JPS641743A - Filler for semiconductor sealing polymer - Google Patents

Filler for semiconductor sealing polymer

Info

Publication number
JPS641743A
JPS641743A JP15601487A JP15601487A JPS641743A JP S641743 A JPS641743 A JP S641743A JP 15601487 A JP15601487 A JP 15601487A JP 15601487 A JP15601487 A JP 15601487A JP S641743 A JPS641743 A JP S641743A
Authority
JP
Japan
Prior art keywords
filler
sealing polymer
semiconductor sealing
particle diameter
inorganic powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15601487A
Other languages
Japanese (ja)
Other versions
JPH011743A (en
Inventor
Kenji Otaguro
Noriyuki Kashiwamura
Takashi Chiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Priority to JP15601487A priority Critical patent/JPS641743A/en
Publication of JPH011743A publication Critical patent/JPH011743A/en
Publication of JPS641743A publication Critical patent/JPS641743A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To obtain the titled filler, consisting of an inorganic powder having a specific particle diameter and collapse angle and capable of providing a sealing polymer composition having low stress and excellent thermal shock resistance.
CONSTITUTION: A filler obtained by using an inorganic powder, e.g. spherical quartz glass or spherical alumina, having ≤149μm, further preferably ≤74μm maximum particle diameter and ≤20° collapse angle as a filler.
COPYRIGHT: (C)1989,JPO&Japio
JP15601487A 1987-06-23 1987-06-23 Filler for semiconductor sealing polymer Pending JPS641743A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15601487A JPS641743A (en) 1987-06-23 1987-06-23 Filler for semiconductor sealing polymer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15601487A JPS641743A (en) 1987-06-23 1987-06-23 Filler for semiconductor sealing polymer

Publications (2)

Publication Number Publication Date
JPH011743A JPH011743A (en) 1989-01-06
JPS641743A true JPS641743A (en) 1989-01-06

Family

ID=15618431

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15601487A Pending JPS641743A (en) 1987-06-23 1987-06-23 Filler for semiconductor sealing polymer

Country Status (1)

Country Link
JP (1) JPS641743A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5183378A (en) * 1990-03-20 1993-02-02 Tokyo Electron Sagami Limited Wafer counter having device for aligning wafers

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5183378A (en) * 1990-03-20 1993-02-02 Tokyo Electron Sagami Limited Wafer counter having device for aligning wafers

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