JPS6359517A - Manufacture of printed-wiring board - Google Patents
Manufacture of printed-wiring boardInfo
- Publication number
- JPS6359517A JPS6359517A JP20305486A JP20305486A JPS6359517A JP S6359517 A JPS6359517 A JP S6359517A JP 20305486 A JP20305486 A JP 20305486A JP 20305486 A JP20305486 A JP 20305486A JP S6359517 A JPS6359517 A JP S6359517A
- Authority
- JP
- Japan
- Prior art keywords
- photosensitive resin
- wiring board
- printed
- board
- under
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000011347 resin Substances 0.000 claims abstract description 31
- 229920005989 resin Polymers 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract description 19
- 238000003825 pressing Methods 0.000 claims description 3
- 230000004580 weight loss Effects 0.000 abstract description 4
- 230000002542 deteriorative effect Effects 0.000 abstract description 3
- 238000010030 laminating Methods 0.000 abstract description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000002788 crimping Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000008094 contradictory effect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- 238000009835 boiling Methods 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/60—In a particular environment
- B32B2309/68—Vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は印刷配線板の製造方法に関し、特に感光性樹脂
を用いる印刷配線板の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a printed wiring board, and particularly to a method for manufacturing a printed wiring board using a photosensitive resin.
従来、製造工程中の印刷配線基板上に感光性樹脂を被着
する方法としては、第２図に示すように印刷配線基板１
の上下に感光性樹脂フィルム２を重ね合せて、これらを
ヒートロール３を用いて加熱・熱圧着させる方法が一般
的である。ところが。Conventionally, as a method for depositing a photosensitive resin on a printed wiring board during the manufacturing process, as shown in FIG.
A common method is to superimpose photosensitive resin films 2 on top and bottom of the photosensitive resin film 2, and heat and thermocompress them using a heat roll 3. However.
印刷配線基板１の表面に深いキズのある場合や、ソルダ
ーレジスト用感光性樹脂フィルムを被着する場合にはキ
ズや導体回路パターンの段差を完全に埋められないため
、ヒートロール３を真空チャンバー中におき、真空中で
加熱・熱圧着を行う方法が提案されている。When there are deep scratches on the surface of the printed wiring board 1 or when applying a photosensitive resin film for solder resist, it is not possible to completely fill in the scratches and steps in the conductor circuit pattern, so the heat roll 3 is placed in a vacuum chamber. A method of heating and thermocompression bonding in a vacuum has been proposed.
この場合、真空中で加熱を行うため、特に感光性樹脂フ
ィルムに含まれる低沸点成分がガス化しやすくなって、
感光性樹脂フィルムの特性を損いやすいという欠点があ
った。In this case, since heating is performed in a vacuum, low-boiling components contained in the photosensitive resin film in particular are easily gasified.
This method has the drawback of easily damaging the properties of the photosensitive resin film.
例えば、感光性樹脂フィルムとしてデュポン社製リスト
ン−１２２０（商品名）を用い、１ｍＨＨに減圧した真
空チャンバー中で、温度１２０℃のヒートロールにより
圧力１．５ｋｇ／ｄをかけて移動速度１．２Ｍ／分でラ
ミネートした場合、約５％の重量減少を示した。これを
回避する方法としては、ヒートロール温度を低下させる
ことが考えられるが、この場合、感光性樹脂フィルムの
フローも低下し、密着性も劣化してしまうという相反す
る問題をかかえていた。For example, using Riston-1220 (trade name) manufactured by DuPont as a photosensitive resin film, in a vacuum chamber with a reduced pressure of 1 mHH, a pressure of 1.5 kg/d is applied with a heat roll at a temperature of 120°C, and a moving speed of 1.2 M is applied. When laminated at 1/min, the weight loss was approximately 5%. One possible way to avoid this is to lower the heat roll temperature, but this has the contradictory problems of lowering the flow of the photosensitive resin film and deteriorating its adhesion.
本発明の目的は感光性樹脂フィルムの特性を損わずにこ
れを印刷配線板に密着させる印刷配線板の製造方法を提
供することにある。An object of the present invention is to provide a method for manufacturing a printed wiring board in which a photosensitive resin film is closely adhered to the printed wiring board without impairing the properties of the photosensitive resin film.
上述した従来の感光性樹脂フィルムの被着方法に対し、
本発明は感光性樹脂フィルムの成分減少に着目し、真空
中における成分のガス化を防ぐと同時に高い密着性を得
るという相反する問題を容易に解決できるという独創的
内容を有する。In contrast to the conventional photosensitive resin film deposition method described above,
The present invention focuses on the reduction of components in a photosensitive resin film, and has an original content in that it can easily solve the contradictory problems of preventing gasification of components in a vacuum and at the same time obtaining high adhesion.
本発明の印刷配線板の製造方法は真空中において印刷配
線基板上に感光性樹脂フィルムを熱圧着させる工程と、
前記工程で熱圧着された印刷配線基板と感光性樹脂フィ
ルムとを、常圧中において前記熱圧着時の熱圧着温度よ
り高い温度で再圧着させる工程とを含むことを特徴とす
るものである。The method for manufacturing a printed wiring board of the present invention includes a step of thermocompression bonding a photosensitive resin film onto a printed wiring board in a vacuum, and a step of bonding the printed wiring board and photosensitive resin film thermocompression bonded in the above step under normal pressure. The present invention is characterized in that it includes a step of re-compression bonding at a temperature higher than the thermocompression bonding temperature during the thermocompression bonding.
