JPS6322235B2 - - Google Patents

Info

Publication number
JPS6322235B2
JPS6322235B2 JP58051182A JP5118283A JPS6322235B2 JP S6322235 B2 JPS6322235 B2 JP S6322235B2 JP 58051182 A JP58051182 A JP 58051182A JP 5118283 A JP5118283 A JP 5118283A JP S6322235 B2 JPS6322235 B2 JP S6322235B2
Authority
JP
Japan
Prior art keywords
article
protective film
adhesive tape
thin plate
peeled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58051182A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59174677A (ja
Inventor
Keigo Funakoshi
Kozo Nomura
Minoru Ametani
Kenji Oonishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP58051182A priority Critical patent/JPS59174677A/ja
Priority to KR1019840002489A priority patent/KR870000002B1/ko
Publication of JPS59174677A publication Critical patent/JPS59174677A/ja
Priority to US06/917,236 priority patent/US4775438A/en
Publication of JPS6322235B2 publication Critical patent/JPS6322235B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D491/00—Heterocyclic compounds containing in the condensed ring system both one or more rings having oxygen atoms as the only ring hetero atoms and one or more rings having nitrogen atoms as the only ring hetero atoms, not provided for by groups C07D451/00 - C07D459/00, C07D463/00, C07D477/00 or C07D489/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0004—Component parts, details or accessories; Auxiliary operations
    • B29C63/0013—Removing old coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44D—PAINTING OR ARTISTIC DRAWING, NOT OTHERWISE PROVIDED FOR; PRESERVING PAINTINGS; SURFACE TREATMENT TO OBTAIN SPECIAL ARTISTIC SURFACE EFFECTS OR FINISHES
    • B44D3/00—Accessories or implements for use in connection with painting or artistic drawing, not otherwise provided for; Methods or devices for colour determination, selection, or synthesis, e.g. use of colour tables
    • B44D3/16—Implements or apparatus for removing dry paint from surfaces, e.g. by scraping, by burning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/34—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater flexible, e.g. heating nets or webs
    • H05B3/36—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater flexible, e.g. heating nets or webs heating conductor embedded in insulating material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
    • Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
JP58051182A 1983-03-24 1983-03-24 保護フイルムの剥離方法 Granted JPS59174677A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP58051182A JPS59174677A (ja) 1983-03-24 1983-03-24 保護フイルムの剥離方法
KR1019840002489A KR870000002B1 (ko) 1983-03-24 1984-05-09 보호필름의 박리방법
US06/917,236 US4775438A (en) 1983-03-24 1986-10-07 Process for peeling protective film off a thin article

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58051182A JPS59174677A (ja) 1983-03-24 1983-03-24 保護フイルムの剥離方法

Publications (2)

Publication Number Publication Date
JPS59174677A JPS59174677A (ja) 1984-10-03
JPS6322235B2 true JPS6322235B2 (https=) 1988-05-11

Family

ID=12879701

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58051182A Granted JPS59174677A (ja) 1983-03-24 1983-03-24 保護フイルムの剥離方法

Country Status (3)

