JPS6422046U - - Google Patents

Info

Publication number
JPS6422046U
JPS6422046U JP11690187U JP11690187U JPS6422046U JP S6422046 U JPS6422046 U JP S6422046U JP 11690187 U JP11690187 U JP 11690187U JP 11690187 U JP11690187 U JP 11690187U JP S6422046 U JPS6422046 U JP S6422046U
Authority
JP
Japan
Prior art keywords
plastic package
external connection
electrode pin
exposed
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11690187U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11690187U priority Critical patent/JPS6422046U/ja
Publication of JPS6422046U publication Critical patent/JPS6422046U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP11690187U 1987-07-29 1987-07-29 Pending JPS6422046U (US07943777-20110517-C00090.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11690187U JPS6422046U (US07943777-20110517-C00090.png) 1987-07-29 1987-07-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11690187U JPS6422046U (US07943777-20110517-C00090.png) 1987-07-29 1987-07-29

Publications (1)

Publication Number Publication Date
JPS6422046U true JPS6422046U (US07943777-20110517-C00090.png) 1989-02-03

Family

ID=31359862

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11690187U Pending JPS6422046U (US07943777-20110517-C00090.png) 1987-07-29 1987-07-29

Country Status (1)

Country Link
JP (1) JPS6422046U (US07943777-20110517-C00090.png)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5512781A (en) * 1992-12-01 1996-04-30 Kabushiki Kaisha Toshiba Semiconductor package device for super high-frequency band
KR100342812B1 (ko) * 1996-11-28 2002-11-18 앰코 테크놀로지 코리아 주식회사 접지선및전원선을구비한에어리어어레이범프드반도체패키지
KR100342811B1 (ko) * 1996-11-28 2002-11-27 앰코 테크놀로지 코리아 주식회사 복수개의칩이내장된에어리어어레이범프드반도체패키지
KR100379083B1 (ko) * 1996-11-28 2004-02-05 앰코 테크놀로지 코리아 주식회사 리드온칩에어리어어레이범프드반도체패키지

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6131626A (ja) * 1984-07-24 1986-02-14 Mitsubishi Heavy Ind Ltd 燃焼器の燃料ノズルパ−ジ装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6131626A (ja) * 1984-07-24 1986-02-14 Mitsubishi Heavy Ind Ltd 燃焼器の燃料ノズルパ−ジ装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5512781A (en) * 1992-12-01 1996-04-30 Kabushiki Kaisha Toshiba Semiconductor package device for super high-frequency band
KR100342812B1 (ko) * 1996-11-28 2002-11-18 앰코 테크놀로지 코리아 주식회사 접지선및전원선을구비한에어리어어레이범프드반도체패키지
KR100342811B1 (ko) * 1996-11-28 2002-11-27 앰코 테크놀로지 코리아 주식회사 복수개의칩이내장된에어리어어레이범프드반도체패키지
KR100379083B1 (ko) * 1996-11-28 2004-02-05 앰코 테크놀로지 코리아 주식회사 리드온칩에어리어어레이범프드반도체패키지

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