JPS6397382A - Coating method for metal member - Google Patents
Coating method for metal memberInfo
- Publication number
- JPS6397382A JPS6397382A JP61241261A JP24126186A JPS6397382A JP S6397382 A JPS6397382 A JP S6397382A JP 61241261 A JP61241261 A JP 61241261A JP 24126186 A JP24126186 A JP 24126186A JP S6397382 A JPS6397382 A JP S6397382A
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- metal member
- metal
- metal plate
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 69
- 239000002184 metal Substances 0.000 title claims abstract description 69
- 238000000576 coating method Methods 0.000 title claims abstract description 24
- 238000007747 plating Methods 0.000 claims abstract description 55
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 20
- 239000000956 alloy Substances 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 claims description 18
- 238000005422 blasting Methods 0.000 claims description 5
- 238000005275 alloying Methods 0.000 claims description 2
- 238000002844 melting Methods 0.000 abstract description 12
- 230000008018 melting Effects 0.000 abstract description 12
- 238000005488 sandblasting Methods 0.000 abstract description 5
- 235000010627 Phaseolus vulgaris Nutrition 0.000 abstract 1
- 244000046052 Phaseolus vulgaris Species 0.000 abstract 1
- 239000011651 chromium Substances 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000010790 dilution Methods 0.000 description 4
- 239000012895 dilution Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000010309 melting process Methods 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229910018487 Ni—Cr Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000002592 echocardiography Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000010953 base metal Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- UPHIPHFJVNKLMR-UHFFFAOYSA-N chromium iron Chemical compound [Cr].[Fe] UPHIPHFJVNKLMR-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は金属部材のコーティング方法、更に詳しくは
金属部材の表面に合金元素をメッキして金属部材表面に
耐食性、耐摩耗性を持たせ、金属部材表面を高機能化す
る金属部材のコーティング方法に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method of coating a metal member, and more specifically, a method of coating a metal member by plating an alloy element on the surface of the metal member to impart corrosion resistance and wear resistance to the surface of the metal member. The present invention relates to a coating method for a metal member that improves the functionality of the surface of the metal member.
一般に金属部材、例えば金属管を油井管などに使用する
場合には、耐食性、耐摩耗性等が要求されることから、
金属管の表面にコーティングを施して耐食性、耐摩耗性
が得られるようにしていた。Generally, when using metal parts, such as metal pipes for oil country tubular goods, corrosion resistance, abrasion resistance, etc. are required.
A coating was applied to the surface of the metal tube to provide corrosion and abrasion resistance.
従来の金属部材の表面にコーティングして表面を高機能
化する代表的な方法としては、金属部材の表面に例えば
クロム、ニッケル等を電気メンキしてメッキ層でコーテ
ィングする方法がある。A typical conventional method of coating the surface of a metal member to make the surface highly functional includes a method of electroplating the surface of the metal member with, for example, chromium, nickel, etc. and coating it with a plating layer.
上記従来のメッキによる金属部材のコーティング方法で
は金属部材の表面にコーティングされたメッキ層の被覆
にピンホールが生じるために金属部材表面の耐食性、耐
摩耗性が劣り、更に金属部材表面とのメッキ層の密着性
が良好でないことから、熱衝撃によってメッキ層が＃Ｉ
離するおそれがあるという問題点があった。In the above-mentioned conventional method of coating metal parts by plating, pinholes occur in the coating of the plating layer coated on the surface of the metal part, resulting in poor corrosion resistance and abrasion resistance of the metal part surface, and furthermore, the plating layer on the surface of the metal part deteriorates. Because the adhesion of #I is not good, the plating layer becomes #I due to thermal shock.
There was a problem in that there was a risk that they would separate.
この発明はかかる問題点を解決するためになされたもの
で、ピンホールがなく、密着性が向上した良好な被膜を
容易に得ることができる金属部材のコーティング方法を
得ることを目的とする。The present invention has been made to solve these problems, and an object of the present invention is to provide a coating method for metal members that can easily form a good film with no pinholes and improved adhesion.
