JPS6347212B2 - - Google Patents
Info
- Publication number
- JPS6347212B2 JPS6347212B2 JP56167686A JP16768681A JPS6347212B2 JP S6347212 B2 JPS6347212 B2 JP S6347212B2 JP 56167686 A JP56167686 A JP 56167686A JP 16768681 A JP16768681 A JP 16768681A JP S6347212 B2 JPS6347212 B2 JP S6347212B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating
- spacer
- insulating sheet
- wire
- keyboard switch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 125000006850 spacer group Chemical group 0.000 claims description 18
- 238000009413 insulation Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000012790 adhesive layer Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/702—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/702—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
- H01H13/703—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches characterised by spacers between contact carrying layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2211/00—Spacers
- H01H2211/006—Individual areas
- H01H2211/016—Wires
Landscapes
- Push-Button Switches (AREA)
Description
【発明の詳細な説明】
本発明はキーボードスイツチに関し、特に薄型
のキーボードスイツチにおいて、上部及び下部電
極間に介在するスペーサーに絶縁性を有する線材
を用いることにより、高密度のキーボードスイツ
チを提供することにある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a keyboard switch, and in particular to a thin keyboard switch, providing a high-density keyboard switch by using an insulating wire for the spacer interposed between the upper and lower electrodes. It is in.
従来の薄型のキーボードスイツチは、上部電極
を形成した可撓性絶縁シートと下部電極を形成し
た絶縁シートを対向させ、その間に両電極が通常
接触しないように絶縁スペーサーを介在させ、し
かも、絶縁スペーサーとしての絶縁フイルムを上
部電極と下部電極のスイツチパターンに合わせ打
抜いていた。 A conventional thin keyboard switch has a flexible insulating sheet with an upper electrode formed thereon and an insulating sheet with a lower electrode formed thereon facing each other, with an insulating spacer interposed between them to prevent the two electrodes from normally touching each other. An insulating film was punched out to match the switch pattern of the upper and lower electrodes.
しかしながらキー密度を高くしようとした場
合、フイルムの加工仕上の問題でスペーサー幅の
細いものが困難であり、キーとキー間のピツチが
大きく、キーボードスイツチ全面に対し、入力で
きない領域(以下不感帯という)が大きく高密度
なキー配置ができないという欠点があつた。 However, when trying to increase the key density, it is difficult to use thin spacers due to film processing and finishing problems, and the pitch between keys is large, resulting in an area (hereinafter referred to as a dead zone) where input cannot be made on the entire surface of the keyboard switch. The disadvantage was that the keys were large and a high-density key arrangement was not possible.
そこで本発明では、前記の欠点を除去するため
に、絶縁性を有する線材をスペーサーに用い、不
感帯を減少したものである。 Therefore, in the present invention, in order to eliminate the above-mentioned drawbacks, an insulating wire is used as a spacer to reduce the dead zone.
以下添付の図面を参照して本発明を説明する。
第1図は上部電極に接する絶縁シートの平面図、
第2図は下部電極に接する絶縁シートの平面図で
ある。 The present invention will be described below with reference to the accompanying drawings.
Figure 1 is a plan view of the insulating sheet in contact with the upper electrode;
FIG. 2 is a plan view of the insulating sheet in contact with the lower electrode.
第1図、第2図において、1,2は合成樹脂な
どからなる可撓性を有する絶縁シート、1a,2
aは複数の上部電極3及び下部電極4を各々形成
したダイアフラム、1b,2bは端子接続部3
b,4bを導出するための張出部、3a,4aは
前記電極3,4と端子接続部3b,4bとを結ぶ
リード部である。なお、前記電極3,4、リード
部3a,4a、端子接続部3b,4bなどは銅張
りプラスチツク基板のエツチングや銀ペースト、
比抵抗の小さなカーボンペーストを印刷ないしは
焼成して形成するか、又は比抵抗の小さい酸化銀
や酸化インジウムなどの透明導電薄膜を蒸着又は
スパツタリングにより形成される。端子接続部3
b,4bの配列はダイアフラム1b,2bを後述
するように重畳状に重ね合わせた場合、相互に短
絡などの電気的障害のないように所定の空隙を設
けて、絶縁シート1,2の各々の張出部1b,2
b上に並設されている。 In FIGS. 1 and 2, 1 and 2 are flexible insulating sheets made of synthetic resin, etc.; 1a and 2;
1b and 2b are terminal connecting parts 3;
The projecting portions 3a and 4a are lead portions for connecting the electrodes 3 and 4 to the terminal connecting portions 3b and 4b. The electrodes 3, 4, lead parts 3a, 4a, terminal connection parts 3b, 4b, etc. are formed by etching a copper-clad plastic substrate, silver paste,
It is formed by printing or baking a carbon paste with a low resistivity, or by vapor deposition or sputtering of a transparent conductive thin film of silver oxide, indium oxide, or the like having a low resistivity. Terminal connection part 3
When the diaphragms 1b and 2b are stacked one on top of the other as described later, a predetermined gap is provided between each of the insulating sheets 1 and 2 to prevent electrical problems such as short circuits. Projecting parts 1b, 2
are arranged in parallel on b.
