JPS632134B2 - - Google Patents

Info

Publication number
JPS632134B2
JPS632134B2 JP56022005A JP2200581A JPS632134B2 JP S632134 B2 JPS632134 B2 JP S632134B2 JP 56022005 A JP56022005 A JP 56022005A JP 2200581 A JP2200581 A JP 2200581A JP S632134 B2 JPS632134 B2 JP S632134B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56022005A
Other versions
JPS57136342A (en
Inventor
Junji Sakurai
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56022005A priority Critical patent/JPS632134B2/ja
Publication of JPS57136342A publication Critical patent/JPS57136342A/ja
Publication of JPS632134B2 publication Critical patent/JPS632134B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/74Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/2205Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities from the substrate during epitaxy, e.g. autodoping; Preventing or using autodoping
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/268Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/092Laser beam processing-diodes or transistor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/093Laser beam treatment in general
JP56022005A 1981-02-17 1981-02-17 Expired JPS632134B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56022005A JPS632134B2 (ja) 1981-02-17 1981-02-17

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP56022005A JPS632134B2 (ja) 1981-02-17 1981-02-17
US06/347,586 US4403400A (en) 1981-02-17 1982-02-10 Process for producing a semiconductor device
EP19820300792 EP0058566B1 (en) 1981-02-17 1982-02-17 Process for producing a semiconductor device using a diffusion step
DE8282300792T DE3277790D1 (en) 1981-02-17 1982-02-17 Process for producing a semiconductor device using a diffusion step

Publications (2)

Publication Number Publication Date
JPS57136342A JPS57136342A (en) 1982-08-23
JPS632134B2 true JPS632134B2 (ja) 1988-01-18

Family

ID=12070884

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56022005A Expired JPS632134B2 (ja) 1981-02-17 1981-02-17

Country Status (4)

Country Link
US (1) US4403400A (ja)
EP (1) EP0058566B1 (ja)
JP (1) JPS632134B2 (ja)
DE (1) DE3277790D1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58194799A (en) * 1982-05-07 1983-11-12 Hitachi Ltd Preparation of silicon single crystal
JPH0450747B2 (ja) * 1983-04-12 1992-08-17 Nippon Electric Co
NL188923C (en) * 1983-07-05 1992-11-02 Philips Nv Method for manufacturing a semiconductor device
US4610730A (en) * 1984-12-20 1986-09-09 Trw Inc. Fabrication process for bipolar devices
US5250388A (en) * 1988-05-31 1993-10-05 Westinghouse Electric Corp. Production of highly conductive polymers for electronic circuits
US5702973A (en) * 1990-04-05 1997-12-30 Seh America, Inc. Method for forming epitaxial semiconductor wafer for CMOS integrated circuits
US5306939A (en) * 1990-04-05 1994-04-26 Seh America Epitaxial silicon wafers for CMOS integrated circuits
DE4315959C2 (de) * 1993-05-12 1997-09-11 Max Planck Gesellschaft Verfahren zur Herstellung einer strukturierten Schicht eines Halbleitermaterials sowie einer Dotierungsstruktur in einem Halbleitermaterial unter Einwirkung von Laserstrahlung
DE4331937A1 (de) * 1993-09-16 1994-03-17 Ulrich Prof Dr Mohr Verfahren zur Eindiffusion von Dotanten in Halbleiterfestkörper

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1373822A (fr) * 1963-08-21 1964-10-02 Europ Des Semiconducteurs Soc Procédé de réalisation de diffusion localisée d'une impureté dans un semiconducteur
US4170501A (en) * 1978-02-15 1979-10-09 Rca Corporation Method of making a semiconductor integrated circuit device utilizing simultaneous outdiffusion and autodoping during epitaxial deposition
JPS5837979B2 (ja) * 1980-02-04 1983-08-19 Nippon Telegraph & Telephone

Also Published As

Publication number Publication date
EP0058566A3 (en) 1986-01-29
EP0058566B1 (en) 1987-12-02
JPS57136342A (en) 1982-08-23
DE3277790D1 (en) 1988-01-14
US4403400A (en) 1983-09-13
EP0058566A2 (en) 1982-08-25

Similar Documents

Publication Publication Date Title
FR2500460B1 (ja)
DE3231587C2 (ja)
JPH0514246Y2 (ja)
JPH0448812B2 (ja)
JPS58500978A (ja)
JPS57171396U (ja)
JPS622380B2 (ja)
JPS6323495B2 (ja)
GR76461B (ja)
JPS6347176B2 (ja)
JPH0354048B2 (ja)
JPS6366937B2 (ja)
JPH0230530B2 (ja)
JPH0234455B2 (ja)
JPH035683B2 (ja)
DE3202446C2 (ja)
DE3208050C2 (ja)
DE3109288C2 (ja)
JPH0149441B2 (ja)
JPH0364728B2 (ja)
JPS6255885B2 (ja)
DE3234937C2 (ja)
JPH0341462B2 (ja)
JPS6217244B2 (ja)
JPH043492B2 (ja)