JPS6388837A - Method and apparatus for transferring chip of semiconductor device - Google Patents

Method and apparatus for transferring chip of semiconductor device

Info

Publication number
JPS6388837A
JPS6388837A JP61234912A JP23491286A JPS6388837A JP S6388837 A JPS6388837 A JP S6388837A JP 61234912 A JP61234912 A JP 61234912A JP 23491286 A JP23491286 A JP 23491286A JP S6388837 A JPS6388837 A JP S6388837A
Authority
JP
Japan
Prior art keywords
chips
collet
pan plate
pipy
sucked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61234912A
Other languages
Japanese (ja)
Inventor
Noritatsu Iwasaki
Kazuhiko Ugi
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP61234912A priority Critical patent/JPS6388837A/en
Publication of JPS6388837A publication Critical patent/JPS6388837A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To move chips without being completely in contact with the surfaces of the chips by thrusting up the chips aligned on a sheet or in a perforated tray by a pipy collet, scooping up the thrusted up chips by an upper pan plate at the nose of an arm and shifting the arm.
CONSTITUTION: An upper pan plate 3 is leg-opened and made to stand by to chips 2 aligned in a tray 1, and the chips 2 are pushed up into the upper pan plate 3 while being sucked by a vacuum by a pipy collet 4. The upper pan plate 3 is closed, and the collet 4 is lowered by breaking a vacuum. A pipy collet 32 at the center of a pre-alignment stage 31 is elevated, the chips 2 on the upper pan plate 3 are further thrusted up while being sucked by the vacuum, and the legs of the upper pan plate 3 are opened. The collet 32 is brought down, and the chips are shifted onto the pre-alignment stage 31, and aligned while being sucked by the collet 32. The chips can be without damaging the surfaces and edges of the chips and without attaching no dust and fouling on the surfaces.
COPYRIGHT: (C)1988,JPO&Japio
JP61234912A 1986-10-01 1986-10-01 Method and apparatus for transferring chip of semiconductor device Pending JPS6388837A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61234912A JPS6388837A (en) 1986-10-01 1986-10-01 Method and apparatus for transferring chip of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61234912A JPS6388837A (en) 1986-10-01 1986-10-01 Method and apparatus for transferring chip of semiconductor device

Publications (1)

Publication Number Publication Date
JPS6388837A true JPS6388837A (en) 1988-04-19

Family

ID=16978232

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61234912A Pending JPS6388837A (en) 1986-10-01 1986-10-01 Method and apparatus for transferring chip of semiconductor device

Country Status (1)

Country Link
JP (1) JPS6388837A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02246241A (en) * 1989-03-20 1990-10-02 Fujitsu Ltd Manufacture of semiconductor device
JPH1114957A (en) * 1997-06-23 1999-01-22 Micronics Japan Co Ltd Inspection device for liquid crystal panel
JP2012041056A (en) * 2010-08-17 2012-03-01 Disco Corp Storage tray and method of handling package substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02246241A (en) * 1989-03-20 1990-10-02 Fujitsu Ltd Manufacture of semiconductor device
JPH1114957A (en) * 1997-06-23 1999-01-22 Micronics Japan Co Ltd Inspection device for liquid crystal panel
JP2012041056A (en) * 2010-08-17 2012-03-01 Disco Corp Storage tray and method of handling package substrate

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