JPS6349239U - - Google Patents
Info
- Publication number
- JPS6349239U JPS6349239U JP1986142959U JP14295986U JPS6349239U JP S6349239 U JPS6349239 U JP S6349239U JP 1986142959 U JP1986142959 U JP 1986142959U JP 14295986 U JP14295986 U JP 14295986U JP S6349239 U JPS6349239 U JP S6349239U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- metal foil
- holes
- foil leads
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000011888 foil Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000008188 pellet Substances 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986142959U JPH0249713Y2 (US20100223739A1-20100909-C00025.png) | 1986-09-18 | 1986-09-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986142959U JPH0249713Y2 (US20100223739A1-20100909-C00025.png) | 1986-09-18 | 1986-09-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6349239U true JPS6349239U (US20100223739A1-20100909-C00025.png) | 1988-04-04 |
JPH0249713Y2 JPH0249713Y2 (US20100223739A1-20100909-C00025.png) | 1990-12-27 |
Family
ID=31052191
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986142959U Expired JPH0249713Y2 (US20100223739A1-20100909-C00025.png) | 1986-09-18 | 1986-09-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0249713Y2 (US20100223739A1-20100909-C00025.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0380554A (ja) * | 1989-08-23 | 1991-04-05 | Toshiba Corp | 半導体装置及びその製造方法 |
-
1986
- 1986-09-18 JP JP1986142959U patent/JPH0249713Y2/ja not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0380554A (ja) * | 1989-08-23 | 1991-04-05 | Toshiba Corp | 半導体装置及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0249713Y2 (US20100223739A1-20100909-C00025.png) | 1990-12-27 |