JPS6333639U - - Google Patents
Info
- Publication number
- JPS6333639U JPS6333639U JP1986126435U JP12643586U JPS6333639U JP S6333639 U JPS6333639 U JP S6333639U JP 1986126435 U JP1986126435 U JP 1986126435U JP 12643586 U JP12643586 U JP 12643586U JP S6333639 U JPS6333639 U JP S6333639U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- cap
- semiconductor element
- package body
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986126435U JPS6333639U (US20030199744A1-20031023-C00003.png) | 1986-08-19 | 1986-08-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986126435U JPS6333639U (US20030199744A1-20031023-C00003.png) | 1986-08-19 | 1986-08-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6333639U true JPS6333639U (US20030199744A1-20031023-C00003.png) | 1988-03-04 |
Family
ID=31020238
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986126435U Pending JPS6333639U (US20030199744A1-20031023-C00003.png) | 1986-08-19 | 1986-08-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6333639U (US20030199744A1-20031023-C00003.png) |
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1986
- 1986-08-19 JP JP1986126435U patent/JPS6333639U/ja active Pending