSTITUTION:An epoxy-modified silicon resin (A) having at least one epoxy group in the molecule and at least 3wt.%, based on the resin solid, silanol groups is obtained by reacting 10-90wt.% alkoxysilane compound (precondensate) (a) having at least two 1-5C alkoxyl groups in the molecule and a number-average MW <=3,000 with 90-10wt.% epoxy resin (b) having at least one epoxy group and at least one hydroxyl group in the molecule and having a number-average MW <=1,000 at 65-150 deg.C in an inert solvent for 1-5hr in the presence of a catalyst (c), removing by-products from the reaction mixture, adding 0.5-1.5mol. of water per remaining alkoxyl group (d) and a hydrolysis catalyst (e) to the mixture, and hydrolyzing the resulting mixture at 40-150 deg.C for 0.5-3hr. Component A is mixed with a curing agent (B) such as a metal chelate compound, a quat. ammonium salt, an organic compound, an organic resin or the like, each of which can perform crosslinking by reaction with the epoxy groups and/or silanol groups in component A.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20485487A JPS6448818A (en) | 1987-08-18 | 1987-08-18 | Epoxy-modified silicon resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20485487A JPS6448818A (en) | 1987-08-18 | 1987-08-18 | Epoxy-modified silicon resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6448818A true JPS6448818A (en) | 1989-02-23 |
Family
ID=16497496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20485487A Pending JPS6448818A (en) | 1987-08-18 | 1987-08-18 | Epoxy-modified silicon resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6448818A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5102960A (en) * | 1989-09-11 | 1992-04-07 | Bayer Aktiengesellschaft | Silicon-epoxy resin composition |
| US5525673A (en) * | 1989-03-03 | 1996-06-11 | Kansai Paint Company, Limited | Hydroxyl and epoxy polymer, hydrolyzable silicone polymer, either containing flourine monomer |
| JP2003037368A (en) * | 2001-07-24 | 2003-02-07 | Taiyo Ink Mfg Ltd | Thermosetting epoxy resin composition for printed wiring board, multilayer printed wiring board manufactured by use thereof, and its manufacturing method |
| US6525160B1 (en) * | 1999-06-17 | 2003-02-25 | Arakawa Chemical Industries Ltd. | Epoxy resin composition and process for producing silane-modified epoxy resin |
| JP2003055435A (en) * | 2001-08-16 | 2003-02-26 | Arakawa Chem Ind Co Ltd | Electrical insulating resin composition, insulating material for electronic material and process for producing it |
| KR100444391B1 (en) * | 2000-12-30 | 2004-08-16 | 주식회사 디피아이 | Silicone oxide modified Epoxy Resin |
| US8546710B2 (en) | 2007-01-26 | 2013-10-01 | Panasonic Corporation | Automatic transmission switch |
| DE102013222003A1 (en) | 2013-10-29 | 2015-04-30 | Evonik Industries Ag | Means for the sealing of light-emitting diodes |
| US9518196B2 (en) | 2013-01-04 | 2016-12-13 | Akzo Nobel Coatings International B.V. | Polyester silicates |
-
1987
- 1987-08-18 JP JP20485487A patent/JPS6448818A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5525673A (en) * | 1989-03-03 | 1996-06-11 | Kansai Paint Company, Limited | Hydroxyl and epoxy polymer, hydrolyzable silicone polymer, either containing flourine monomer |
| US5102960A (en) * | 1989-09-11 | 1992-04-07 | Bayer Aktiengesellschaft | Silicon-epoxy resin composition |
| US6525160B1 (en) * | 1999-06-17 | 2003-02-25 | Arakawa Chemical Industries Ltd. | Epoxy resin composition and process for producing silane-modified epoxy resin |
| KR100444391B1 (en) * | 2000-12-30 | 2004-08-16 | 주식회사 디피아이 | Silicone oxide modified Epoxy Resin |
| JP2003037368A (en) * | 2001-07-24 | 2003-02-07 | Taiyo Ink Mfg Ltd | Thermosetting epoxy resin composition for printed wiring board, multilayer printed wiring board manufactured by use thereof, and its manufacturing method |
| JP2003055435A (en) * | 2001-08-16 | 2003-02-26 | Arakawa Chem Ind Co Ltd | Electrical insulating resin composition, insulating material for electronic material and process for producing it |
| US8546710B2 (en) | 2007-01-26 | 2013-10-01 | Panasonic Corporation | Automatic transmission switch |
| US9518196B2 (en) | 2013-01-04 | 2016-12-13 | Akzo Nobel Coatings International B.V. | Polyester silicates |
| DE102013222003A1 (en) | 2013-10-29 | 2015-04-30 | Evonik Industries Ag | Means for the sealing of light-emitting diodes |
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