なお、本発明ではダイアフラム1a,2aは
別々の1対の絶縁シート1,2に設けてあるが、
1枚の連続した絶縁シートに折線を設け、この折
線の対向側にそれぞれの対応電極3,4、リード
部3a,4a、及び端子接続部3b,4bを形成
し、あとで絶縁シートを上記折線より電極3,4
がそれぞれ対応するようにして1組のダイアフラ
ム1a,2aを形成しても良い。 Note that in the present invention, the diaphragms 1a and 2a are provided on a separate pair of insulating sheets 1 and 2, but
A fold line is provided on one continuous insulating sheet, and corresponding electrodes 3, 4, lead parts 3a, 4a, and terminal connecting parts 3b, 4b are formed on the opposite side of the fold line, and later the insulating sheet is attached to the above fold line. More electrodes 3, 4
A pair of diaphragms 1a and 2a may be formed such that the diaphragms 1a and 2a correspond to each other.
第3図は絶縁シート2上にスペーサー5を取付
けた場合の平面図である。スペーサー5は後述す
る方法により形成したものであるが、スペーサー
5上には前記上部電極に接する絶縁シート1を重
畳状に重ね、その場合上部及び下部電極3,4
は、スペーサー5によつて、通常状態では接触す
ることはない。 FIG. 3 is a plan view of the spacer 5 mounted on the insulating sheet 2. FIG. The spacer 5 is formed by a method described later. On the spacer 5, the insulating sheets 1 in contact with the upper electrode are superimposed, and in this case, the upper and lower electrodes 3 and 4 are stacked on the spacer 5.
do not come into contact with each other due to the spacer 5 under normal conditions.
第4―a図、第4―b図はスペーサーの構造を
示しており、スペーサーの素材としてはマグネツ
トワイヤ等の絶縁コートされた金属線、融着性マ
グネツトワイヤ等の接着層付きの絶縁コートされ
た金属線、熱可塑性プラスチツク線、接着層付プ
ラスチツク線、絶縁繊維線等を用いることができ
る。 Figures 4-a and 4-b show the structure of the spacer, and the spacer materials include metal wire coated with insulation such as magnet wire, and insulation with an adhesive layer such as fusible magnet wire. A coated metal wire, a thermoplastic plastic wire, a plastic wire with an adhesive layer, an insulated fiber wire, etc. can be used.
ここで特に第4―a図は絶縁コートされた金属
線の断側面図であり、一般的には金属線6に油性
エナメル、ポリウレタン、ポリエステル、ポリイ
ミド樹脂などの絶縁層7をコーテイングしたもの
であり、金属線通電による自己発熱、超音波接
合、高周波接合、ヒートシール、インパルスシー
ル等により、絶縁シート片面、又は絶縁シート
1,2間にスペーサー5を挾んで熱圧着する。 Particularly, Fig. 4-a is a cross-sectional side view of an insulating coated metal wire, and generally the metal wire 6 is coated with an insulating layer 7 of oil-based enamel, polyurethane, polyester, polyimide resin, etc. The spacer 5 is placed between one side of the insulating sheet or between the insulating sheets 1 and 2 and thermocompression bonded by self-heating by energizing metal wires, ultrasonic bonding, high frequency bonding, heat sealing, impulse sealing, etc.
