JPS63251215A - ピンゲ−トを有する射出成形金型 - Google Patents

ピンゲ−トを有する射出成形金型

Info

Publication number
JPS63251215A
JPS63251215A JP8452787A JP8452787A JPS63251215A JP S63251215 A JPS63251215 A JP S63251215A JP 8452787 A JP8452787 A JP 8452787A JP 8452787 A JP8452787 A JP 8452787A JP S63251215 A JPS63251215 A JP S63251215A
Authority
JP
Japan
Prior art keywords
plate
cavity
runner
mold
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8452787A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0416054B2 (en:Method
Inventor
Hiroshi Kubota
寛 久保田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Precision Corp
Original Assignee
Nidec Copal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Copal Corp filed Critical Nidec Copal Corp
Priority to JP8452787A priority Critical patent/JPS63251215A/ja
Publication of JPS63251215A publication Critical patent/JPS63251215A/ja
Publication of JPH0416054B2 publication Critical patent/JPH0416054B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/38—Cutting-off equipment for sprues or ingates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/38—Cutting-off equipment for sprues or ingates
    • B29C2045/388—Locking pins for retaining the sprue
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2602—Mould construction elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2101/00—Use of unspecified macromolecular compounds as moulding material
    • B29K2101/12—Thermoplastic materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP8452787A 1987-04-08 1987-04-08 ピンゲ−トを有する射出成形金型 Granted JPS63251215A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8452787A JPS63251215A (ja) 1987-04-08 1987-04-08 ピンゲ−トを有する射出成形金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8452787A JPS63251215A (ja) 1987-04-08 1987-04-08 ピンゲ−トを有する射出成形金型

Publications (2)

Publication Number Publication Date
JPS63251215A true JPS63251215A (ja) 1988-10-18
JPH0416054B2 JPH0416054B2 (en:Method) 1992-03-19

Family

ID=13833110

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8452787A Granted JPS63251215A (ja) 1987-04-08 1987-04-08 ピンゲ−トを有する射出成形金型

Country Status (1)

Country Link
JP (1) JPS63251215A (en:Method)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994017978A1 (en) * 1993-02-02 1994-08-18 Tpp Axxicon B.V. Injection mould and method for injection moulding an article
EP2253445A1 (en) * 2009-05-20 2010-11-24 Samsung Electronics Co., Ltd. Injection mold and injection molding method using the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5451021B2 (ja) * 2008-10-01 2014-03-26 キヤノン電子株式会社 射出成形機の制御方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5397174U (en:Method) * 1977-01-12 1978-08-07
JPS5683023U (en:Method) * 1979-11-30 1981-07-04
JPS57108928U (en:Method) * 1980-12-26 1982-07-05

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5397174U (en:Method) * 1977-01-12 1978-08-07
JPS5683023U (en:Method) * 1979-11-30 1981-07-04
JPS57108928U (en:Method) * 1980-12-26 1982-07-05

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994017978A1 (en) * 1993-02-02 1994-08-18 Tpp Axxicon B.V. Injection mould and method for injection moulding an article
EP2253445A1 (en) * 2009-05-20 2010-11-24 Samsung Electronics Co., Ltd. Injection mold and injection molding method using the same
US7867430B2 (en) 2009-05-20 2011-01-11 Samsung Electronics Co., Ltd. Injection mold and injection molding method using the same

Also Published As

Publication number Publication date
JPH0416054B2 (en:Method) 1992-03-19

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