次に本発明の実施例について図面を参照して説明する。 Next, embodiments of the present invention will be described with reference to the drawings.
（実施例１） 第１図は本発明の実施例を示す工程概要図である。(Example 1) FIG. 1 is a process outline diagram showing an embodiment of the present invention.
銅張積層板に公知の方法により穴あけ、めっきを施した
のち、所定の前処理を完了した印刷配線基板１に感光性
樹脂フィルム（例えばデュポン社製リストン−１２２０
（商品名））２を１ｍ１ｇに減圧した真空チャンバー４
中において、９０℃に加熱したヒートロール３ａを用い
圧力１．５ｋｇ／ａＪ、移動速度１゜２Ｍ／分でラミネ
ートした１次に常圧中において、１２０℃に加熱したヒ
ートロール３ｂを用い、圧力１．５ｋｇ／ｃｄ、移動速
度１．２１１１／分で再圧着させた。この工程処理後の
印刷配線基板を露光、現像してレジストパターンを得る
。第１表に示すように従来例（１）のｌｍＨｇ減圧下、
１２０℃、 １．５ｋｇ／ｃｄの圧力、１．２Ｍ／分の
移動速度でヒートロールすると約５％が重量減少するの
に対し、実施例１によるものは約１％どまりであった。After drilling and plating a copper-clad laminate using a known method, a photosensitive resin film (for example, DuPont Riston-1220
(Product name)) Vacuum chamber 4 with reduced pressure of 2 to 1ml1g
Inside, the first layer was laminated using a heat roll 3a heated to 90°C at a pressure of 1.5 kg/aJ and a moving speed of 1°2M/min. Re-crimping was carried out at 1.5 kg/cd and a moving speed of 1.2111/min. After this process, the printed wiring board is exposed and developed to obtain a resist pattern. As shown in Table 1, under lmHg reduced pressure in conventional example (1),
Heat rolling at 120° C., a pressure of 1.5 kg/cd, and a moving speed of 1.2 M/min resulted in a weight loss of about 5%, while that of Example 1 was only about 1%.
第１表
（実施例２）
次に、ソルダーレジスト用感光性樹脂フィルムについて
の実施例を示す。Table 1 (Example 2) Next, examples of photosensitive resin films for solder resists are shown.
積層板上に公知の方法により、導体回路パターンを形成
した印刷配線基板１に日立化成製フォテック−１０００
Ｇドライフィルム２を１ｍａ）Ｉｇに減圧した真空チャ
ンバー４中において９０℃に加熱したヒートロール３ａ
を用いて、圧力２．５ｋｇ／ａｄ、移動速度０．８Ｍ／
分でラミネートしたのち、常圧中において１３０℃に加
熱したヒートロール３ｂを用いて、圧力２．５ｋｇ／ｌ
ｎ、移動速度０．８Ｍ／分で再圧着させた。実施例２に
よる重量減少は第１表に示すように約５％であったが、
これに対し常圧中の再圧着を行わない従来方法の場合、
１ａａＨｇに減圧した真空チャンバー中で１３０℃に加
熱したヒートロールを用いて、同圧力、同一速度でラミ
ネートした場合約２０％の重量減少を示した。A printed wiring board 1 with a conductor circuit pattern formed on the laminate by a known method was coated with Fotec-1000 manufactured by Hitachi Chemical.
G Dry film 2 is heated to 90°C in a vacuum chamber 4 with a reduced pressure of 1 ma) Ig on a heat roll 3a.
using a pressure of 2.5 kg/ad and a moving speed of 0.8 M/
After laminating for several minutes, using a heat roll 3b heated to 130°C under normal pressure, the pressure was 2.5 kg/l.
n, re-crimping was performed at a moving speed of 0.8 M/min. The weight reduction in Example 2 was about 5% as shown in Table 1, but
On the other hand, in the case of the conventional method that does not involve re-crimping under normal pressure,
When laminated at the same pressure and speed using a heat roll heated to 130° C. in a vacuum chamber with a reduced pressure of 1 aaHg, a weight reduction of about 20% was observed.
さらに、所定の条件で処理した後の２６０℃１０秒のは
んだ付けを反復した場合のレジストはがれの発生は、従
来方法によるものが３回目ではがれを生じたのに対し、
本発明方法によるものでは５回目まではがれを生じなか
った。Furthermore, resist peeling occurs when soldering is repeated at 260°C for 10 seconds after processing under predetermined conditions, whereas resist peeling occurred on the third soldering using the conventional method.
With the method of the present invention, no peeling occurred until the fifth time.
