JPS63248115A - Discrimination device for semiconductor device - Google Patents

Abstract

PURPOSE:To cut down the cost of manufacture of the title discriminating device by a method wherein the discrimination pattern, which was formed simultaneously with a semiconductor element pattern, is classified automatically. CONSTITUTION:Wafers 21 are sent to the position detecting part 11 of a discrimination pattern 22 from a stoker 15 by a belt 18, the positioning operation of the linear point of intersection of a stripe line 23 in conducted by the detection of a stepping using a laser beam. The position of the pattern 22 is recognized by the relative position from the linear point of intersection, the wafers 21 are sent to a pattern recognition part 12. Then, the pattern 22 is discriminated by the laser beam, the discriminated wafers 21 are classified by a classification part 13 using the method of classification which was inputted into a control part 14 in advance and the wafers are housed in a stoker 16.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a semiconductor device identification method for automatically identifying a pattern completely formed on a semiconductor device.

[Conventional technology]

Regarding the identification of Sasamai semiconductor devices, identification can be done by visual inspection using a human microscope without using automatic equipment, or by attaching a special mark for identification to the semiconductor substrate in a separate process. I was making an identification.

[Problem that the invention seeks to solve]

The above-mentioned conventional ν method for semiconductor devices has the disadvantage that not only does it require the step of applying an identification mark, but also a place must be secured on the semiconductor substrate to place the mark.

[Means for solving the problem] The method for identifying a semiconductor device of the present invention includes a step of detecting the position of a pattern forming a semiconductor element and an identification pattern formed at four o'clock, a step of identifying the pattern, and identification. The process includes a process of classifying broken semiconductor devices.

〔Example〕

Next, I would like to explain briefly about the present invention.

FIG. 1 is a schematic diagram of a semiconductor identification device implementing an actual MII example of the present invention. In the figure, 11 rt identification pattern position detection section, 12 ri pattern identification section, 13 ri semiconductor device classification section, and 14 ri these control sections. Second
FIG. 1'lt is a schematic diagram of an identified semiconductor device, 21
is a wafer, 22 is an identification pattern, and 23 is a scribe pattern. Further, the identification pattern 22 in this embodiment is the product name of the semiconductor device, and the mask pattern is set so that the product name is present at the 1'6'' position of the chip for 16 chip sizes. First, wafer-21r
i The detection section 11 sends the identification pattern from the semiconductor wafer unloading stoker 15 to the identification pattern position detection section 11 by the automatic conveyance belt 18. The detection section 11 uses a laser beam to detect the level difference in the swipe life line 23, thereby detecting the intersection of the 7° swipe line. positioning is performed. Here, since the identification pattern 22 exists at the same position on the chip, its position can be recognized from the relative position from the intersection of the scribe legs 23. When the wafer 21 is transferred to the pattern identification section 12, the RI identification pattern 22 is Positioning is complete. There are various methods for identifying patterns, such as using the brightness of light or reflecting laser light on the steps of the pattern, but this device identifies patterns by using laser light. The identified wafers 21ri are sorted by the sorting section 13 according to the sorting method inputted in advance to the control section 14, and then transported to the stovker 16 for carrying in each semiconductor wafer.
is stored in. Additionally, this device has a re-identification control function in case a pattern cannot be identified the first time, and a classification function for unidentifiable wafers.

[Embodiment 2] FIG. 3 is a schematic diagram showing a semiconductor device according to Embodiment 2 of the present invention, in which products of gate array and ROM quality 18 are divided by coat, and are made of a 31ri wafer.

32 is a code name representing the type of wafer subjected to pattern identification, 33ri 7° wafer.

In this embodiment, the identification device shown in FIG. 1 is used.
1cIj, it is possible to automatically perform convex pole classification for each code, such as the stage of stocking. The position on the semiconductor device to which the type code pattern is transferred has a constant positional relationship with the life line as shown in FIG.

〔Effect of the invention〕

As explained above, the present invention has the effect of automatically classifying the identification pattern formed at the same time as the pattern forming the semiconductor element, thereby eliminating the need to add an identification pattern and reducing the manufacturing cost of semiconductor devices. be.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram of a semiconductor identification device implementing an embodiment of the present invention, and FIGS. 2 and 3 are schematic diagrams of a semiconductor device to be identified. 11...Identification pattern position punching fR1, 12
...Pattern identification section, 13...Semiconductor device classification section, 14...Control section, 15...
...Carrier stocker for carrying out semiconductor wafers, 16
...Carrier strike for loading semiconductor wafers, car, 17...Monitor TV, 18...
Transport bell), 21... River/Semiconductor wafer, 22...
...Identification pattern (product name), 23...Suflife'i, 31...Semiconductor wafer, 32
...Identification pattern (product code), 33...
...Suflife line. -“, 1 Yun Ge f Map F 2 I $ 2 Ward 3rd concave j1

Claims (1)

[Claims] Patterns such as letters, numbers, symbols, codes, etc. formed simultaneously with patterns for forming semiconductor elements on a semiconductor substrate or various films formed on the semiconductor substrate are identified, and semiconductor substrates are classified according to pre-entered classification criteria. An identification device for semiconductor devices, characterized in that it automatically performs classification of semiconductor devices.