JPS63208261A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS63208261A
JPS63208261A JP4028787A JP4028787A JPS63208261A JP S63208261 A JPS63208261 A JP S63208261A JP 4028787 A JP4028787 A JP 4028787A JP 4028787 A JP4028787 A JP 4028787A JP S63208261 A JPS63208261 A JP S63208261A
Authority
JP
Japan
Prior art keywords
island
loop
semiconductor
bonding
tab
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4028787A
Other languages
Japanese (ja)
Other versions
JP2544371B2 (en
Inventor
Sueo Kawai
Asao Nishimura
Makoto Kitano
Akihiro Tatemichi
Hideo Miura
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62040287A priority Critical patent/JP2544371B2/en
Priority claimed from US07/158,673 external-priority patent/US4942452A/en
Publication of JPS63208261A publication Critical patent/JPS63208261A/en
Priority claimed from US08/448,881 external-priority patent/USRE37690E1/en
Application granted granted Critical
Publication of JP2544371B2 publication Critical patent/JP2544371B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PURPOSE: To prevent the breakdown of a semiconductor element in die bonding or due to temperature history thereafter, by dividing a tab into a peripheral loop part and a central island part, and indirectly mounting the semiconductor element on the island part through a bonding agent.
CONSTITUTION: A tab 2 is divided into a peripheral loop part 2b and a central island part 2a. The island part 2a is connected to a part 2c of the loop part 2b so that the island part 2a is supported with the loop part 2b as a unitary body. A semiconductor element 1 is indirectly mounted on the island part 2a through a bonding agent 6. Meanwhile the element 1 is directly mounted on the element mounting surface of the loop part 2b or mounted through a gap part. Since the bonding of the element 1 and the tab 2 is carried out only at a part of the center of the element in this method, the stress yielded in the element is approximately equal to the value, which is yielded at the entire bonding part of the element 1 corresponding to the length of the bonded part. Therefore, cracks are not yielded in the element even if the element has a large size.
COPYRIGHT: (C)1988,JPO&Japio
JP62040287A 1987-02-25 1987-02-25 Semiconductor device Expired - Lifetime JP2544371B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62040287A JP2544371B2 (en) 1987-02-25 1987-02-25 Semiconductor device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP62040287A JP2544371B2 (en) 1987-02-25 1987-02-25 Semiconductor device
US07/158,673 US4942452A (en) 1987-02-25 1988-02-22 Lead frame and semiconductor device
US08/448,881 USRE37690E1 (en) 1987-02-25 1995-05-24 Lead frame and semiconductor device

Publications (2)

Publication Number Publication Date
JPS63208261A true JPS63208261A (en) 1988-08-29
JP2544371B2 JP2544371B2 (en) 1996-10-16

Family

ID=12576391

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62040287A Expired - Lifetime JP2544371B2 (en) 1987-02-25 1987-02-25 Semiconductor device

Country Status (1)

Country Link
JP (1) JP2544371B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6265770B1 (en) * 1998-03-24 2001-07-24 Seiko Epson Corporation Mounting structure of semiconductor chip, liquid crystal device, and electronic equipment
JP2007194379A (en) * 2006-01-19 2007-08-02 Matsushita Electric Ind Co Ltd Lead frame, semiconductor device, and method of manufacturing same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS574226U (en) * 1980-06-09 1982-01-09
JPS5916357A (en) * 1982-07-19 1984-01-27 Nec Corp Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS574226U (en) * 1980-06-09 1982-01-09
JPS5916357A (en) * 1982-07-19 1984-01-27 Nec Corp Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6265770B1 (en) * 1998-03-24 2001-07-24 Seiko Epson Corporation Mounting structure of semiconductor chip, liquid crystal device, and electronic equipment
JP2007194379A (en) * 2006-01-19 2007-08-02 Matsushita Electric Ind Co Ltd Lead frame, semiconductor device, and method of manufacturing same

Also Published As

Publication number Publication date
JP2544371B2 (en) 1996-10-16

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