JPS6364920B2 - - Google Patents

Info

Publication number
JPS6364920B2
JPS6364920B2 JP57196245A JP19624582A JPS6364920B2 JP S6364920 B2 JPS6364920 B2 JP S6364920B2 JP 57196245 A JP57196245 A JP 57196245A JP 19624582 A JP19624582 A JP 19624582A JP S6364920 B2 JPS6364920 B2 JP S6364920B2
Authority
JP
Japan
Prior art keywords
paste
conductive paste
insulating paste
photocurable
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57196245A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5986292A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19624582A priority Critical patent/JPS5986292A/ja
Publication of JPS5986292A publication Critical patent/JPS5986292A/ja
Publication of JPS6364920B2 publication Critical patent/JPS6364920B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP19624582A 1982-11-09 1982-11-09 セラミツク多層配線基板の製造方法 Granted JPS5986292A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19624582A JPS5986292A (ja) 1982-11-09 1982-11-09 セラミツク多層配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19624582A JPS5986292A (ja) 1982-11-09 1982-11-09 セラミツク多層配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPS5986292A JPS5986292A (ja) 1984-05-18
JPS6364920B2 true JPS6364920B2 (enrdf_load_stackoverflow) 1988-12-14

Family

ID=16354598

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19624582A Granted JPS5986292A (ja) 1982-11-09 1982-11-09 セラミツク多層配線基板の製造方法

Country Status (1)

Country Link
JP (1) JPS5986292A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS611237A (ja) * 1984-06-13 1986-01-07 Canon Electronics Inc シ−トコイルの製造方法
JP2800446B2 (ja) * 1991-03-12 1998-09-21 日本電気株式会社 セラミックグリーンシート上での微細配線パターンの形成方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5785293A (en) * 1980-11-17 1982-05-27 Nippon Electric Co Method of producing hihg density multilayer circuit board
JPS57196244A (en) * 1981-05-28 1982-12-02 Ricoh Co Ltd Electrophotographic receptor

Also Published As

Publication number Publication date
JPS5986292A (ja) 1984-05-18

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