Country Link
US (1) US4775438A (https=)
JP (1) JPS59174677A (https=)
KR (1) KR870000002B1 (https=)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6155332U (https=) * 1984-09-17 1986-04-14
JP2589678B2 (ja) * 1986-09-03 1997-03-12 松下電子工業株式会社 半導体基板の裏面処理方法
JPH01125947A (ja) * 1987-11-11 1989-05-18 Ryoji Wakabayashi 半導体ウェハーの保護膜剥離装置
JP2628349B2 (ja) * 1988-07-19 1997-07-09 日東電工株式会社 半導体ウエハ保護フィルムの剥離方法
US5154793A (en) * 1988-09-27 1992-10-13 General Electric Company Method and apparatus for removing components bonded to a substrate
JPH0734433B2 (ja) * 1988-11-21 1995-04-12 日東電工株式会社 半導体ウエハのテープ貼付け方法およびテープ剥離方法
AT392949B (de) * 1989-03-17 1991-07-10 Gfm Holding Ag Vorrichtung zum abnehmen eines flaechigen werkstueckes von einer anklebenden unterfolie
JPH0682750B2 (ja) * 1989-08-30 1994-10-19 日東電工株式会社 ウエハ保護シートの剥離方法
JPH04336428A (ja) * 1991-05-13 1992-11-24 Nitto Denko Corp ウエハのテープ貼合わせ剥離装置
JP3156419B2 (ja) * 1993-02-15 2001-04-16 松下電器産業株式会社 異方性導電フィルム保護用セパレータの剥離方法
US5482899A (en) * 1994-03-21 1996-01-09 Texas Instruments Incorporated Leveling block for semiconductor demounter
US5609714A (en) * 1994-05-10 1997-03-11 Sterling Dry Imaging, Inc. Apparatus for dry processing of optical print media
US5651846A (en) * 1995-08-17 1997-07-29 Hurst; Richard Francis Method and apparatus for removing the printed layer of labels from semirigid containers
EP0848415A1 (en) * 1995-08-31 1998-06-17 Nitto Denko Corporation Method and apparatus for peeling protective adhesive tape from semiconductor wafer
US5810962A (en) * 1996-09-30 1998-09-22 Magnatech Computer Services, Inc. Apparatus and process for removing computer diskette labels
US5833073A (en) * 1997-06-02 1998-11-10 Fluoroware, Inc. Tacky film frame for electronic device
US6149758A (en) * 1997-06-20 2000-11-21 Lintec Corporation Sheet removing apparatus and method
JPH11162805A (ja) * 1997-12-02 1999-06-18 Nitto Denko Corp レジスト除去方法
JP3888754B2 (ja) * 1997-12-08 2007-03-07 日東電工株式会社 半導体ウエハの自動貼付け装置
JP3504543B2 (ja) * 1999-03-03 2004-03-08 株式会社日立製作所 半導体素子の分離方法およびその装置並びに半導体素子の搭載方法
JP4166920B2 (ja) * 2000-02-24 2008-10-15 リンテック株式会社 シート剥離装置および方法
US7413626B2 (en) * 2001-01-12 2008-08-19 3M Innovative Properties Company Adhesive film removal method and apparatus
JP4502547B2 (ja) * 2000-08-07 2010-07-14 日東電工株式会社 半導体ウエハの保護テープ除去方法およびその装置
DE10046594A1 (de) * 2000-09-20 2002-04-25 Hermann Werner Entetikettierverfahren und zugehörige Vorrichtung
US20030037877A1 (en) * 2000-10-18 2003-02-27 Fritz Brinkmann Delabelling method and device for carrying out said method
EP1259953A2 (de) * 2000-10-18 2002-11-27 Pacimex Verpackungen GmbH Entetikettierverfahren und vorrichtung zum durchführen des verfahrens
KR100425429B1 (ko) * 2001-05-02 2004-04-08 주식회사 엠앤엘 코팅 비닐 제거용 진공롤러 장치
JP2003147300A (ja) * 2001-11-12 2003-05-21 Lintec Corp ウエハ裏面研削時の表面保護シートおよび半導体チップの製造方法
TWI336603B (en) * 2004-12-03 2011-01-21 Ngk Spark Plug Co Method and apparatus for producing a wiring board, including film-peeling
JP2007230740A (ja) * 2006-03-02 2007-09-13 Tokyo Seimitsu Co Ltd 表面保護フィルム剥離方法および表面保護フィルム剥離装置
JP6099343B2 (ja) * 2012-09-21 2017-03-22 株式会社ディスコ 樹脂剥がし方法及び樹脂剥がし装置
BR112015018027A2 (pt) * 2013-01-31 2017-07-11 Michelin Rech Tech Encontrador de prevenção de rachadura de banda de rodagem e de redução de força de desmoldagem
JP6914587B2 (ja) * 2017-05-25 2021-08-04 株式会社ディスコ ウェーハの加工方法
CN110938386B (zh) * 2018-09-25 2022-06-28 上海和辉光电股份有限公司 一种薄膜封装结构保护膜及其褪膜方法
US11130329B2 (en) 2020-02-07 2021-09-28 The Boeing Company Apparatus and method for peeling a liner away from a substrate
JP2022074816A (ja) * 2020-11-05 2022-05-18 三菱電機株式会社 清掃装置および清掃方法
CN119176305A (zh) * 2023-06-21 2024-12-24 纬创资通(重庆)有限公司 除膜设备与揭膜机构

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE791797A (fr) * 1971-11-23 1973-05-23 Du Pont Procede et appareil de reproduction d'images par destratification d'unefeuille receptrice qui adhere a un element sensibilise
US4029536A (en) * 1976-04-07 1977-06-14 Western Electric Company, Inc. Methods of and apparatus for mounting articles to a carrier member
JPS5374534A (en) * 1976-12-15 1978-07-03 Seiko Epson Corp Method and apparatus for peeling protector paper or release paper
US4285759A (en) * 1979-11-19 1981-08-25 E. I. Du Pont De Nemours And Company Apparatus for stripping a cover sheet
US4421586A (en) * 1982-09-20 1983-12-20 Ronald Bargman Process, disposable roller cover, and masking preform for removing adhesive tape
JPS59104649A (ja) * 1982-12-08 1984-06-16 Somar Corp 保護膜の剥離装置
US4466852A (en) * 1983-10-27 1984-08-21 At&T Technologies, Inc. Method and apparatus for demounting wafers

Also Published As

Publication number Publication date
US4775438A (en) 1988-10-04
KR850000297A (ko) 1985-02-26
KR870000002B1 (ko) 1987-01-28
JPS59174677A (ja) 1984-10-03

Similar Documents

Publication Publication Date Title
JPS6322235B2 (https=)
US4732642A (en) Apparatus for peeling protective film off a thin article
JPH01272129A (ja) 保護フイルムの剥離方法
EP1128415B1 (en) Sheet removing apparatus and method
US6149758A (en) Sheet removing apparatus and method
CN101060068B (zh) 保护带剥离方法及采用该方法的装置
JP4204653B2 (ja) シート剥離装置および方法
CN101847571B (zh) 保护带剥离方法以及采用该方法的保护带剥离装置
CN101181834B (zh) 半导体晶圆的保护带切断方法及保护带切断装置
GB2159763A (en) Process for sticking adhesive tape on thin article
JPS644904B2 (https=)
FR2565949A1 (fr) Procede et appareil pour le collage d'un ruban adhesif sur un objet mince
JPH0319149B2 (https=)
KR101048920B1 (ko) 반도체웨이퍼의 불필요물 제거방법 및 이것을 이용한 장치
JPH0224381B2 (https=)
JP4204658B2 (ja) シート剥離装置および方法
JPH01321257A (ja) 薄板と粘着テープの貼着方法
KR20220123359A (ko) 반도체용 기판의 필름 박리 및 기판 적재 장치
JP2014225587A (ja) 基板へのテープ貼り付け装置及び方法
CN115071122B (zh) 一种自动化贴防水膜装置及防水膜自动剥离方法
JP2799564B2 (ja) 保護板分離装置
JPS644903B2 (https=)
JP2539828B2 (ja) 貼合せ装置
JPS6038897A (ja) 薄板とリングの貼着方法
JP2000172190A (ja) 貼付装置