JPS6349251U - - Google Patents
Info
- Publication number
- JPS6349251U JPS6349251U JP14296086U JP14296086U JPS6349251U JP S6349251 U JPS6349251 U JP S6349251U JP 14296086 U JP14296086 U JP 14296086U JP 14296086 U JP14296086 U JP 14296086U JP S6349251 U JPS6349251 U JP S6349251U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- pellet
- solder
- semiconductor device
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14296086U JPS6349251U (US20080293856A1-20081127-C00150.png) | 1986-09-18 | 1986-09-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14296086U JPS6349251U (US20080293856A1-20081127-C00150.png) | 1986-09-18 | 1986-09-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6349251U true JPS6349251U (US20080293856A1-20081127-C00150.png) | 1988-04-04 |
Family
ID=31052193
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14296086U Pending JPS6349251U (US20080293856A1-20081127-C00150.png) | 1986-09-18 | 1986-09-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6349251U (US20080293856A1-20081127-C00150.png) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5827934B2 (ja) * | 1980-09-25 | 1983-06-13 | テルモ株式会社 | 減圧採血管保持具 |
JPS5961055A (ja) * | 1982-09-29 | 1984-04-07 | Toshiba Corp | 半導体装置 |
-
1986
- 1986-09-18 JP JP14296086U patent/JPS6349251U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5827934B2 (ja) * | 1980-09-25 | 1983-06-13 | テルモ株式会社 | 減圧採血管保持具 |
JPS5961055A (ja) * | 1982-09-29 | 1984-04-07 | Toshiba Corp | 半導体装置 |