JPS6411537U - - Google Patents
Info
- Publication number
- JPS6411537U JPS6411537U JP10589587U JP10589587U JPS6411537U JP S6411537 U JPS6411537 U JP S6411537U JP 10589587 U JP10589587 U JP 10589587U JP 10589587 U JP10589587 U JP 10589587U JP S6411537 U JPS6411537 U JP S6411537U
- Authority
- JP
- Japan
- Prior art keywords
- paste
- piping
- solenoid valve
- pressure air
- discharging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007599 discharging Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Coating Apparatus (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10589587U JPS6411537U (US07922777-20110412-C00004.png) | 1987-07-09 | 1987-07-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10589587U JPS6411537U (US07922777-20110412-C00004.png) | 1987-07-09 | 1987-07-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6411537U true JPS6411537U (US07922777-20110412-C00004.png) | 1989-01-20 |
Family
ID=31338916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10589587U Pending JPS6411537U (US07922777-20110412-C00004.png) | 1987-07-09 | 1987-07-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6411537U (US07922777-20110412-C00004.png) |
-
1987
- 1987-07-09 JP JP10589587U patent/JPS6411537U/ja active Pending
