JPS6426856U - - Google Patents
Info
- Publication number
- JPS6426856U JPS6426856U JP12189487U JP12189487U JPS6426856U JP S6426856 U JPS6426856 U JP S6426856U JP 12189487 U JP12189487 U JP 12189487U JP 12189487 U JP12189487 U JP 12189487U JP S6426856 U JPS6426856 U JP S6426856U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- lead
- die part
- recess provided
- inner lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims 1
- 239000003566 sealing material Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12189487U JPS6426856U (US20110232667A1-20110929-C00004.png) | 1987-08-06 | 1987-08-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12189487U JPS6426856U (US20110232667A1-20110929-C00004.png) | 1987-08-06 | 1987-08-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6426856U true JPS6426856U (US20110232667A1-20110929-C00004.png) | 1989-02-15 |
Family
ID=31369322
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12189487U Pending JPS6426856U (US20110232667A1-20110929-C00004.png) | 1987-08-06 | 1987-08-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6426856U (US20110232667A1-20110929-C00004.png) |
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1987
- 1987-08-06 JP JP12189487U patent/JPS6426856U/ja active Pending