JPS6365224U - - Google Patents
Info
- Publication number
- JPS6365224U JPS6365224U JP15995786U JP15995786U JPS6365224U JP S6365224 U JPS6365224 U JP S6365224U JP 15995786 U JP15995786 U JP 15995786U JP 15995786 U JP15995786 U JP 15995786U JP S6365224 U JPS6365224 U JP S6365224U
- Authority
- JP
- Japan
- Prior art keywords
- collet
- holder
- electromagnet
- slide portion
- mounter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000696 magnetic material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15995786U JPS6365224U (US06633600-20031014-M00021.png) | 1986-10-17 | 1986-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15995786U JPS6365224U (US06633600-20031014-M00021.png) | 1986-10-17 | 1986-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6365224U true JPS6365224U (US06633600-20031014-M00021.png) | 1988-04-30 |
Family
ID=31084874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15995786U Pending JPS6365224U (US06633600-20031014-M00021.png) | 1986-10-17 | 1986-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6365224U (US06633600-20031014-M00021.png) |
-
1986
- 1986-10-17 JP JP15995786U patent/JPS6365224U/ja active Pending
