JPS63292100A - Ultrahigh vacuum apparatus - Google Patents
Ultrahigh vacuum apparatusInfo
- Publication number
- JPS63292100A JPS63292100A JP12689587A JP12689587A JPS63292100A JP S63292100 A JPS63292100 A JP S63292100A JP 12689587 A JP12689587 A JP 12689587A JP 12689587 A JP12689587 A JP 12689587A JP S63292100 A JPS63292100 A JP S63292100A
- Authority
- JP
- Japan
- Prior art keywords
- baking
- vacuum
- chamber
- synchrotron radiation
- vacuum chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005469 synchrotron radiation Effects 0.000 claims abstract description 19
- 238000010438 heat treatment Methods 0.000 abstract description 13
- 238000005516 engineering process Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 108010083687 Ion Pumps Proteins 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 102000006391 Ion Pumps Human genes 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 230000005674 electromagnetic induction Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 238000005211 surface analysis Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、超高真空装置に関し、特に、シンクロトロン
放射光源から放射される放射光を利用する分野における
超高真空装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an ultra-high vacuum apparatus, and particularly to an ultra-high vacuum apparatus in the field of utilizing synchrotron radiation light emitted from a synchrotron radiation light source.
[従来の技術]
近年、シンクロトロン放射光利用技術、MBE技術、表
面分析技術等の超高真空技術の産業面における応用が急
速に拡がってきている。超高真空技術は真空技術の延長
線上に乗った技術で必るが、真空排気を行うポンプ類お
よび到達圧力達成手段等において、通常の真空技術とは
技術的に大きく一線を画している。真空排気技術として
は、イオンポンプ、サブリメーションポンプ、ターボポ
ンプ等が使用されるが、通常の真空技術とは異って、一
段と高性能のものが使用され、例えばイオンポンプでは
希ガスに対しても更に排気性能の高いものが用いられる
。到達圧力達成手段として最も一般的なものは加熱ヒー
タによるベーキングでおる。[Background Art] In recent years, industrial applications of ultra-high vacuum technologies such as synchrotron radiation utilization technology, MBE technology, and surface analysis technology have been rapidly expanding. Although ultra-high vacuum technology is an extension of vacuum technology, it is technologically distinct from normal vacuum technology in terms of pumps for evacuation, means for achieving ultimate pressure, etc. Ion pumps, sublimation pumps, turbo pumps, etc. are used as vacuum evacuation technologies, but unlike normal vacuum technologies, higher performance ones are used.For example, ion pumps are used for rare gases. Also, those with even higher exhaust performance are used. The most common means of achieving the ultimate pressure is baking using a heater.
第2図はシンクロトロン放射光を利用する従来の超高真
空装置の一例を示す構成図である。第2図において、電
子蓄積リング2上の放射光源1からシンクロトロン放射
光3が放射される。シンクロトロン放射光3はビームラ
イン4を通して真空チャンバ5内に導入され、所望の反
応あるいは処理が行われる。電子蓄積リング2は通常t
o−11〜1O−10Torrの超高真空に排気されて
いる。この従来例ではビームライン4および真空チャン
バ5も超高真空に設定される。特に、真空チャンバ5は
試料の出し入れを行う事情もあって、その真空を超高真
空(tO−9Torrより良い真空)に保つために、ベ
ーキングヒータ6を用いた加熱手段が通常用いられてい
る。FIG. 2 is a block diagram showing an example of a conventional ultra-high vacuum apparatus that utilizes synchrotron radiation. In FIG. 2, synchrotron radiation 3 is emitted from a radiation source 1 on an electron storage ring 2. As shown in FIG. Synchrotron radiation 3 is introduced into a vacuum chamber 5 through a beam line 4, and a desired reaction or treatment is performed. The electron storage ring 2 is usually t
It is evacuated to an ultra-high vacuum of o-11 to 10-10 Torr. In this conventional example, the beam line 4 and vacuum chamber 5 are also set to ultra-high vacuum. In particular, since samples are taken in and taken out of the vacuum chamber 5, a heating means using a baking heater 6 is usually used to maintain the vacuum at an ultra-high vacuum (a vacuum better than tO-9 Torr).
