JPS63236322A - Mask for x-ray exposure - Google Patents

Mask for x-ray exposure

Info

Publication number
JPS63236322A
JPS63236322A JP62068836A JP6883687A JPS63236322A JP S63236322 A JPS63236322 A JP S63236322A JP 62068836 A JP62068836 A JP 62068836A JP 6883687 A JP6883687 A JP 6883687A JP S63236322 A JPS63236322 A JP S63236322A
Authority
JP
Japan
Prior art keywords
mask
adhesive
support frame
fixing ring
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62068836A
Other languages
Japanese (ja)
Inventor
Minoru Tanaka
稔 田中
Ryuichi Funatsu
隆一 船津
Yukio Kenbo
行雄 見坊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62068836A priority Critical patent/JPS63236322A/en
Publication of JPS63236322A publication Critical patent/JPS63236322A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To prevent thermal deformation of a mask substrate, by bonding a mask support frame to a securing ring by means of an adhesive which keeps its resiliency still after cured. CONSTITUTION:A recess 6 in a securing ring 4 is filled with adhesive 5. The reference surface of the securing ring, namely the surface on which the recess 5 is provided is contacted closely on the surface of the mask support frame 3 opposite to the one having mask patterns. A communication hole 7 provided in the securing ring 4 is aligned with a groove 9 provided on a base 9, and vacuum is drawn by means of a vacuum drawing duct 10 so that the mask support frame 3 is secured closely on the securing ring 4. A mask structure 12 thus prepared is heated to a temperature higher than a temperature used for exposure replication by several to several tens degrees so that the adhesive 5 is cured. In this manner, it is possible to prevent thermal deformation of the mask and to improve the precisions of gap and alignment between the mask and the wafer.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、軟X線を用いて微細パターンを転写するX線
露光用マスクにかかわり、特に、熱歪の影響が少なく、
マスク基板の平坦性の高精度維持が可能なX線露光用マ
スクに関する。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an X-ray exposure mask that transfers fine patterns using soft X-rays, and in particular, the present invention relates to an X-ray exposure mask that is less affected by thermal distortion,
The present invention relates to an X-ray exposure mask that can maintain high precision flatness of a mask substrate.

〔従来の技術〕[Conventional technology]

従来のX線露光用マスクは、特公昭54−8068号公
報に記載のように、マスク支持枠と固定リングとの間に
一定の厚みの接着剤を充填して接着していた。また、接
着剤としては、接着力が強力で充填が可能なエポキシ系
接着剤が一般的に用いられていた。
In a conventional X-ray exposure mask, as described in Japanese Patent Publication No. 54-8068, a mask support frame and a fixing ring are bonded together by filling the space between the mask support frame and a fixing ring with an adhesive having a certain thickness. Furthermore, as the adhesive, an epoxy adhesive that has strong adhesive force and can be filled has generally been used.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上記従来技術は、接着剤の熱膨張に起因するマスク基板
の変形について配慮されておらず、露光転写時マスク基
板の平坦性が維持できず、マスクとウェハ間のギャップ
精度およびアラインメント精度が低下するという問題が
あった。
The above conventional technology does not take into account the deformation of the mask substrate caused by thermal expansion of the adhesive, and the flatness of the mask substrate cannot be maintained during exposure transfer, resulting in a decrease in gap accuracy and alignment accuracy between the mask and the wafer. There was a problem.

