JPS6422032U - - Google Patents
Info
- Publication number
- JPS6422032U JPS6422032U JP11736987U JP11736987U JPS6422032U JP S6422032 U JPS6422032 U JP S6422032U JP 11736987 U JP11736987 U JP 11736987U JP 11736987 U JP11736987 U JP 11736987U JP S6422032 U JPS6422032 U JP S6422032U
- Authority
- JP
- Japan
- Prior art keywords
- needle
- adhesive
- tip
- core
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11736987U JPS6422032U (US07413550-20080819-C00001.png) | 1987-07-30 | 1987-07-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11736987U JPS6422032U (US07413550-20080819-C00001.png) | 1987-07-30 | 1987-07-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6422032U true JPS6422032U (US07413550-20080819-C00001.png) | 1989-02-03 |
Family
ID=31360770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11736987U Pending JPS6422032U (US07413550-20080819-C00001.png) | 1987-07-30 | 1987-07-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6422032U (US07413550-20080819-C00001.png) |
-
1987
- 1987-07-30 JP JP11736987U patent/JPS6422032U/ja active Pending
