JPS639153U - - Google Patents

Info

Publication number

JPS639153U

JPS639153U JP10351386U JP10351386U JPS639153U JP S639153 U JPS639153 U JP S639153U JP 10351386 U JP10351386 U JP 10351386U JP 10351386 U JP10351386 U JP 10351386U JP S639153 U JPS639153 U JP S639153U

Authority

JP

Japan

Prior art keywords

integrated circuit

hybrid integrated

circuit board

mounting

lead terminal

Prior art date

1986-07-04

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 238000005452 bending Methods 0.000 claims 1
• 239000013013 elastic material Substances 0.000 claims 1
• 239000011248 coating agent Substances 0.000 description 1
• 238000000576 coating method Methods 0.000 description 1
• 238000010586 diagram Methods 0.000 description 1
• 230000037431 insertion Effects 0.000 description 1
• 238000003780 insertion Methods 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1

Cited By (1)