すなわち、エポキシ系接着剤等の硬化後は弾力性をほと
んど有しない接着剤を用いてマスク支持枠を固定リング
に接着した場合、接着剤の剛性が高いため、マスク支持
枠、接着剤および固定リングの熱膨張差によって、剛性
の低いマスク支持枠が変形する。また、一般に接着剤の
熱膨張係数は金属に比べて1桁ないし2桁大きく、従来
例のようにマスク支持枠と固定リングとの間に一定の厚
みの接着剤を充填したような構造では、接着剤の厚さ方
向の熱膨張も無視できなくなる。例えば、接着剤の厚み
が1瓢、温度変動が2℃で、エポキシ系接着剤使用の場
合、接着剤の厚さ方向の寸法変化は0.1〜α2μmと
なる。
In other words, if the mask support frame is bonded to the fixing ring using an adhesive such as an epoxy adhesive that has almost no elasticity after curing, the rigidity of the adhesive is high, so the mask support frame, adhesive, and fixation ring The mask support frame, which has low rigidity, is deformed due to the difference in thermal expansion. Additionally, the coefficient of thermal expansion of adhesives is generally one to two orders of magnitude larger than that of metals, and in conventional structures where a fixed thickness of adhesive is filled between the mask support frame and the fixing ring, Thermal expansion in the thickness direction of the adhesive can no longer be ignored. For example, when the thickness of the adhesive is 1 mm, the temperature fluctuation is 2° C., and an epoxy adhesive is used, the dimensional change in the thickness direction of the adhesive is 0.1 to α2 μm.

本発明の目的は、接着剤の種類、接着方法に起因するマ
スク基板の熱変°形の問題を取り除き、露光転写中、マ
スク平坦性の高精度維持が可能なX線露光用マスクを提
供することにある。
An object of the present invention is to provide an X-ray exposure mask that eliminates the problem of thermal deformation of the mask substrate caused by the type of adhesive and bonding method, and that can maintain high precision mask flatness during exposure transfer. There is a particular thing.

〔問題点を解決するための手段〕[Means for solving problems]

上記目的は、固定リングの一方の基準面に接着剤を充填
するための凹みを設け、該凹みに硬化後も弾力性を有す
る接着剤を充填して、マスク支持枠のパターン形成側と
は反対側の面と、固定リングの上記凹みを設けた基準面
とを密着させて接着することにより、達成される。
The above purpose is to provide a recess for filling an adhesive on one reference surface of the fixing ring, fill the recess with an adhesive that remains elastic even after curing, and fill the recess with an adhesive that remains elastic even after curing. This is achieved by closely adhering the side surface and the reference surface of the fixing ring provided with the recess.

さらに、接着を露光転写時の温度よ)数度〜数十度高い
温度で行うか、あるいは、接着剤として、硬化時収縮性
を有しかつ硬化後も弾力性を有する接着剤を用いること
により、一層の効果を挙げることができる。
Furthermore, by performing the adhesion at a temperature several degrees to several tens of degrees higher than the temperature at the time of exposure transfer, or by using an adhesive that has shrinkage properties during curing and remains elastic even after curing. , further effects can be achieved.

〔作用〕[Effect]

上記のように、硬化後も弾力性を有する接着剤を用いて
マスク支持枠と固定リングとを接着することによう、露
光転写中に温度変動が生じても、マスク支持枠、接着剤
および固定リングの熱膨張の差による変形の要因を上記
接着剤の弾性変形によって吸収させることが可能となる
ので、マスク基板のそυ等の熱変形を防止することがで
き、高精度の平坦性の維持が可能となる。
As mentioned above, since the mask support frame and fixing ring are bonded using an adhesive that remains elastic even after curing, even if temperature fluctuations occur during exposure transfer, the mask support frame, adhesive, and fixing ring can be bonded together. Since the cause of deformation caused by the difference in thermal expansion of the ring can be absorbed by the elastic deformation of the adhesive, it is possible to prevent thermal deformation of the mask substrate and maintain high precision flatness. becomes possible.

