JPS6364075U - - Google Patents
Info
- Publication number
- JPS6364075U JPS6364075U JP1986157986U JP15798686U JPS6364075U JP S6364075 U JPS6364075 U JP S6364075U JP 1986157986 U JP1986157986 U JP 1986157986U JP 15798686 U JP15798686 U JP 15798686U JP S6364075 U JPS6364075 U JP S6364075U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- copper foil
- adhesive layer
- flexible board
- protective layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
- 239000011241 protective layer Substances 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000013039 cover film Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Combinations Of Printed Boards (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986157986U JPS6364075U (US08063081-20111122-C00044.png) | 1986-10-15 | 1986-10-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986157986U JPS6364075U (US08063081-20111122-C00044.png) | 1986-10-15 | 1986-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6364075U true JPS6364075U (US08063081-20111122-C00044.png) | 1988-04-27 |
Family
ID=31081048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986157986U Pending JPS6364075U (US08063081-20111122-C00044.png) | 1986-10-15 | 1986-10-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6364075U (US08063081-20111122-C00044.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005322878A (ja) * | 2004-04-09 | 2005-11-17 | Dainippon Printing Co Ltd | 印刷配線基板の組付パネル、印刷配線基板の実装用単位シート、リジッド−フレキシブル基板及びこれらの製造方法 |
-
1986
- 1986-10-15 JP JP1986157986U patent/JPS6364075U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005322878A (ja) * | 2004-04-09 | 2005-11-17 | Dainippon Printing Co Ltd | 印刷配線基板の組付パネル、印刷配線基板の実装用単位シート、リジッド−フレキシブル基板及びこれらの製造方法 |
