JPS6410502A - Lead wire for electronic component - Google Patents

Lead wire for electronic component

Info

Publication number
JPS6410502A
JPS6410502A JP16608587A JP16608587A JPS6410502A JP S6410502 A JPS6410502 A JP S6410502A JP 16608587 A JP16608587 A JP 16608587A JP 16608587 A JP16608587 A JP 16608587A JP S6410502 A JPS6410502 A JP S6410502A
Authority
JP
Japan
Prior art keywords
less
lead wire
glass
alloy
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16608587A
Other languages
Japanese (ja)
Inventor
Kazunao Kudo
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Priority to JP16608587A priority Critical patent/JPS6410502A/en
Publication of JPS6410502A publication Critical patent/JPS6410502A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To allow the airtight sealing with glass by using an Fe-Ni alloy mixed with Mn with the specific ratio. CONSTITUTION:A lead wire for electronic component is made of an alloy of Fe and Ni. The composition contains Ni 40-52wt.%, C 0.02wt.% or less, Si 0.3wt.% or less, Mn 0.75-1.25wt.%, P 0.025wt.% or less, S 0.025wt.% or less, Cr 0.1wt.% or less, Co 0.5wt.% or less, Al 0.1wt.% or less, other trace elements 0.2wt.% or less, and Fe remaining wt.%. When the Mn quantity in this Fe-Ni alloy is 1.25% or less, the plating property is good. At 0.75% or less, the adhesion with glass is reduced. The proper Mn quantity is 0.75-1.25%. The lead wire made of the Fe-Ni alloy with such composition has the expansion coefficient near the expansion coefficient of the glass used for the airtight sealing. It also has strength and the good plating property. The good airtight sealing with glass is thereby obtained.
JP16608587A 1987-07-02 1987-07-02 Lead wire for electronic component Pending JPS6410502A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16608587A JPS6410502A (en) 1987-07-02 1987-07-02 Lead wire for electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16608587A JPS6410502A (en) 1987-07-02 1987-07-02 Lead wire for electronic component

Publications (1)

Publication Number Publication Date
JPS6410502A true JPS6410502A (en) 1989-01-13

Family

ID=15824706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16608587A Pending JPS6410502A (en) 1987-07-02 1987-07-02 Lead wire for electronic component

Country Status (1)

Country Link
JP (1) JPS6410502A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104946972A (en) * 2015-07-07 2015-09-30 常州东大中天钢铁研究院有限公司 Steel disc strip for diode lead and production technology of steel disc strip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104946972A (en) * 2015-07-07 2015-09-30 常州东大中天钢铁研究院有限公司 Steel disc strip for diode lead and production technology of steel disc strip

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