第4―b図は接着層付きの絶縁コートされた金
属線の断側面図であり、第4―a図の絶縁コート
された金属線にナイロン、エポキシ、ポリビニル
ブチラール、ポリビニールエーテル、天然ゴム等
の感熱接着性又は感圧接着性を有する接着層8を
コーテイングしたものであり、金属線通電による
自己発熱、ヒートシール、インパルスシール等に
より絶縁シート片面又は絶縁シート1,2間にス
ペーサーを挾んで熱圧着する。また感圧接着剤に
より圧着だけの工程でもよい。さらには、ポリエ
チレン軟質塩化ビニルポリプロピレン等の熱接着
性を有する熱可塑性プラスチツク線を上述の熱接
着法で絶縁シート片面又は絶縁シート1,2間に
スペーサー5を挾んで接着しても良い。 Figure 4-b is a cross-sectional side view of an insulating coated metal wire with an adhesive layer, and nylon, epoxy, polyvinyl butyral, polyvinyl ether, natural rubber, etc. It is coated with an adhesive layer 8 having heat-sensitive adhesive properties or pressure-sensitive adhesive properties, and a spacer is sandwiched between one side of the insulating sheet or between the insulating sheets 1 and 2 by self-heating by energizing a metal wire, heat sealing, impulse sealing, etc. Heat and press. Alternatively, a process of only crimping using a pressure-sensitive adhesive may be used. Furthermore, a thermoplastic wire having heat adhesive properties such as polyethylene soft vinyl chloride polypropylene may be bonded to one side of the insulating sheet or by sandwiching the spacer 5 between the insulating sheets 1 and 2 by the above-described thermal bonding method.
第5図は絶縁基板上に本発明によるキーボード
スイツチを取付け、指で上部シートを押し、上下
部電極3,4を接触させ、スイツチをオンにした
状態を示している。 FIG. 5 shows a state in which the keyboard switch according to the present invention is mounted on an insulating substrate, the upper sheet is pressed with a finger, the upper and lower electrodes 3 and 4 are brought into contact, and the switch is turned on.
以上詳述したように、本発明のキーボードスイ
ツチは電極を形成した絶縁シート間にスペーサー
として絶縁性を有する線材を使用したものであ
り、キーボードスイツチのキーとキーとの間のピ
ツチが大きくならず、キーボードスイツチ全面に
不感帯の生ずる部分が少なくなり、高密度なキー
配置が可能になるという顕著な効果が生ずる。 As detailed above, the keyboard switch of the present invention uses an insulating wire as a spacer between the insulating sheets on which electrodes are formed, so that the pitch between the keys of the keyboard switch does not become large. This has the remarkable effect that the dead zone on the entire surface of the keyboard switch is reduced, making it possible to arrange keys with high density.
第1図は上部電極に接する絶縁シートの平面
図、第2図は下部電極に接する絶縁シートの平面
図、第3図は本発明を実施したものであり、絶縁
シート上にスペーサーを取付けた場合の平面図、
第4―a図、第4―b図は絶縁コートされた金属
線の断側面図、第5図は絶縁基板上に本発明によ
るキーボードスイツチを取付けたものを動作させ
たものの断面図である。
1,2…絶縁シート、3…上部電極、4…下部
電極、5…スペーサー。
Fig. 1 is a plan view of the insulating sheet in contact with the upper electrode, Fig. 2 is a plan view of the insulating sheet in contact with the lower electrode, and Fig. 3 is an implementation of the present invention, in which a spacer is attached to the insulating sheet. Plan of
4-a and 4-b are cross-sectional side views of an insulating coated metal wire, and FIG. 5 is a cross-sectional view of a keyboard switch according to the present invention mounted on an insulating substrate in operation. 1, 2... Insulating sheet, 3... Upper electrode, 4... Lower electrode, 5... Spacer.
Claims (1)
形成した絶縁シートとを上部電極と下部電極とが
対向するように配置し、両絶縁シート間に絶縁性
を有する線材から成るスペーサーを複数本介在さ
せ、両絶縁シートを重ね合せたことを特徴とする
キーボードスイツチ。1. An insulating sheet on which an upper electrode is formed and an insulating sheet on which a lower electrode is formed are arranged so that the upper electrode and the lower electrode face each other, and a plurality of spacers made of wire material having insulating properties are interposed between the two insulating sheets. , a keyboard switch characterized by overlapping both insulation sheets.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56167686A JPS5868147A (en) | 1981-10-20 | 1981-10-20 | Keyboard switch |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56167686A JPS5868147A (en) | 1981-10-20 | 1981-10-20 | Keyboard switch |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5868147A JPS5868147A (en) | 1983-04-22 |
JPS6347212B2 true JPS6347212B2 (en) | 1988-09-21 |
Family
ID=15854341
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56167686A Granted JPS5868147A (en) | 1981-10-20 | 1981-10-20 | Keyboard switch |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5868147A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002112856A (en) * | 2000-10-06 | 2002-04-16 | Bridgestone Corp | Seat pressure decreasing cushion pad and seat pressure decreasing seat |
-
1981
- 1981-10-20 JP JP56167686A patent/JPS5868147A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5868147A (en) | 1983-04-22 |
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