この発明に係る金属部材のコーティング方法は金属部材
の表面をブラスト加工により粗面に形成し、しかる後に
金属部材の表面に合金元素をメッキしてメッキ層を形成
し、その後メッキ層にレーザビームを照射してメッキ層
を合金層に溶融処理するように構成したものである。The coating method for a metal member according to the present invention involves forming the surface of the metal member into a rough surface by blasting, then plating the surface of the metal member with an alloy element to form a plating layer, and then applying a laser beam to the plating layer. The plated layer is melted into an alloy layer by irradiation.
この発明においては、金属部材のブラスト加工により粗
面に形成された表面に合金元素をメッキしてメッキ層を
形成し、その後メッキ層にレーザビームを照射してメッ
キ層を溶融処理するから、メッキ層表面も凹凸粗面とな
りメッキ層表面でのレーザビームの吸収率が高まり、メ
ッキ層成分の希釈率を小さく抑えたままメッキ層及び金
属部際の表面部分を溶融によって一体化して諏密な合金
層が形成される。In this invention, a plated layer is formed by plating an alloy element on a rough surface formed by blasting of a metal member, and then the plated layer is irradiated with a laser beam to melt the plated layer. The surface of the layer also becomes uneven and rough, increasing the absorption rate of the laser beam on the surface of the plating layer.The surface portion of the plating layer and the metal part are integrated by melting while keeping the dilution rate of the components of the plating layer low, forming a dense alloy. A layer is formed.
第１図（ａ）、 （ｂ）、 （ｃ）はこの発明の一
実施例で金属部材にメッキ層が形成される工程をそれぞ
れ示す説明図、第２図はこの発明の一実施例でメッキ層
及び金属部材の溶融処理工程を示す説明図である。図に
おいて、（１）は基材となるステンレス等の金属部材で
ある金属板、（１ａ）は金属ｖｉ（１）のコーティング
される表面で、サンドブラスト加工法或いはショツトブ
ラスト加工法によって５〜２０μｍ程度の粗さの粗面に
形成されている。（２）は金属板（１）の粗面に形成さ
れた表面（１ａ）に電気メッキあるいは化学メッキによ
って形成されたメッキ層、（３）は金属板（１）のメッ
キ層（２）を照射するレーザビーム、（４）はレーザビ
ーム（３）を集光する集光レンズ、（５）はレーザビー
ム（３）の照射による溶融処理によって形成された合金
層である。FIGS. 1(a), (b), and (c) are explanatory diagrams showing the steps of forming a plating layer on a metal member in an embodiment of the present invention, and FIG. FIG. 3 is an explanatory diagram showing a melting process of layers and metal members. In the figure, (1) is a metal plate that is a metal member such as stainless steel as a base material, and (1a) is the surface to be coated with metal vi (1), which is approximately 5 to 20 μm thick by sandblasting or shotblasting. It is formed on a rough surface with a roughness of . (2) is a plating layer formed on the rough surface (1a) of metal plate (1) by electroplating or chemical plating, and (3) is irradiation of plating layer (2) of metal plate (1). (4) is a condensing lens that focuses the laser beam (3), and (5) is an alloy layer formed by melting treatment by irradiation with the laser beam (3).
次に、この発明方法について説明する。Next, the method of this invention will be explained.
まず、第１図（ａ）に示す金属板（１）のコーティング
すべき表面（１ａ）をサンドブラスト加工法によって第
１図（ｂ）に示すように５〜２０μｍ程度の粗さの粗面
に形成する。First, the surface (1a) to be coated of the metal plate (1) shown in Fig. 1(a) is formed into a rough surface with a roughness of about 5 to 20 μm as shown in Fig. 1(b) by sandblasting. do.
次に、金属板（１）の粗面に形成された表面（Ｉａ）に
電気メッキにより、第１図（ｃ）に示すように添加希望
の合金元素のメッキ１１（２）を形成する。このときの
メッキＮ（２）の厚さは１０〜２００μｍである。Next, a plating 11 (2) of an alloying element desired to be added is formed on the rough surface (Ia) of the metal plate (1) by electroplating, as shown in FIG. 1(c). The thickness of the plating N(2) at this time is 10 to 200 μm.
