JPS6364916B2 - - Google Patents

Info

Publication number
JPS6364916B2
JPS6364916B2 JP1775182A JP1775182A JPS6364916B2 JP S6364916 B2 JPS6364916 B2 JP S6364916B2 JP 1775182 A JP1775182 A JP 1775182A JP 1775182 A JP1775182 A JP 1775182A JP S6364916 B2 JPS6364916 B2 JP S6364916B2
Authority
JP
Japan
Prior art keywords
lead
bonding
group
leads
tape carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1775182A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58134454A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1775182A priority Critical patent/JPS58134454A/ja
Publication of JPS58134454A publication Critical patent/JPS58134454A/ja
Publication of JPS6364916B2 publication Critical patent/JPS6364916B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP1775182A 1982-02-05 1982-02-05 リ−ドボンデイング構造 Granted JPS58134454A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1775182A JPS58134454A (ja) 1982-02-05 1982-02-05 リ−ドボンデイング構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1775182A JPS58134454A (ja) 1982-02-05 1982-02-05 リ−ドボンデイング構造

Publications (2)

Publication Number Publication Date
JPS58134454A JPS58134454A (ja) 1983-08-10
JPS6364916B2 true JPS6364916B2 (enrdf_load_stackoverflow) 1988-12-14

Family

ID=11952437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1775182A Granted JPS58134454A (ja) 1982-02-05 1982-02-05 リ−ドボンデイング構造

Country Status (1)

Country Link
JP (1) JPS58134454A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0770560B2 (ja) * 1985-03-15 1995-07-31 松下電器産業株式会社 デイスプレイパネルの実装体
JPH0773154B2 (ja) * 1986-04-10 1995-08-02 松下電器産業株式会社 リ−ド接続方法
JPH0719943B2 (ja) * 1986-07-04 1995-03-06 日本電気株式会社 電子部品の実装構造
JPH03119786A (ja) * 1989-09-30 1991-05-22 Toshiba Corp 半導体装置
FR2749974B1 (fr) * 1996-06-13 1998-08-14 Bull Sa Procede de montage d'un circuit integre sur un support et support en resultant

Also Published As

Publication number Publication date
JPS58134454A (ja) 1983-08-10

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