JPS6415986A - Equipment for measuring semiconductor photosensor - Google Patents

Equipment for measuring semiconductor photosensor

Info

Publication number
JPS6415986A
JPS6415986A JP62172136A JP17213687A JPS6415986A JP S6415986 A JPS6415986 A JP S6415986A JP 62172136 A JP62172136 A JP 62172136A JP 17213687 A JP17213687 A JP 17213687A JP S6415986 A JPS6415986 A JP S6415986A
Authority
JP
Japan
Prior art keywords
chip
measured
supersonic wave
equipment
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62172136A
Inventor
Toshiaki Hoshi
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Priority to JP62172136A priority Critical patent/JPS6415986A/en
Publication of JPS6415986A publication Critical patent/JPS6415986A/en
Application status is Pending legal-status Critical

Links

Abstract

PURPOSE:To prevent the malfuction due to dust and the like, by providing a means which projects supersonic wave on the main surface of a semiconductor photo sensor chip to be measured, just before starting the measurement or during the measurement. CONSTITUTION:A probe 1 having electrical continuity brings a specified chip 7' to be measured among a plurarity of semiconductor photo sensor chips into contact with a metal pad 6. A photo sensor part 5 detects light, and the converted electric signal is delivered to a signal processing equipment. A light projecting equipment 4 to project a light having a specific light quantity and wavelength on a chip 7' to be measured, and a supersonic wave projecting equipment 3 to project a supersonic wave on a chip 7' to be measured are installed. Dust attaching to the chip 7' is exfoliated from the surface, and made to float by projecting the supersonic wave. An air suction opening 2 sucks and discharges the floating dust.
JP62172136A 1987-07-09 1987-07-09 Equipment for measuring semiconductor photosensor Pending JPS6415986A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62172136A JPS6415986A (en) 1987-07-09 1987-07-09 Equipment for measuring semiconductor photosensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62172136A JPS6415986A (en) 1987-07-09 1987-07-09 Equipment for measuring semiconductor photosensor

Publications (1)

Publication Number Publication Date
JPS6415986A true JPS6415986A (en) 1989-01-19

Family

ID=15936234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62172136A Pending JPS6415986A (en) 1987-07-09 1987-07-09 Equipment for measuring semiconductor photosensor

Country Status (1)

Country Link
JP (1) JPS6415986A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6224983B1 (en) 1989-05-04 2001-05-01 Ad Tech Holdings Limited Deposition of silver layer on nonconducting substrate
JP2007205869A (en) * 2006-02-01 2007-08-16 Sumida Corporation Ultrasonic proximity switch
CN106653637A (en) * 2016-11-29 2017-05-10 芜湖赋兴光电有限公司 Camera chip cleaning detection device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6224983B1 (en) 1989-05-04 2001-05-01 Ad Tech Holdings Limited Deposition of silver layer on nonconducting substrate
JP2007205869A (en) * 2006-02-01 2007-08-16 Sumida Corporation Ultrasonic proximity switch
CN106653637A (en) * 2016-11-29 2017-05-10 芜湖赋兴光电有限公司 Camera chip cleaning detection device

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