しかる後に、第２図に示すように金属板（１）の表面（
１ａ）に形成されたメッキ層（２）に向けてＣＯｚ レ
ーザのレーザビーム（３）ｔ−［射して溶融処理を行う
。このとき、レーザビーム（３）をメッキ層（２）の全
面にわたって移動させてメッキｒｆＪ（２）の表面全体
の溶融を行う。After that, the surface of the metal plate (1) (
A laser beam (3) t-[ of a COz laser is emitted toward the plating layer (2) formed on layer 1a) to perform melting treatment. At this time, the laser beam (3) is moved over the entire surface of the plating layer (2) to melt the entire surface of the plating rfJ (2).
この溶融処理の状態は、レーザビーム（３）のビーム径
とレーザ移動速度によって左右され、適正条件を選定す
ればメッキＮ（２）の全部と金属板（１）の表面部分が
溶融される。この場合、メッキ層（２）は金属板（１）
のブラスト加工法によって粗面に形成された表面（１ａ
）に形成され、メッキ層（２）の表面が平滑でないこと
から、レーザビーム（３）の吸収率が高まり、メッキ層
（２）成分の希釈率を小さく抑えたままメッキ層（２）
及び金属板（１）の表面（１ａ）部分が溶融によって一
体化され、メッキ層（２）はピンホールがなく、緻密で
金属板（１）に対して密着性の高い合金層（５）となる
。ここにメッキ層（２）成分の希釈率Ｒは次式で表わさ
れる。The state of this melting process depends on the beam diameter of the laser beam (3) and the laser movement speed, and if appropriate conditions are selected, the entire plating N (2) and the surface portion of the metal plate (1) will be melted. In this case, the plating layer (2) is the metal plate (1)
A rough surface formed by the blasting method (1a
), and since the surface of the plating layer (2) is not smooth, the absorption rate of the laser beam (3) increases, and the plating layer (2) is formed while keeping the dilution rate of the components of the plating layer (2) small.
and the surface (1a) of the metal plate (1) are integrated by melting, and the plated layer (2) has no pinholes and is dense and has an alloy layer (5) with high adhesion to the metal plate (1). Become. Here, the dilution rate R of the components of the plating layer (2) is expressed by the following formula.
Ｒ＝Ｂ／ （Ａ＋Ｂ）
ＡはメッキＮ（２）の厚さ、Ｂは金属板（１）表面の溶
融された部分の厚さをいう。R=B/ (A+B) A is the thickness of the plating N (2), and B is the thickness of the melted portion of the surface of the metal plate (1).
このように、メッキ層（２）が合金層（５）となること
によって耐食性、耐摩耗性が優れ、密着性の良好な被膜
がコーティングされた金属板（１）が得られる。In this way, by forming the plating layer (2) into the alloy layer (5), a metal plate (1) coated with a film having excellent corrosion resistance and wear resistance and good adhesion can be obtained.
この実施例では、金属部材として金属板（１）の適用例
について述べたが、金属管のコーティングにも適用し得
ることは勿論である。In this embodiment, a metal plate (1) is used as the metal member, but it goes without saying that the present invention can also be applied to coating a metal tube.
次に、この発明方法により金罵板（１）の表面に被膜を
コーティングした具体例について説明する。Next, a specific example in which the surface of the gold plate (1) is coated with a film by the method of the present invention will be described.
〔具体例１〕
この具体例に使用される基材となる金属板（１）は５Ｕ
Ｓ３０４ステンレス網、寸法は肉厚が５ｍｍ、縦が５０
ｍ ｍ ％横が１００ｍｍである。[Specific Example 1] The metal plate (1) serving as the base material used in this specific example is 5U.
S304 stainless steel mesh, wall thickness 5mm, length 50mm
m m % width is 100 mm.
まず、この金属板（１）の表面（１ａ）をサンドブラス
ト加工法によって、５μｍの粗さの粗面に形成する。First, the surface (1a) of this metal plate (1) is formed into a rough surface with a roughness of 5 μm by sandblasting.