以上説明したように本発明は減圧下の感光性樹脂フィル
ムのラミネートを低温で行って重量減少を防止するとと
もに、常圧下で高温の感光性樹脂フィルムのフローの良
い状態で再圧着することによって十分な密着性を得るこ
とができ、又、感光性樹脂フィルムの特性を劣化させる
ことなしに感光性樹脂フィルムの被着ができる効果があ
る。As explained above, the present invention is achieved by laminating photosensitive resin films under reduced pressure at a low temperature to prevent weight loss, and by re-pressing the high temperature photosensitive resin films under normal pressure in a state with good flow. This has the effect that a photosensitive resin film can be attached without deteriorating the properties of the photosensitive resin film.
第１図は本発明による感光性樹脂フィルムの被着方法を
示す工程概要図、第２図は従来例による感光性樹脂フィ
ルムの被着方法を示す工程概要図である。
１・・・印刷配線基板、２・・・感光性樹脂フィルム、
３ａ。FIG. 1 is a process outline diagram showing a method of applying a photosensitive resin film according to the present invention, and FIG. 2 is a process outline diagram showing a conventional method of applying a photosensitive resin film. 1... Printed wiring board, 2... Photosensitive resin film,
3a.
Claims (1)
ルムを熱圧着させる工程と、 前記工程で熱圧着された印刷配線基板と感光性樹脂フィ
ルムとを、常圧中において前記熱圧着時の熱圧着温度よ
り高い温度で再圧着させる工程とを含むことを特徴とす
る印刷配線板の製造方法。(1) A step of thermocompression bonding a photosensitive resin film onto a printed wiring board in a vacuum; and a step of bonding a photosensitive resin film to a printed wiring board by thermocompression in a vacuum; A method for manufacturing a printed wiring board, comprising the step of re-pressing at a temperature higher than the pressing temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20305486A JPS6359517A (en) | 1986-08-29 | 1986-08-29 | Manufacture of printed-wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20305486A JPS6359517A (en) | 1986-08-29 | 1986-08-29 | Manufacture of printed-wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6359517A true JPS6359517A (en) | 1988-03-15 |
Family
ID=16467577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20305486A Pending JPS6359517A (en) | 1986-08-29 | 1986-08-29 | Manufacture of printed-wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6359517A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0460621A1 (en) * | 1990-06-04 | 1991-12-11 | Hakuto Co., Ltd. | Vacuum laminator |
| JPH08130357A (en) * | 1994-10-31 | 1996-05-21 | Matsushita Electric Ind Co Ltd | Circuit board manufacturing method and device |
| EP1176577A1 (en) * | 2000-07-27 | 2002-01-30 | Minnesota Mining And Manufacturing Company | Graphic application system and methods |
| US6474389B1 (en) | 1999-01-25 | 2002-11-05 | 3M Innovative Properties Company | Vacuum-assisted laminator and methods of using the same |
| US6706131B2 (en) | 2000-05-23 | 2004-03-16 | 3M Innovative Properties Company | Film lamination and removal system and methods of use |
| US6872268B2 (en) | 2002-06-11 | 2005-03-29 | 3M Innovative Properties Company | Method of conforming an adherent film to a substrate by application of vacuum |
| US7141133B2 (en) | 2002-01-08 | 2006-11-28 | 3M Innovative Properties Company | Method of conforming a film to a surface |
| US7413626B2 (en) | 2001-01-12 | 2008-08-19 | 3M Innovative Properties Company | Adhesive film removal method and apparatus |
| CN111669903A (en) * | 2020-06-19 | 2020-09-15 | 奥士康精密电路（惠州）有限公司 | Production method of PCB (printed circuit board) ultra-thick dielectric layer |
-
1986
- 1986-08-29 JP JP20305486A patent/JPS6359517A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0460621A1 (en) * | 1990-06-04 | 1991-12-11 | Hakuto Co., Ltd. | Vacuum laminator |
| JPH08130357A (en) * | 1994-10-31 | 1996-05-21 | Matsushita Electric Ind Co Ltd | Circuit board manufacturing method and device |
| US6474389B1 (en) | 1999-01-25 | 2002-11-05 | 3M Innovative Properties Company | Vacuum-assisted laminator and methods of using the same |
| US6613181B2 (en) | 1999-01-25 | 2003-09-02 | 3M Innovative Properties Company | Vacuum-assisted laminator and methods of using the same |
| US6706131B2 (en) | 2000-05-23 | 2004-03-16 | 3M Innovative Properties Company | Film lamination and removal system and methods of use |
| EP1176577A1 (en) * | 2000-07-27 | 2002-01-30 | Minnesota Mining And Manufacturing Company | Graphic application system and methods |
| US7413626B2 (en) | 2001-01-12 | 2008-08-19 | 3M Innovative Properties Company | Adhesive film removal method and apparatus |
| US7141133B2 (en) | 2002-01-08 | 2006-11-28 | 3M Innovative Properties Company | Method of conforming a film to a surface |
| US6872268B2 (en) | 2002-06-11 | 2005-03-29 | 3M Innovative Properties Company | Method of conforming an adherent film to a substrate by application of vacuum |
| CN111669903A (en) * | 2020-06-19 | 2020-09-15 | 奥士康精密电路（惠州）有限公司 | Production method of PCB (printed circuit board) ultra-thick dielectric layer |
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