JPS6348640B2 - - Google Patents

Info

Publication number
JPS6348640B2
JPS6348640B2 JP13673381A JP13673381A JPS6348640B2 JP S6348640 B2 JPS6348640 B2 JP S6348640B2 JP 13673381 A JP13673381 A JP 13673381A JP 13673381 A JP13673381 A JP 13673381A JP S6348640 B2 JPS6348640 B2 JP S6348640B2
Authority
JP
Japan
Prior art keywords
seat plate
fins
thickness
fin
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP13673381A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5838658A (ja
Inventor
Masabumi Kaneko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MA Aluminum Corp
Original Assignee
Mitsubishi Aluminum Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Aluminum Co Ltd filed Critical Mitsubishi Aluminum Co Ltd
Priority to JP13673381A priority Critical patent/JPS5838658A/ja
Publication of JPS5838658A publication Critical patent/JPS5838658A/ja
Publication of JPS6348640B2 publication Critical patent/JPS6348640B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP13673381A 1981-08-31 1981-08-31 放熱フインの接合方法 Granted JPS5838658A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13673381A JPS5838658A (ja) 1981-08-31 1981-08-31 放熱フインの接合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13673381A JPS5838658A (ja) 1981-08-31 1981-08-31 放熱フインの接合方法

Publications (2)

Publication Number Publication Date
JPS5838658A JPS5838658A (ja) 1983-03-07
JPS6348640B2 true JPS6348640B2 (forum.php) 1988-09-29

Family

ID=15182229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13673381A Granted JPS5838658A (ja) 1981-08-31 1981-08-31 放熱フインの接合方法

Country Status (1)

Country Link
JP (1) JPS5838658A (forum.php)

Also Published As

Publication number Publication date
JPS5838658A (ja) 1983-03-07

Similar Documents

Publication Publication Date Title
US2389175A (en) Method of making heat exchange apparatus
JPS61187351A (ja) ヒートパイプを統合した電力用半導体モジユール
US4072262A (en) Method of fabricating a solar heating unit
WO2008037134A1 (en) A heat pipe radiator and manufacturing method thereof
US4709849A (en) Solder preform and methods employing the same
JPS6348640B2 (forum.php)
JPH02268966A (ja) 熱交換器の製造方法
JPH0451034Y2 (forum.php)
JP2619744B2 (ja) ヒートパイプ式冷却器
CN110900050A (zh) 一种热应力自适应补偿的刚性结构件焊接用工装
JP7394243B1 (ja) 加熱装置及びはんだ接合済対象物の製造方法
JPH02251366A (ja) 拘束治具を用いた製造方法
CN222767588U (zh) 功率器件模块端子焊接工装
JPH0225270Y2 (forum.php)
RU2118585C1 (ru) Способ монтажа деталей полупроводникового прибора к основанию и полупроводниковый прибор, полученный этим способом
CN114812240A (zh) 均温板及其制造工艺和电子产品
JP2659272B2 (ja) セラミックヒータのリード端子接続構造
JPS601837A (ja) 半導体装置
JPS594228B2 (ja) ラジエ−タコアブレ−ジングジグ
JP2503774B2 (ja) 半導体装置用基板
JPS58168299A (ja) アルミニウム製ヒ−トシンクの製造法
JPH0790301B2 (ja) ハニカム構造体の圧締装置
JP2514419B2 (ja) 熱交換器の炉中ろう付け用ハンガ
JPS54115071A (en) Semiconductor element
JPS5844317B2 (ja) 熱交換器の製造方法