JPS6393651U - - Google Patents
Info
- Publication number
- JPS6393651U JPS6393651U JP1986187563U JP18756386U JPS6393651U JP S6393651 U JPS6393651 U JP S6393651U JP 1986187563 U JP1986187563 U JP 1986187563U JP 18756386 U JP18756386 U JP 18756386U JP S6393651 U JPS6393651 U JP S6393651U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- insulating film
- bonded
- electronic component
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986187563U JPS6393651U (US06724976-20040420-M00002.png) | 1986-12-04 | 1986-12-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986187563U JPS6393651U (US06724976-20040420-M00002.png) | 1986-12-04 | 1986-12-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6393651U true JPS6393651U (US06724976-20040420-M00002.png) | 1988-06-17 |
Family
ID=31138140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986187563U Pending JPS6393651U (US06724976-20040420-M00002.png) | 1986-12-04 | 1986-12-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6393651U (US06724976-20040420-M00002.png) |
-
1986
- 1986-12-04 JP JP1986187563U patent/JPS6393651U/ja active Pending
