JPS633146U - - Google Patents

Info

Publication number
JPS633146U
JPS633146U JP9618586U JP9618586U JPS633146U JP S633146 U JPS633146 U JP S633146U JP 9618586 U JP9618586 U JP 9618586U JP 9618586 U JP9618586 U JP 9618586U JP S633146 U JPS633146 U JP S633146U
Authority
JP
Japan
Prior art keywords
bonding
cylindrical
spool
spool body
slipping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9618586U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9618586U priority Critical patent/JPS633146U/ja
Publication of JPS633146U publication Critical patent/JPS633146U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Storage Of Web-Like Or Filamentary Materials (AREA)
  • Wire Bonding (AREA)
JP9618586U 1986-06-23 1986-06-23 Pending JPS633146U (US20090163788A1-20090625-C00002.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9618586U JPS633146U (US20090163788A1-20090625-C00002.png) 1986-06-23 1986-06-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9618586U JPS633146U (US20090163788A1-20090625-C00002.png) 1986-06-23 1986-06-23

Publications (1)

Publication Number Publication Date
JPS633146U true JPS633146U (US20090163788A1-20090625-C00002.png) 1988-01-11

Family

ID=30961648

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9618586U Pending JPS633146U (US20090163788A1-20090625-C00002.png) 1986-06-23 1986-06-23

Country Status (1)

Country Link
JP (1) JPS633146U (US20090163788A1-20090625-C00002.png)

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