JPS6364038U - - Google Patents
Info
- Publication number
- JPS6364038U JPS6364038U JP15691986U JP15691986U JPS6364038U JP S6364038 U JPS6364038 U JP S6364038U JP 15691986 U JP15691986 U JP 15691986U JP 15691986 U JP15691986 U JP 15691986U JP S6364038 U JPS6364038 U JP S6364038U
- Authority
- JP
- Japan
- Prior art keywords
- support block
- semiconductor wafer
- target portion
- suction
- suction target
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 description 4
- 238000001505 atmospheric-pressure chemical vapour deposition Methods 0.000 description 1
Description
第１図乃至第３図はこの考案に係る半導体ウエ
ーハのローダ・アンローダ装置を連続式常圧ＣＶ
Ｄ装置に於ける半導体ウエーハの供給及び取出し
に適用した実施例を示す図面で、第１図は要部平
面図、第２図及び第３図は第１図のＡ―Ａ線及び
Ｂ―Ｂ線に於ける断面図である。第４図及び第５
図は連続式常圧ＣＶＤ装置を示す図面で、第４図
は全体概略図、第５図はトレーの拡大斜視図であ
る。第６図及び第７図は上記ＣＶＤ装置に於ける
半導体ウエハの供給及び取出しに従来使用されて
いた真空吸着ペン及びベルヌーイチヤツクを示す
断面図である。
１１……半導体ウエーハ、１２，１２……支受
ブロツク、１３……吸着ヘツド、１７……トレー
、１８，１８……凹部。
Figures 1 to 3 show a semiconductor wafer loader/unloader device according to this invention in a continuous normal pressure CV type.
Drawings showing an embodiment applied to the supply and take-out of semiconductor wafers in equipment D; FIG. 1 is a plan view of the main part, and FIGS. 2 and 3 are lines AA and B-B in FIG. 1. FIG. Figures 4 and 5
The figures show a continuous atmospheric pressure CVD apparatus, with FIG. 4 being an overall schematic view and FIG. 5 being an enlarged perspective view of a tray. 6 and 7 are cross-sectional views showing a vacuum suction pen and a Bernoulli chuck conventionally used for supplying and unloading semiconductor wafers in the CVD apparatus. DESCRIPTION OF SYMBOLS 11... Semiconductor wafer, 12, 12... Supporting block, 13... Suction head, 17... Tray, 18, 18... Recessed portion.
Claims (1)
位置に被吸着部を突出形成した支受ブロツクと、
該支受ブロツクの被吸着部を吸着して上記支受ブ
ロツクを所定位置に移動させる吸着ヘツドとを具
備したことを特徴とする半導体ウエーハのローダ
・アンローダ装置。 a support block in which a suction target portion is formed protrudingly at an arbitrary position of a placing portion on which a semiconductor wafer is placed and supported;
A semiconductor wafer loader/unloader apparatus comprising a suction head for suctioning a suction target portion of the support block and moving the support block to a predetermined position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15691986U JPS6364038U (en) | 1986-10-13 | 1986-10-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15691986U JPS6364038U (en) | 1986-10-13 | 1986-10-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6364038U true JPS6364038U (en) | 1988-04-27 |
Family
ID=31078988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15691986U Pending JPS6364038U (en) | 1986-10-13 | 1986-10-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6364038U (en) |
-
1986
- 1986-10-13 JP JP15691986U patent/JPS6364038U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6364038U (en) | ||
| JPS6252929U (en) | ||
| JPS6237932U (en) | ||
| JPS63202933A (en) | Sticker for adhesive sheet | |
| JPS63177035U (en) | ||
| JP2565673Y2 (en) | Wafer holding device | |
| JPH0128681Y2 (en) | ||
| JPH01100435U (en) | ||
| JPS6377344U (en) | ||
| JPS63153529U (en) | ||
| JPS6283949A (en) | Wafer conveyer | |
| JPH0423870Y2 (en) | ||
| JP2529796Y2 (en) | Suction pad | |
| JPH0341470Y2 (en) | ||
| JPS63159835U (en) | ||
| JPH0430741U (en) | ||
| JPH0279036U (en) | ||
| JPH01121932U (en) | ||
| JPS6433743U (en) | ||
| JPH08203982A (en) | Conveying jig of wafer | |
| JPS6346846U (en) | ||
| JPS6430842U (en) | ||
| JPH0275724U (en) | ||
| JPH10107050A (en) | Die bonding device | |
| JPS63170464U (en) |