[発明が解決しようとする問題点]
上記従来の超高真空装置の大きな問題点は、超高真空達
成手段としてベーキングヒータを用いる点である。超高
真空を達成するためにはイオンポンプ等の高能力真空排
気装置の使用はもちろんであるが、真空チVンバの内壁
面に付着したガスおよび水分等を除去することが最も重
要である。そのため、従来は真空チVンバの外側からベ
ーキング処理することにより真空チャンバ内壁面の付着
したガスおよび水分を放出することが行われてきた。と
ころがこのような従来のベーキング処理は、下記の如き
、大きな欠点を有している。すなわち第1にベーキング
処理に要する時間が非常に長く、通常数日間の昼夜間連
続ベーキングを要し、作業能率を著しく低下させる。第
2に、長時間の昼夜間連続ベーキングは安全管理上好ま
しくない。すなわちベーキング処理によって周囲に放熱
が起こるため安全管理体制が必要となる。第3に、超高
真空のチャンバを一度大気にさらすと、再度のベーキン
グ処理が必要となり、更に作業効率を低下させる。[Problems to be Solved by the Invention] A major problem with the conventional ultra-high vacuum apparatus described above is that a baking heater is used as a means for achieving ultra-high vacuum. In order to achieve an ultra-high vacuum, it is of course necessary to use a high-capacity evacuation device such as an ion pump, but it is most important to remove gas, moisture, etc. adhering to the inner wall surface of the vacuum chamber. Therefore, conventionally, the gas and moisture adhering to the inner wall surface of the vacuum chamber have been released by performing a baking process from the outside of the vacuum chamber. However, such conventional baking treatment has major drawbacks as described below. First, the baking process takes a very long time, usually requiring continuous baking day and night for several days, which significantly reduces work efficiency. Second, continuous baking day and night for long periods of time is unfavorable in terms of safety management. In other words, a safety management system is required because the baking process causes heat to be radiated to the surrounding area. Thirdly, once the ultra-high vacuum chamber is exposed to the atmosphere, another baking process is required, further reducing work efficiency.
本発明の目的は、このような問題点を除去し、超高真空
達成のための作業効率を大幅に向上した実用的な超高真
空装置を提供することにある。An object of the present invention is to provide a practical ultra-high vacuum apparatus that eliminates such problems and greatly improves the working efficiency for achieving ultra-high vacuum.
[問題点を、解決するための手段]
本発明は、シンクロトロン放射光源と、その放射光の通
路を形成するビームラインと、放射光を導入して利用す
る真空チャンバとで構成される超高真空装置において、
前記真空チャンバは、高周波電流を通すコイルで包囲さ
れてなることを特徴とする超高真空装置でおる。[Means for Solving the Problems] The present invention provides an ultra-high-temperature system consisting of a synchrotron radiation light source, a beam line that forms a path for the synchrotron radiation, and a vacuum chamber that introduces and utilizes the synchrotron radiation. In vacuum equipment,
The vacuum chamber is an ultra-high vacuum device characterized in that it is surrounded by a coil through which a high frequency current is passed.
[作用]
真空チャンバ全体を高周波加熱すると、通常のベーキン
グヒータによる場合と比べてベーキングの立上り時間が
早く、ベーキングの効率は一段と良くなる。また高周波
加熱の場合にはコイルの内側にあるもの全てが加熱され
る。すなわち、導体の場合は電磁誘導で生じる渦電流に
よって加熱され、誘電体も誘電損失によってゆるやかに
加熱される。従って真空チャンバを高周波加熱すること
により、真空チャンバ内の全てのものを効率よく加熱す
ることができる。[Function] When the entire vacuum chamber is heated with high frequency, the rise time of baking is faster than when using a normal baking heater, and the efficiency of baking is further improved. Furthermore, in the case of high frequency heating, everything inside the coil is heated. That is, conductors are heated by eddy currents generated by electromagnetic induction, and dielectrics are also heated slowly by dielectric loss. Therefore, by high-frequency heating the vacuum chamber, everything within the vacuum chamber can be efficiently heated.
[実施例]
以下本発明の実施例について、図面を参照しながら詳細
に説明する。第1図は、本発明の一実施例を示1模式図
である。シンクロトロン放射光源(図示せず)から放射
されたシンクロトロン放射光3は、ビームライン4を通
って真空ヂVンバ5内に導入される。真空チャンバ5の
側壁外周面には、ベーキング用のヒータ6が巻回されて
いる。[Examples] Examples of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a schematic diagram showing an embodiment of the present invention. Synchrotron radiation 3 emitted from a synchrotron radiation light source (not shown) is introduced into a vacuum chamber 5 through a beam line 4 . A baking heater 6 is wound around the outer peripheral surface of the side wall of the vacuum chamber 5 .
