JPS6380072U - - Google Patents

Info

Publication number

JPS6380072U

JPS6380072U JP17363286U JP17363286U JPS6380072U JP S6380072 U JPS6380072 U JP S6380072U JP 17363286 U JP17363286 U JP 17363286U JP 17363286 U JP17363286 U JP 17363286U JP S6380072 U JPS6380072 U JP S6380072U

Authority

JP

Japan

Prior art keywords

recess

circuit element

main body

central portion

circumferential surface

Prior art date

1986-11-12

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000853 adhesive Substances 0.000 claims description 2
• 230000001070 adhesive effect Effects 0.000 claims description 2
• 229920001187 thermosetting polymer Polymers 0.000 claims 1
• 238000010586 diagram Methods 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1