JPS6351437U - - Google Patents

Info

Publication number
JPS6351437U
JPS6351437U JP14451986U JP14451986U JPS6351437U JP S6351437 U JPS6351437 U JP S6351437U JP 14451986 U JP14451986 U JP 14451986U JP 14451986 U JP14451986 U JP 14451986U JP S6351437 U JPS6351437 U JP S6351437U
Authority
JP
Japan
Prior art keywords
bonding device
semiconductor chip
frame
wire bonding
die bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14451986U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14451986U priority Critical patent/JPS6351437U/ja
Publication of JPS6351437U publication Critical patent/JPS6351437U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP14451986U 1986-09-20 1986-09-20 Pending JPS6351437U (US20100223739A1-20100909-C00005.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14451986U JPS6351437U (US20100223739A1-20100909-C00005.png) 1986-09-20 1986-09-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14451986U JPS6351437U (US20100223739A1-20100909-C00005.png) 1986-09-20 1986-09-20

Publications (1)

Publication Number Publication Date
JPS6351437U true JPS6351437U (US20100223739A1-20100909-C00005.png) 1988-04-07

Family

ID=31055194

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14451986U Pending JPS6351437U (US20100223739A1-20100909-C00005.png) 1986-09-20 1986-09-20

Country Status (1)

Country Link
JP (1) JPS6351437U (US20100223739A1-20100909-C00005.png)

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