また、固定リングの接着側の基準面と、マスク支持枠の
パターン形成側とは反対側の面とを密着させ、固定リン
グの接着側の基準面に設けた凹みに接着剤を充填し、露
光転写時の温度より数度〜数十度高い温度で接着を行う
か、あるいは硬化時収縮性を有し硬化後も弾力性を有す
る接着剤を用いることによシ、露光転写時には、接着剤
の収縮によって発生する力がマスク支持枠を固定リング
に密着させる力として作用し、接着剤に起因するマスク
の厚さ方向の変化を除去することができる。
In addition, the reference surface on the adhesive side of the fixing ring is brought into close contact with the surface of the mask support frame on the opposite side from the pattern formation side, and the recess provided in the reference surface on the adhesive side of the fixing ring is filled with adhesive, and exposed. By adhering at a temperature several to several tens of degrees higher than the temperature at the time of transfer, or by using an adhesive that shrinks during curing and remains elastic even after curing, it is possible to The force generated by the contraction acts as a force that brings the mask support frame into close contact with the fixing ring, and can eliminate changes in the thickness direction of the mask caused by the adhesive.

このときマスク支持枠を固定リングに密着させる力は、
接着剤が硬化後も弾力性を有しているため、マスク基板
の変形等の悪影響はほとんど生じない。
At this time, the force that brings the mask support frame into close contact with the fixing ring is
Since the adhesive has elasticity even after curing, adverse effects such as deformation of the mask substrate hardly occur.

〔実施例〕〔Example〕

以下、本発明の一実施例を第1図、第2図により説明す
る。
An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.

第1図は、該実施例のX線露光用マスクの断面図−t’
sす、マスクパターン1、マスク基板2、マスク支持枠
3、固定リング4、接着剤5からなっている。固定リン
グ4の両面は高精度で平坦な基準面を有し、一方の基準
面には接着剤5を充填するための凹み6を設けである。
FIG. 1 is a cross-sectional view of the X-ray exposure mask of this embodiment -t'
It consists of a mask pattern 1, a mask substrate 2, a mask support frame 3, a fixing ring 4, and an adhesive 5. Both sides of the fixing ring 4 have highly accurate and flat reference surfaces, and one reference surface is provided with a recess 6 for filling the adhesive 5.

凹み乙の形状は、マスク支持枠3と固定リング4との間
で気密性を必要とする場合は連続した溝状とし、そうで
ない場合は連続しない凹み、例えばそれぞれ独立した複
数の凹みでもよい。凹み6への接着剤5の充填量は、凹
み6内に少しすき壕ができる程度がよい。
The shape of the recess B may be a continuous groove if airtightness is required between the mask support frame 3 and the fixing ring 4, or may be a discontinuous recess, for example, a plurality of independent recesses. The amount of adhesive 5 to be filled into the recess 6 is preferably such that a slight groove is formed within the recess 6.

マスク支持枠3と固定リング4との接着は、接着剤5を
凹み6内に充填した後、固定リング4の凹み6のある側
の基準面と、マスク支持枠3のマスクパターン形成側と
は反対側の面とを密着させ、露光転写時の温度より数度
〜数十度高い温度で接着を行うか、あるいは硬化時収縮
性を有しかつ硬化後も弾力性を有する接着剤を用いて接
着を行う。
The mask support frame 3 and the fixing ring 4 are bonded together after filling the recess 6 with the adhesive 5. The reference surface of the fixing ring 4 on the side with the recess 6 and the mask pattern forming side of the mask support frame 3 are Either bring the opposite side into close contact and bond at a temperature several to several tens of degrees higher than the temperature at the time of exposure transfer, or use an adhesive that shrinks when cured and remains elastic even after curing. Perform gluing.

なお、固定リング4に設けた連通穴7は、接着時にマス
ク支持枠3と固定リング4とを真空吸着によシ密着させ
るためのものである。接着剤5には、硬化後も弾力性を
有するシリコーンゴム等のゴム系の接着剤を用いる。
Note that the communication hole 7 provided in the fixing ring 4 is for bringing the mask support frame 3 and the fixing ring 4 into close contact with each other by vacuum suction during adhesion. As the adhesive 5, a rubber-based adhesive such as silicone rubber is used which has elasticity even after curing.

