JPS6329937U - - Google Patents
Info
- Publication number
- JPS6329937U JPS6329937U JP12304186U JP12304186U JPS6329937U JP S6329937 U JPS6329937 U JP S6329937U JP 12304186 U JP12304186 U JP 12304186U JP 12304186 U JP12304186 U JP 12304186U JP S6329937 U JPS6329937 U JP S6329937U
- Authority
- JP
- Japan
- Prior art keywords
- disk
- die bonding
- rotatable
- adhesive
- adjusted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000002759 woven fabric Substances 0.000 claims 1
- 239000004744 fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12304186U JPS6329937U (US07714131-20100511-C00001.png) | 1986-08-11 | 1986-08-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12304186U JPS6329937U (US07714131-20100511-C00001.png) | 1986-08-11 | 1986-08-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6329937U true JPS6329937U (US07714131-20100511-C00001.png) | 1988-02-27 |
Family
ID=31013784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12304186U Pending JPS6329937U (US07714131-20100511-C00001.png) | 1986-08-11 | 1986-08-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6329937U (US07714131-20100511-C00001.png) |
-
1986
- 1986-08-11 JP JP12304186U patent/JPS6329937U/ja active Pending
