JPS6370175U - - Google Patents

Info

Publication number

JPS6370175U

JPS6370175U JP16307886U JP16307886U JPS6370175U JP S6370175 U JPS6370175 U JP S6370175U JP 16307886 U JP16307886 U JP 16307886U JP 16307886 U JP16307886 U JP 16307886U JP S6370175 U JPS6370175 U JP S6370175U

Authority

JP

Japan

Prior art keywords

bare wire

land

wiring board

component mounting

terminal

Prior art date

1986-10-24

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 230000037431 insertion Effects 0.000 claims description 2
• 238000003780 insertion Methods 0.000 claims description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
• 239000011889 copper foil Substances 0.000 claims 1
• 238000005476 soldering Methods 0.000 claims 1