第2図は、第1図のマスクの接着方法を示したものであ
る。固定リング4に設けた凹み6内に接着剤5を充填し
、マスク支持枠3のマスクパターン1が形成された側と
反対側の面と、固定リング4の凹み6の設けられた基糸
面とを密着させる。
FIG. 2 shows a method of bonding the mask of FIG. 1. The recess 6 provided in the fixing ring 4 is filled with adhesive 5, and the surface of the mask support frame 3 opposite to the side on which the mask pattern 1 is formed, and the base thread surface of the fixing ring 4 where the recess 6 is provided. and bring them into close contact.

次に、固定リング4に設けた連通穴7を、ペース8に設
けた溝9の位置に合わせ、真空吸引路10を用いて真空
吸引し、マスク支持枠3と固定リング4とを完全に密着
させる。この状態で、加熱手段11によりマスク体12
を、露光転写時の温度より数度〜数十度高い温度に加熱
し、接着剤5を硬化させる。
Next, the communication hole 7 provided in the fixing ring 4 is aligned with the groove 9 provided in the pace 8, and vacuum suction is applied using the vacuum suction path 10 to completely bring the mask support frame 3 and the fixing ring 4 into close contact. let In this state, the mask body 12 is heated by the heating means 11.
is heated to a temperature several degrees to several tens of degrees higher than the temperature at the time of exposure transfer, and the adhesive 5 is cured.

本実施例によれば、マスク支持枠6と固定リング4を、
密着状態で、硬化後に弾力性を有する接着剤を用いて、
露光転写時の温度より数度〜数十度高い温度で接着する
か、あるいは硬化時収縮性の接着剤を用いて接着するた
め、接着剤に起因するマスクの熱変形を防止できるよう
になる。
According to this embodiment, the mask support frame 6 and the fixing ring 4 are
In close contact, using an adhesive that has elasticity after curing,
Since the mask is bonded at a temperature several to several tens of degrees higher than the temperature during exposure and transfer, or by using an adhesive that shrinks when cured, thermal deformation of the mask due to the adhesive can be prevented.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、マスクの熱変形が防止できるので、露
光転写中においてマスク基板の平坦性が高精度で維持で
きるようにな9.X線露光に際しマスクとウェハ間のギ
ャップ精度、アラインメント精度を向上することができ
る。
According to the present invention, since thermal deformation of the mask can be prevented, the flatness of the mask substrate can be maintained with high precision during exposure and transfer9. It is possible to improve the gap accuracy and alignment accuracy between the mask and the wafer during X-ray exposure.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例のX線露光用マスクの断面図
、第2図は第1図のマスクの接着方法を説明するための
図である。 1・・・マスクパターン 2・・・マスク基板 3・・・マスク支持枠 4・・・固定リング 5・・・接着剤 6・・・凹み。
FIG. 1 is a sectional view of an X-ray exposure mask according to an embodiment of the present invention, and FIG. 2 is a diagram for explaining a method of bonding the mask of FIG. 1. 1...Mask pattern 2...Mask substrate 3...Mask support frame 4...Fixing ring 5...Adhesive 6...Concave.

Claims (1)

