JPS6371551U - - Google Patents

Info

Publication number

JPS6371551U

JPS6371551U JP16607386U JP16607386U JPS6371551U JP S6371551 U JPS6371551 U JP S6371551U JP 16607386 U JP16607386 U JP 16607386U JP 16607386 U JP16607386 U JP 16607386U JP S6371551 U JPS6371551 U JP S6371551U

Authority

JP

Japan

Prior art keywords

mold

semiconductor element

plastic package

flat plastic

lead frame

Prior art date

1986-10-29

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000011347 resin Substances 0.000 claims description 5
• 229920005989 resin Polymers 0.000 claims description 5
• 239000004065 semiconductor Substances 0.000 claims description 4
• BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
• 229910052709 silver Inorganic materials 0.000 description 2
• 239000004332 silver Substances 0.000 description 2
• 238000005452 bending Methods 0.000 description 1
• 238000007747 plating Methods 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1

Cited By (1)