真空チャンバ5の外側に、真空チャンバを包囲するよう
にコイル7を配置し、該コイル7に高周波電流8を高周
波電流供給系9より供給する。以上のJ:うに配置する
ことにより、高周波加熱によって真空チャンバをベーキ
ングすることができる。A coil 7 is arranged outside the vacuum chamber 5 so as to surround the vacuum chamber, and a high frequency current 8 is supplied to the coil 7 from a high frequency current supply system 9. By arranging the vacuum chamber as shown in J: above, the vacuum chamber can be baked by high frequency heating.
ベーキングヒータによるベーキングのみでは極めて効率
は悪いが、高周波加熱を付加することによってベーキン
グの効率をはるかに上げることができる。高周波加熱の
場合は、通常のベーキングヒータに比べて、ベーキング
の立上り時間が早く、ベーキングの効率は一段と良い。Baking using a baking heater alone is extremely inefficient, but baking efficiency can be greatly increased by adding high-frequency heating. In the case of high-frequency heating, the rise time of baking is faster and the baking efficiency is much better than that of ordinary baking heaters.
また、従来のベーキングヒータのみによる加熱では真空
チャンバ内のもののベーキング効率は極めて悪かったが
、高周波加熱ではコイルの内側にあるもの全てが加熱さ
れる。導体の場合は電磁誘導で生じる渦電流によって加
熱され、誘電体も誘電損失によってゆるやかに加熱され
る。特に内部から発熱するので均一加熱が可能である。In addition, heating using only a conventional baking heater had extremely poor baking efficiency for things inside the vacuum chamber, but high-frequency heating heats everything inside the coil. Conductors are heated by eddy currents generated by electromagnetic induction, and dielectrics are also heated slowly by dielectric loss. In particular, since heat is generated from within, uniform heating is possible.
高周波加熱によってコイルの内側にある全てのものが加
熱されることは重要でおり、特に真空チャンバの中にミ
ラー等の光学系のものが含まれている場合のベーキング
に関して有効である。It is important that everything inside the coil is heated by high-frequency heating, and this is particularly effective for baking when optical systems such as mirrors are included in the vacuum chamber.
[発明の効果]
以上説明したとあり、本発明によればシンクロトロン放
射光を用い、超高真空達成の作業効率を高効率化した超
高真空装置を提供することができ、実用化に大きく寄与
できる。[Effects of the Invention] As explained above, according to the present invention, it is possible to provide an ultra-high vacuum device that uses synchrotron radiation light to improve the working efficiency of achieving an ultra-high vacuum, which greatly contributes to practical application. I can contribute.
第1図は本発明の一実施例の模式図、第2図は従来の超
高真空装置の模式図である。
1・・・放射光源 2・・・電子蓄積リング3
・・・シンクロトロン放射光FIG. 1 is a schematic diagram of an embodiment of the present invention, and FIG. 2 is a schematic diagram of a conventional ultra-high vacuum apparatus. 1... Synchrotron radiation source 2... Electron storage ring 3
... Synchrotron synchrotron radiation
Claims (1)
形成するビームラインと、放射光を導入して利用する真
空チャンバとで構成される超高真空装置において、前記
真空チャンバは、高周波電流を通すコイルで包囲されて
なることを特徴とする超高真空装置。(1) In an ultra-high vacuum apparatus consisting of a synchrotron radiation light source, a beam line that forms a path for the synchrotron radiation, and a vacuum chamber that introduces and utilizes the synchrotron radiation, the vacuum chamber has a high-frequency current. An ultra-high vacuum device characterized by being surrounded by a coil that passes through it.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12689587A JPS63292100A (en) | 1987-05-26 | 1987-05-26 | Ultrahigh vacuum apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12689587A JPS63292100A (en) | 1987-05-26 | 1987-05-26 | Ultrahigh vacuum apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63292100A true JPS63292100A (en) | 1988-11-29 |
Family
ID=14946530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12689587A Pending JPS63292100A (en) | 1987-05-26 | 1987-05-26 | Ultrahigh vacuum apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63292100A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0387843A (en) * | 1989-08-31 | 1991-04-12 | Canon Inc | Image forming device |
US6375743B2 (en) * | 1999-03-03 | 2002-04-23 | Applied Materials, Inc. | Method for improved chamber bake-out and cool-down |
-
1987
- 1987-05-26 JP JP12689587A patent/JPS63292100A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0387843A (en) * | 1989-08-31 | 1991-04-12 | Canon Inc | Image forming device |
US6375743B2 (en) * | 1999-03-03 | 2002-04-23 | Applied Materials, Inc. | Method for improved chamber bake-out and cool-down |
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