Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filedfiledCritical
Priority to JP1987141052UpriorityCriticalpatent/JPH064577Y2/ja
Publication of JPS6447037UpublicationCriticalpatent/JPS6447037U/ja
Application grantedgrantedCritical
Publication of JPH064577Y2publicationCriticalpatent/JPH064577Y2/ja
238000004806packaging method and processMethods0.000claims1
Classifications
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
