JPS6343431U - - Google Patents

Info

Publication number
JPS6343431U
JPS6343431U JP13525486U JP13525486U JPS6343431U JP S6343431 U JPS6343431 U JP S6343431U JP 13525486 U JP13525486 U JP 13525486U JP 13525486 U JP13525486 U JP 13525486U JP S6343431 U JPS6343431 U JP S6343431U
Authority
JP
Japan
Prior art keywords
die
collet
bonding
contact
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13525486U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13525486U priority Critical patent/JPS6343431U/ja
Publication of JPS6343431U publication Critical patent/JPS6343431U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75Apparatus for connecting with bump connectors or layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525Means for applying energy, e.g. heating means
    • H01L2224/753Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301Bonding head
    • H01L2224/75302Shape
    • H01L2224/75303Shape of the pressing surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP13525486U 1986-09-02 1986-09-02 Pending JPS6343431U (US20030157376A1-20030821-M00001.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13525486U JPS6343431U (US20030157376A1-20030821-M00001.png) 1986-09-02 1986-09-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13525486U JPS6343431U (US20030157376A1-20030821-M00001.png) 1986-09-02 1986-09-02

Publications (1)

Publication Number Publication Date
JPS6343431U true JPS6343431U (US20030157376A1-20030821-M00001.png) 1988-03-23

Family

ID=31037264

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13525486U Pending JPS6343431U (US20030157376A1-20030821-M00001.png) 1986-09-02 1986-09-02

Country Status (1)

Country Link
JP (1) JPS6343431U (US20030157376A1-20030821-M00001.png)

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