JPS6320476U - - Google Patents
Info
- Publication number
- JPS6320476U JPS6320476U JP11391186U JP11391186U JPS6320476U JP S6320476 U JPS6320476 U JP S6320476U JP 11391186 U JP11391186 U JP 11391186U JP 11391186 U JP11391186 U JP 11391186U JP S6320476 U JPS6320476 U JP S6320476U
- Authority
- JP
- Japan
- Prior art keywords
- conductor circuit
- layer
- circuit layer
- via hole
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 11
- 239000012212 insulator Substances 0.000 claims description 5
- 239000000945 filler Substances 0.000 claims 2
- 239000002952 polymeric resin Substances 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000463 material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11391186U JPS6320476U (US06368395-20020409-C00050.png) | 1986-07-24 | 1986-07-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11391186U JPS6320476U (US06368395-20020409-C00050.png) | 1986-07-24 | 1986-07-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6320476U true JPS6320476U (US06368395-20020409-C00050.png) | 1988-02-10 |
Family
ID=30996157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11391186U Pending JPS6320476U (US06368395-20020409-C00050.png) | 1986-07-24 | 1986-07-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6320476U (US06368395-20020409-C00050.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02281692A (ja) * | 1989-04-21 | 1990-11-19 | Matsushita Electric Works Ltd | 多層配線板 |
| JPH02281693A (ja) * | 1989-04-21 | 1990-11-19 | Matsushita Electric Works Ltd | 多層配線板の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53123868A (en) * | 1977-04-04 | 1978-10-28 | Hitachi Ltd | Method of producing multilayer printed circuit board provided with multiple through holes |
| JPS6151779B2 (US06368395-20020409-C00050.png) * | 1979-01-31 | 1986-11-10 | Canon Kk |
-
1986
- 1986-07-24 JP JP11391186U patent/JPS6320476U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53123868A (en) * | 1977-04-04 | 1978-10-28 | Hitachi Ltd | Method of producing multilayer printed circuit board provided with multiple through holes |
| JPS6151779B2 (US06368395-20020409-C00050.png) * | 1979-01-31 | 1986-11-10 | Canon Kk |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02281692A (ja) * | 1989-04-21 | 1990-11-19 | Matsushita Electric Works Ltd | 多層配線板 |
| JPH02281693A (ja) * | 1989-04-21 | 1990-11-19 | Matsushita Electric Works Ltd | 多層配線板の製造方法 |