次に、この金属板（１）の粗面に形成された表面にＣｒ
を電気メッキしてＣｒの無光沢なメンキＮ（２）を形成
する。このメッキ層（２）のメッキ層は５０μｍである
。Next, Cr was applied to the rough surface of this metal plate (1).
is electroplated to form a matte Cr coating N (2). The thickness of this plating layer (2) is 50 μm.
更に、このＣｒのメッキ層（２）の全面を金属板（１）
の表面の一部と共にレーザビーム（３）により溶融処理
した。レーザビームの溶融処理条件は次のとおりである
。レーザの種類はＣＯ２レーザ、レーザ出力３ＫＷ、集
光レンズ（４）の焦点距離ｆは１５＃、レーザ焦点位置
は、＋４ｍｍ、レーザ移動速度は５ｍ／ｗｉｎである。Furthermore, the entire surface of this Cr plating layer (2) is coated with a metal plate (1).
It was melted together with a part of the surface by a laser beam (3). The laser beam melting processing conditions are as follows. The type of laser is a CO2 laser, the laser output is 3KW, the focal length f of the condensing lens (4) is 15#, the laser focal position is +4 mm, and the laser moving speed is 5 m/win.
このようなレーザビーム（３）の溶融処理により、メッ
キ層（２）は全に溶融されると共に金属板（１）も表面
下約２５μｍ溶融された。By such melting treatment with the laser beam (3), the plating layer (2) was completely melted, and the metal plate (1) was also melted approximately 25 μm below the surface.
この結果、クロムとステンレス鋼の約７５μｍ厚の合金
層（５）が得られた。この合金層（５）のＣｒ濃度は約
７２ｗｔ％である。As a result, an approximately 75 μm thick alloy layer (5) of chromium and stainless steel was obtained. The Cr concentration of this alloy layer (5) is approximately 72 wt%.
このようにして得られた金属板（１）の合金ＦＪ／母材
界面全面にわたって超音波試験を実施したが、欠陥エコ
ーは検出されず、ピンホールがなくなったことがｉ認さ
れた。また、一部断面検査を行ったが、欠陥は認められ
ず、均一な厚さの合金層（５）が形成されているのが確
認された。これによって、機密で密着性が同上し、熱衝
撃によって剥離のおそれがないコーティング被膜が得ら
れた。An ultrasonic test was conducted over the entire surface of the alloy FJ/base metal interface of the thus obtained metal plate (1), but no defective echoes were detected, and it was confirmed that there were no pinholes. In addition, a partial cross-sectional inspection was performed, but no defects were found, and it was confirmed that an alloy layer (5) of uniform thickness was formed. This resulted in a coating film that was airtight, had the same adhesion properties, and was free from peeling due to thermal shock.
まず、金属板（１）の表面をサンドブラスト加工法によ
って１５μｍの粗さの粗面に形成する。First, the surface of the metal plate (1) is formed into a rough surface with a roughness of 15 μm by sandblasting.
次に、その金属板（１）の表面にまずＮｉを電気メンキ
し、ついでＣｒを電気メッキしてＮｆ−Ｃｒの２層のメ
ンキＮ（２）を形成する。このメッキＮ（２）のメッキ
厚は、Ｎｉが２５μｍ１Ｃｒが２５μｍである。Next, the surface of the metal plate (1) is first electroplated with Ni and then electroplated with Cr to form a two-layer coating N(2) of Nf-Cr. The plating thickness of this plating N(2) is 25 μm for Ni and 25 μm for 1Cr.
更に、Ｎｉ−ＣｒのメッキＮ（２）の全面を金属板（１
）の表面の一部と共にレーザビーム（３）により溶融処
理した。Furthermore, the entire surface of the Ni-Cr plating N (2) is coated with a metal plate (1).
) was melted with a laser beam (3).
レーザビームの溶融処理条件はレーザ移動速度を４ｍ／
ｍｉｎにした以外は具体例１と同じである。The laser beam melting processing conditions are a laser movement speed of 4 m/
It is the same as Example 1 except that it is set to min.