【特許請求の範囲】 1、軟X線を吸収しやすい材質からなるマスクパターン
と、該マスクパターンをその面上に形成する軟X線を透
過しやすい材質からなる薄いマスク基板と、該マスク基
板を支えるマスク支持枠と、該マスク支持枠を接着によ
り固定する固定リングとで構成されるX線露光用マスク
において、上記固定リングは両面に高精度で平坦な基準
面を有するとともに、その一方の基準面には凹みを有し
、該凹みに硬化後も弾力性を有する接着剤を充填して、
上記マスク支持枠のパターン形成側とは反対側の面と、
固定リングの上記凹みが設けられた基準面とを密着させ
、該接着剤を硬化させてマスク支持枠と固定リングとを
接着したことを特徴とするX線露光用マスク。 2、特許請求の範囲第1項に記載のX線露光用マスクに
おいて、露光転写時の温度より数度〜数十度高い温度で
接着を行ったことを特徴とするX線露光用マスク。 3、特許請求の範囲第1項に記載のX線露光用マスクに
おいて、接着剤として、硬化時収縮性を有する接着剤を
用いたことを特徴とするX線露光用マスク。
[Claims] 1. A mask pattern made of a material that easily absorbs soft X-rays, a thin mask substrate made of a material that easily transmits soft X-rays on which the mask pattern is formed, and the mask substrate. In an X-ray exposure mask that is composed of a mask support frame that supports the mask support frame, and a fixing ring that fixes the mask support frame by adhesive, the fixing ring has high precision and flat reference surfaces on both sides, and The reference surface has a recess, and the recess is filled with an adhesive that remains elastic even after hardening.
A surface of the mask support frame opposite to the pattern formation side,
An X-ray exposure mask characterized in that the fixing ring is brought into close contact with the reference surface provided with the recess, and the adhesive is cured to bond the mask support frame and the fixing ring. 2. The X-ray exposure mask according to claim 1, wherein the mask is bonded at a temperature several to several tens of degrees higher than the temperature during exposure and transfer. 3. An X-ray exposure mask according to claim 1, characterized in that an adhesive having shrinkage properties upon curing is used as the adhesive.
JP62068836A 1987-03-25 1987-03-25 Mask for x-ray exposure Pending JPS63236322A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62068836A JPS63236322A (en) 1987-03-25 1987-03-25 Mask for x-ray exposure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62068836A JPS63236322A (en) 1987-03-25 1987-03-25 Mask for x-ray exposure

Publications (1)

Publication Number Publication Date
JPS63236322A true JPS63236322A (en) 1988-10-03

Family

ID=13385179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62068836A Pending JPS63236322A (en) 1987-03-25 1987-03-25 Mask for x-ray exposure

Country Status (1)

Country Link
JP (1) JPS63236322A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0677743A2 (en) * 1994-03-15 1995-10-18 Minimed Inc. Method of fabricating thin film sensors

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0677743A2 (en) * 1994-03-15 1995-10-18 Minimed Inc. Method of fabricating thin film sensors
EP0677743A3 (en) * 1994-03-15 1997-05-07 Minimed Inc Method of fabricating thin film sensors.

Similar Documents

Publication Publication Date Title
JP2891184B2 (en) Semiconductor device and manufacturing method thereof
JP4806850B2 (en) Actuator
JP2911954B2 (en) X-ray mask structure
JPS63236322A (en) Mask for x-ray exposure
JPH01292343A (en) Pellicle
JPH04232804A (en) Scale plate
JP3306922B2 (en) X-ray exposure mask and method of manufacturing the same
JPS63155731A (en) Semiconductor device
JP2802665B2 (en) Mask assembly method
JPH06260398A (en) X-ray mask structure and manufacture thereof, x-ray exposure method using the structure and semiconductor device manufacture according to the method
JPH11108783A (en) Capacitance type pressure sensor and fixing structure thereof
JPH01200328A (en) Manufacture of liquid crystal display device
JPS6259828A (en) Electrostatic capacity type pressure sensor
JPH0330349A (en) Manufacture of semiconductor device
JP5514175B2 (en) Object bonding method and composite
JPH02129910A (en) Mask for x-ray exposure
JPH01266722A (en) Preparation of mask for x-ray exposure
JPH0534571A (en) Mirror holding device of optical system
JPH0334582A (en) Solar cell fitted with cover glass
JP2000082642A (en) Method for bonding substrates together
JPS61182689A (en) Method for producing magnetic bubble memory device
JPS61271841A (en) Polishing method of semiconductor substrate
JPS6116087A (en) Magnetic bubble memory device
JPS60250314A (en) Lens holder
JPS5966545A (en) Weft guide of loom and production thereof