JPS636145B2 - - Google Patents

Info

Publication number
JPS636145B2
JPS636145B2 JP57110103A JP11010382A JPS636145B2 JP S636145 B2 JPS636145 B2 JP S636145B2 JP 57110103 A JP57110103 A JP 57110103A JP 11010382 A JP11010382 A JP 11010382A JP S636145 B2 JPS636145 B2 JP S636145B2
Authority
JP
Japan
Prior art keywords
semiconductor
capacitor
sealed container
case
bushing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57110103A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59945A (ja
Inventor
Haruo Tetsuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP57110103A priority Critical patent/JPS59945A/ja
Publication of JPS59945A publication Critical patent/JPS59945A/ja
Publication of JPS636145B2 publication Critical patent/JPS636145B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP57110103A 1982-06-25 1982-06-25 半導体沸騰冷却装置 Granted JPS59945A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57110103A JPS59945A (ja) 1982-06-25 1982-06-25 半導体沸騰冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57110103A JPS59945A (ja) 1982-06-25 1982-06-25 半導体沸騰冷却装置

Publications (2)

Publication Number Publication Date
JPS59945A JPS59945A (ja) 1984-01-06
JPS636145B2 true JPS636145B2 (cs) 1988-02-08

Family

ID=14527108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57110103A Granted JPS59945A (ja) 1982-06-25 1982-06-25 半導体沸騰冷却装置

Country Status (1)

Country Link
JP (1) JPS59945A (cs)

Also Published As

Publication number Publication date
JPS59945A (ja) 1984-01-06

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