このようなレーザビームの溶融処理により、Ｎｉ−Ｃｒ
のメッキ層（２）は全厚熔融されると共に金属板（１）
も表面下約２５μｍ溶融され、金ＩＸ板（１）の表面に
ニッケル、クロム鉄の約７５μｍ厚の合金層（５）が得
られた。この合金層（５）のＮｉ９Ｊ１度は３６ｗｔ％
Ｃｒｆ１度は３９ｗｔ％である。Through such laser beam melting treatment, Ni-Cr
The entire thickness of the plating layer (2) is melted and the metal plate (1) is melted.
The metal was melted approximately 25 μm below the surface, and an alloy layer (5) of nickel and chromium iron with a thickness of approximately 75 μm was obtained on the surface of the gold IX plate (1). The Ni9J degree of this alloy layer (5) is 36 wt%
Crf1 degree is 39wt%.
このようにして得られた金属板（１）の唇面全面にわた
って超音波試験を実施したが欠陥エコーは検出されなか
った。また、１部断面検査を行ったが、欠陥が認められ
なかった。An ultrasonic test was conducted over the entire lip surface of the metal plate (1) thus obtained, but no defective echoes were detected. In addition, a partial cross-sectional inspection was conducted, but no defects were found.
上記具体例１及び２に示すように、金属板表面に７５μ
ｍ被膜を形成した後、被膜の密着強度を調べた結果、密
着強度は下記表に示す通りとなった。As shown in Specific Examples 1 and 2 above, 75 μm was applied to the surface of the metal plate.
After forming the M coating, the adhesion strength of the coating was examined, and the adhesion strength was as shown in the table below.
表
なお、表中の粗面加工の欄における「無」は具体例１及
び２において、金属板の表面に粗面加工をしないでレー
ザビームによす溶融処理した場合の被膜の密着強度を示
している。In the table, "None" in the roughening column indicates the adhesion strength of the coating when the surface of the metal plate is melted by a laser beam without roughening in Examples 1 and 2. ing.
この表に示すように、金属板の表面に粗面加工をしない
場合に比べて粗面を形成して、レーザビームにより溶＋
ａｌｔ処理した場合には、いずれの具体例においても被
膜の密着強度が向上していることがわかる。As shown in this table, compared to the case where the surface of the metal plate is not roughened, a rougher surface is formed and the laser beam is used to melt it.
It can be seen that when alt treatment was applied, the adhesion strength of the coating was improved in all specific examples.
この発明は以上説明したとおり、金属部材のブラスト加
工により粗面に形成された表面に合金元素をメンキして
メッキ層を形成し、その後メッキ層にレーザビームを照
射してメッキ層を溶融処理するようにしたので、メッキ
層表面も凹凸粗面となりレーザビームの吸収率が高まり
、メッキ層成分の希釈率を小さく抑えたままメッキ層及
び金属部材の表面部分が溶融によって一体化して緻密な
合金層が形成され、ピンホールがなく、しかも密着性が
向上して剥離のおそれがないコーティング被膜の金属部
材が得られるという効果がある。As explained above, this invention involves coating a metal member with an alloy element on a rough surface formed by blasting to form a plating layer, and then irradiating the plating layer with a laser beam to melt the plating layer. As a result, the surface of the plating layer also becomes uneven and rough, increasing the absorption rate of the laser beam, and the surface portion of the plating layer and the metal member are melted and integrated into a dense alloy layer while keeping the dilution rate of the plating layer components low. is formed, there are no pinholes, and there is an effect that a metal member with a coating film that has improved adhesion and is free from peeling is obtained.
第１図（ａ）、 （ｂ）、 （ｃ）はこの発明の一
実施例で金属部材にメッキ層が形成される工程をそれぞ
れ示す説明図、第２図はこの発明の一実施例でメッキ層
及び金属部材の溶融処理工程を示す説明図である。
図において、（１）は金属部材、（２）はメッキ層、（
３）はレーザビーム、（５）は合金層である。FIGS. 1(a), (b), and (c) are explanatory diagrams showing the steps of forming a plating layer on a metal member in an embodiment of the present invention, and FIG. FIG. 3 is an explanatory diagram showing a melting process of layers and metal members. In the figure, (1) is a metal member, (2) is a plating layer, (
3) is a laser beam, and (5) is an alloy layer.
