JPS6333916U - - Google Patents

Info

Publication number
JPS6333916U
JPS6333916U JP12648186U JP12648186U JPS6333916U JP S6333916 U JPS6333916 U JP S6333916U JP 12648186 U JP12648186 U JP 12648186U JP 12648186 U JP12648186 U JP 12648186U JP S6333916 U JPS6333916 U JP S6333916U
Authority
JP
Japan
Prior art keywords
mold
die extension
cantilever
supported
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12648186U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12648186U priority Critical patent/JPS6333916U/ja
Publication of JPS6333916U publication Critical patent/JPS6333916U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP12648186U 1986-08-21 1986-08-21 Pending JPS6333916U (US07922777-20110412-C00004.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12648186U JPS6333916U (US07922777-20110412-C00004.png) 1986-08-21 1986-08-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12648186U JPS6333916U (US07922777-20110412-C00004.png) 1986-08-21 1986-08-21

Publications (1)

Publication Number Publication Date
JPS6333916U true JPS6333916U (US07922777-20110412-C00004.png) 1988-03-04

Family

ID=31020320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12648186U Pending JPS6333916U (US07922777-20110412-C00004.png) 1986-08-21 1986-08-21

Country Status (1)

Country Link
JP (1) JPS6333916U (US07922777-20110412-C00004.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010092853A1 (ja) * 2009-02-10 2010-08-19 三洋電機株式会社 フレームパッケージの製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5519848A (en) * 1978-07-31 1980-02-12 Toshiba Corp Semiconductor element molding die

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5519848A (en) * 1978-07-31 1980-02-12 Toshiba Corp Semiconductor element molding die

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010092853A1 (ja) * 2009-02-10 2010-08-19 三洋電機株式会社 フレームパッケージの製造方法

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