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Priority to JP19049681UpriorityCriticalpatent/JPS5893896U/ja
Publication of JPS5893896UpublicationCriticalpatent/JPS5893896U/ja
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Publication of JPS6336304Y2publicationCriticalpatent/JPS6336304Y2/ja
Procede d'assemblage de pieces d'un boitier metallique en materiau a teneur en cuivre, notamment pour l'encapsulation de circuits hybrides en boitier metallique.