Claims (1)
かる後に金属部材の表面に合金元素をメッキしてメッキ
層を形成し、その後メッキ層にレーザビームを照射して
メッキ層を合金層に溶融処理するようにしたことを特徴
とする金属部材のコーティング方法。The surface of the metal member is formed into a rough surface by blasting, and then the surface of the metal member is plated with an alloying element to form a plating layer, and then the plating layer is irradiated with a laser beam to melt the plating layer into an alloy layer. 1. A method of coating a metal member, characterized in that the coating method comprises:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61241261A JPS6397382A (en) | 1986-10-13 | 1986-10-13 | Coating method for metal member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61241261A JPS6397382A (en) | 1986-10-13 | 1986-10-13 | Coating method for metal member |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6397382A true JPS6397382A (en) | 1988-04-28 |
Family
ID=17071616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61241261A Pending JPS6397382A (en) | 1986-10-13 | 1986-10-13 | Coating method for metal member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6397382A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0364494A (en) * | 1989-07-31 | 1991-03-19 | Yazaki Corp | Treatment of gold plating film |
| US5023407A (en) * | 1988-08-30 | 1991-06-11 | Hitachi, Ltd. | Printed circuit board with a uniform conductive layer formed by equalization of metals therein |
| JPH04365894A (en) * | 1991-06-12 | 1992-12-17 | Shimizu:Kk | Heat treatment of plated film |
| US5499668A (en) * | 1993-11-02 | 1996-03-19 | Hitachi, Ltd. | Process for making electronic device |
| US5940728A (en) * | 1995-05-19 | 1999-08-17 | Hitachi, Ltd. | Process for manufacturing electronic circuits |
| US6227436B1 (en) | 1990-02-19 | 2001-05-08 | Hitachi, Ltd. | Method of fabricating an electronic circuit device and apparatus for performing the method |
| US6471115B1 (en) | 1990-02-19 | 2002-10-29 | Hitachi, Ltd. | Process for manufacturing electronic circuit devices |
| JP2009208106A (en) * | 2008-03-03 | 2009-09-17 | Furukawa Electric Co Ltd:The | Plated square wire material for connector |
-
1986
- 1986-10-13 JP JP61241261A patent/JPS6397382A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5023407A (en) * | 1988-08-30 | 1991-06-11 | Hitachi, Ltd. | Printed circuit board with a uniform conductive layer formed by equalization of metals therein |
| JPH0364494A (en) * | 1989-07-31 | 1991-03-19 | Yazaki Corp | Treatment of gold plating film |
| US6227436B1 (en) | 1990-02-19 | 2001-05-08 | Hitachi, Ltd. | Method of fabricating an electronic circuit device and apparatus for performing the method |
| US6471115B1 (en) | 1990-02-19 | 2002-10-29 | Hitachi, Ltd. | Process for manufacturing electronic circuit devices |
| JPH04365894A (en) * | 1991-06-12 | 1992-12-17 | Shimizu:Kk | Heat treatment of plated film |
| US5499668A (en) * | 1993-11-02 | 1996-03-19 | Hitachi, Ltd. | Process for making electronic device |
| US5940728A (en) * | 1995-05-19 | 1999-08-17 | Hitachi, Ltd. | Process for manufacturing electronic circuits |
| US6133135A (en) * | 1995-05-19 | 2000-10-17 | Hitachi, Ltd. | Process for manufacturing electronic circuits |
| US6161748A (en) * | 1995-05-19 | 2000-12-19 | Hitachi, Ltd. | Process for manufacturing electronic circuits |
| US6269998B1 (en) | 1995-05-19 | 2001-08-07 | Hitachi, Ltd. | Process for manufacturing electronic circuits |
| US6410881B2 (en) | 1995-05-19 | 2002-06-25 | Hitachi, Ltd. | Process for manufacturing electronic circuits |
| JP2009208106A (en) * | 2008-03-03 | 2009-09-17 | Furukawa Electric Co Ltd:The | Plated square wire material for connector |
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