JPS63268745A - Production of prepreg for printed circuit board - Google Patents

Production of prepreg for printed circuit board

Info

Publication number
JPS63268745A
JPS63268745A JP10555087A JP10555087A JPS63268745A JP S63268745 A JPS63268745 A JP S63268745A JP 10555087 A JP10555087 A JP 10555087A JP 10555087 A JP10555087 A JP 10555087A JP S63268745 A JPS63268745 A JP S63268745A
Authority
JP
Japan
Prior art keywords
component
substrate
prepreg
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10555087A
Inventor
Tomio Fukuda
Ikuo Hoshi
Kazuhito Kobayashi
Katsuji Shibata
Masami Yusa
Original Assignee
Hitachi Chem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chem Co Ltd filed Critical Hitachi Chem Co Ltd
Priority to JP10555087A priority Critical patent/JPS63268745A/en
Publication of JPS63268745A publication Critical patent/JPS63268745A/en
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics

Abstract

PURPOSE:To produce prepreg for printed circuit board having improved drying workability, impregnating properties to substrate and excellent heat resistance, by impregnating a substrate with varnish blended with a solid epoxy resin as a resin component and drying. CONSTITUTION:(A) A solid epoxy resin (e.g. bisphenol A type) having preferably 500-2,000 average molecular weight is blended with (B) 0.01-1 equivalent based on 1 equivalent component A of tetrabromobisphenol A, (C) 0.5-1.5 equivalent based on the component A of a polyhydric phenol (e.g. bisphenol), (D) 0.01-5pts.wt. based on 100pts.wt. component A of curing promoter, preferably an imidazole compound containing an imino group masked with acrylonitrile, etc., and (E) a solvent (e.g. acetone) to give varnish, which is impregnated into a substrate such as glass cloth and dried in a drying furnace at 60-200 deg.C to produce prepreg.
JP10555087A 1987-04-28 1987-04-28 Production of prepreg for printed circuit board Granted JPS63268745A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10555087A JPS63268745A (en) 1987-04-28 1987-04-28 Production of prepreg for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10555087A JPS63268745A (en) 1987-04-28 1987-04-28 Production of prepreg for printed circuit board

Publications (1)

Publication Number Publication Date
JPS63268745A true JPS63268745A (en) 1988-11-07

Family

ID=14410678

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10555087A Granted JPS63268745A (en) 1987-04-28 1987-04-28 Production of prepreg for printed circuit board

Country Status (1)

Country Link
JP (1) JPS63268745A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011202140A (en) * 2009-10-14 2011-10-13 Sumitomo Bakelite Co Ltd Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011202140A (en) * 2009-10-14 2011-10-13 Sumitomo Bakelite Co Ltd Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor device
US8852734B2 (en) 2009-10-14 2014-10-07 Sumitomo Bakelite Company, Ltd. Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor device

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