JPS6420623A - Flattening method - Google Patents

Flattening method

Info

Publication number
JPS6420623A
JPS6420623A JP17591687A JP17591687A JPS6420623A JP S6420623 A JPS6420623 A JP S6420623A JP 17591687 A JP17591687 A JP 17591687A JP 17591687 A JP17591687 A JP 17591687A JP S6420623 A JPS6420623 A JP S6420623A
Authority
JP
Japan
Prior art keywords
film
electrode
etching
exposed
covered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17591687A
Other languages
English (en)
Inventor
Shuichi Nagasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP17591687A priority Critical patent/JPS6420623A/ja
Publication of JPS6420623A publication Critical patent/JPS6420623A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP17591687A 1987-07-16 1987-07-16 Flattening method Pending JPS6420623A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17591687A JPS6420623A (en) 1987-07-16 1987-07-16 Flattening method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17591687A JPS6420623A (en) 1987-07-16 1987-07-16 Flattening method

Publications (1)

Publication Number Publication Date
JPS6420623A true JPS6420623A (en) 1989-01-24

Family

ID=16004491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17591687A Pending JPS6420623A (en) 1987-07-16 1987-07-16 Flattening method

Country Status (1)

Country Link
JP (1) JPS6420623A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03288431A (ja) * 1990-04-05 1991-12-18 Nec Corp エッチバック平坦化方法
JP2020017555A (ja) * 2018-07-23 2020-01-30 株式会社アルバック ドライエッチング方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5664436A (en) * 1979-10-30 1981-06-01 Fujitsu Ltd Manufacturf of semiconductor device
JPS61107743A (ja) * 1984-10-30 1986-05-26 Nec Corp 半導体装置の製造方法
JPS6273723A (ja) * 1985-09-27 1987-04-04 Sumitomo Electric Ind Ltd エツチバツク法による平坦化工程終点検出方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5664436A (en) * 1979-10-30 1981-06-01 Fujitsu Ltd Manufacturf of semiconductor device
JPS61107743A (ja) * 1984-10-30 1986-05-26 Nec Corp 半導体装置の製造方法
JPS6273723A (ja) * 1985-09-27 1987-04-04 Sumitomo Electric Ind Ltd エツチバツク法による平坦化工程終点検出方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03288431A (ja) * 1990-04-05 1991-12-18 Nec Corp エッチバック平坦化方法
JP2020017555A (ja) * 2018-07-23 2020-01-30 株式会社アルバック ドライエッチング方法

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