JPS641743A - Filler for semiconductor sealing polymer - Google Patents
Filler for semiconductor sealing polymerInfo
- Publication number
- JPS641743A JPS641743A JP15601487A JP15601487A JPS641743A JP S641743 A JPS641743 A JP S641743A JP 15601487 A JP15601487 A JP 15601487A JP 15601487 A JP15601487 A JP 15601487A JP S641743 A JPS641743 A JP S641743A
- Authority
- JP
- Japan
- Prior art keywords
- filler
- sealing polymer
- semiconductor sealing
- particle diameter
- inorganic powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To obtain the titled filler, consisting of an inorganic powder having a specific particle diameter and collapse angle and capable of providing a sealing polymer composition having low stress and excellent thermal shock resistance.
CONSTITUTION: A filler obtained by using an inorganic powder, e.g. spherical quartz glass or spherical alumina, having ≤149μm, further preferably ≤74μm maximum particle diameter and ≤20° collapse angle as a filler.
COPYRIGHT: (C)1989,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15601487A JPS641743A (en) | 1987-06-23 | 1987-06-23 | Filler for semiconductor sealing polymer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15601487A JPS641743A (en) | 1987-06-23 | 1987-06-23 | Filler for semiconductor sealing polymer |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH011743A JPH011743A (en) | 1989-01-06 |
JPS641743A true JPS641743A (en) | 1989-01-06 |
Family
ID=15618431
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15601487A Pending JPS641743A (en) | 1987-06-23 | 1987-06-23 | Filler for semiconductor sealing polymer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS641743A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5183378A (en) * | 1990-03-20 | 1993-02-02 | Tokyo Electron Sagami Limited | Wafer counter having device for aligning wafers |
-
1987
- 1987-06-23 JP JP15601487A patent/JPS641743A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5183378A (en) * | 1990-03-20 | 1993-02-02 | Tokyo Electron Sagami Limited | Wafer counter having device for aligning wafers |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SE8601522D0 (en) | DENTAL CEMENT COMPOSITIONS | |
CA2051361A1 (en) | Cementitious compositions and method | |
PT76745B (en) | Process for the preparation of imidazo-<1,2-c>pyrazolio-<3,4-e>-pyrimidines with antipsychotic effect and pharmaceutical compositions therewith | |
EP0347598A3 (en) | Polyphenylene ether/rubber modified polystyrene composition suitable for blow molding large parts | |
JPS57212225A (en) | Epoxy resin composition for encapsulation of semiconductor | |
JPS641743A (en) | Filler for semiconductor sealing polymer | |
JPS57102967A (en) | Heat-insulating coat composition | |
JPS57137351A (en) | Resin composition containing perfumery | |
JPS51137746A (en) | Thixotropic polyurethan e sealing composition | |
JPS5388198A (en) | Complex dielectric for capacitor | |
JPS53118209A (en) | Powder metallurgical method of manufacturing high-silicon containing sinteted aluminum alloy | |
JPS52151891A (en) | Resistor body for high temperature | |
JPS5266592A (en) | Preparation of cationic polychloroprene latexes | |
JPS5221299A (en) | Composition of iron oxide picment and its preparation of iron oxide picment | |
JPS57205436A (en) | Polyvinyl chloride resin paste composition for hot- press molding | |
JPS5229847A (en) | Heat-stable halogen containing resin composition | |
JPS5321294A (en) | Preparation of oxidation-polymerizable and vinyl-modified alkyd resin | |
JPS52130852A (en) | Resin compositions | |
JPS53127540A (en) | Adhesive composition | |
JPS51149345A (en) | Manufacturing polyolfin resin composition | |
JPS52151398A (en) | Method of curing epoxy resin | |
JPS5333999A (en) | Granulated material of zeolite | |
JPS5712073A (en) | Heat-resisting powder composition | |
JPS56144565A (en) | Semiconductor device | |
CA2443112A1 (en) | Granule with reduced dust potential |