JPS6381817A - Projection exposure method - Google Patents

Projection exposure method

Info

Publication number
JPS6381817A
JPS6381817A JP61226848A JP22684886A JPS6381817A JP S6381817 A JPS6381817 A JP S6381817A JP 61226848 A JP61226848 A JP 61226848A JP 22684886 A JP22684886 A JP 22684886A JP S6381817 A JPS6381817 A JP S6381817A
Authority
JP
Japan
Prior art keywords
substrate
mask
alignment marks
optical system
marks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61226848A
Other languages
Japanese (ja)
Other versions
JPH0740542B2 (en
Inventor
Kazutoshi Ota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP61226848A priority Critical patent/JPH0740542B2/en
Publication of JPS6381817A publication Critical patent/JPS6381817A/en
Publication of JPH0740542B2 publication Critical patent/JPH0740542B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography

Abstract

PURPOSE: To indicate clear alignment marks subject to less aberration on a substrate to be exposed by a method wherein the second alignment marks on a reference mask and the first alignment marks on a master mask are formed on the same surface by the first optical system to be further transferred by the second optical system.
CONSTITUTION: A master mask 101 is composed of a mask pattern 2 scatter- arranged with the first alignment marks 3 while a reference mask 107 previously formed of the second alignment marks 6 only with arrangement pitch equivalent to that of the first alignment marks 3. Next, the reference mask 107 is arranged on the conjugate point of master mask 101 in the first optical system 135 and then a substrate 115 to be exposed is further arranged on the conjugate point of reference mask 107 in the second optical system 136. Then the marks 3 and 6 are simultaneously projected on the substrate 115 to be exposed. After developing the substrate 115, any relative positional slip ▵d between the marks 6 and 3 transferred to the substrate 115 is measured so that the position of mask pattern 2 transferred to the substrate 115 may be detected.
COPYRIGHT: (C)1988,JPO&Japio
JP61226848A 1986-09-25 1986-09-25 Projection exposure method Expired - Lifetime JPH0740542B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61226848A JPH0740542B2 (en) 1986-09-25 1986-09-25 Projection exposure method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61226848A JPH0740542B2 (en) 1986-09-25 1986-09-25 Projection exposure method

Publications (2)

Publication Number Publication Date
JPS6381817A true JPS6381817A (en) 1988-04-12
JPH0740542B2 JPH0740542B2 (en) 1995-05-01

Family

ID=16851510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61226848A Expired - Lifetime JPH0740542B2 (en) 1986-09-25 1986-09-25 Projection exposure method

Country Status (1)

Country Link
JP (1) JPH0740542B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004006849A (en) * 2000-07-24 2004-01-08 Matsushita Electric Ind Co Ltd Manufacturing method of semiconductor device, liquid crystal display, electroluminescent indicating device and semiconductor thin film
WO2012160928A1 (en) * 2011-05-23 2012-11-29 株式会社ブイ・テクノロジー Alignment device for exposure apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004006849A (en) * 2000-07-24 2004-01-08 Matsushita Electric Ind Co Ltd Manufacturing method of semiconductor device, liquid crystal display, electroluminescent indicating device and semiconductor thin film
WO2012160928A1 (en) * 2011-05-23 2012-11-29 株式会社ブイ・テクノロジー Alignment device for exposure apparatus
JP2012242746A (en) * 2011-05-23 2012-12-10 V Technology Co Ltd Alignment device for exposure apparatus

Also Published As

Publication number Publication date
JPH0740542B2 (en) 1995-05-01

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