JPS63204723A - Reduction stepper - Google Patents

Reduction stepper

Info

Publication number
JPS63204723A
JPS63204723A JP62038181A JP3818187A JPS63204723A JP S63204723 A JPS63204723 A JP S63204723A JP 62038181 A JP62038181 A JP 62038181A JP 3818187 A JP3818187 A JP 3818187A JP S63204723 A JPS63204723 A JP S63204723A
Authority
JP
Japan
Prior art keywords
substrate
semiconductor substrate
substrate holding
cleaning
cleaned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62038181A
Other languages
Japanese (ja)
Other versions
JPH0519296B2 (en
Inventor
Hisashi Takahashi
久 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62038181A priority Critical patent/JPS63204723A/en
Publication of JPS63204723A publication Critical patent/JPS63204723A/en
Publication of JPH0519296B2 publication Critical patent/JPH0519296B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

PURPOSE:To eliminate any out of focus in case of exposure due to dirt on a substrate holding base by means of cleaning the base every time after finishing the exposure of semiconductor substrate. CONSTITUTION:A substrate holding base 1 with a semiconductor substrate removed therefrom after exposure is shifted to a cleaning vessel 8 by a carrier arm 5 and a carrier belt 6 comprising a substrate holding mechanism. Within the cleaming vessel 8, the rotating substrate holding base 1 held by a movable arm 11 is cleaned up by pure water nozzles 13 and a cleaning brush 12 comprising a cleaning mechanism to be dried up by the movable arm 11 turning at high speed. The cleaned up substrate holding base 1 is shifted to a positioning plate 9 by another carrier belt 7. Finally, the cleaned up and positioned substrate holder 1A is shifted to X-Y stage again to hold another semiconductor substrate repeatedly.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は縮小投影露光装置に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a reduction projection exposure apparatus.

〔従来の技術〕[Conventional technology]

従来の縮小投影露光装置では、半導体基板を保持した際
に、半導体基板と保持台のあいだに塵埃等がはさまれて
、その部分を露光した際局部的に焦点がずれてしまうと
いう現象が生じるが、これを避けるために、基板保持台
は半導体基板との接触面積をなるべく少なくするように
工夫されている。
With conventional reduction projection exposure equipment, when a semiconductor substrate is held, dust or the like gets caught between the semiconductor substrate and the holder, resulting in a local out-of-focus phenomenon when exposing that part. However, in order to avoid this, the substrate holder is devised to reduce the contact area with the semiconductor substrate as much as possible.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかし、上述した従来の基板保持台を用いた場合、半導
体基板裏面の塵埃の影響が確率的に低くはなるが、基板
保持台に、半導体基板を保持した際塵埃がはさまれ局部
的な焦点ずれを起す減少はなくならない。
However, when using the above-mentioned conventional substrate holder, the influence of dust on the back side of the semiconductor substrate is reduced in probability, but when the semiconductor substrate is held by the substrate holder, dust may be caught in the substrate holder, resulting in a localized focus. The decrease that causes the discrepancy will not disappear.

この塵埃が半導体基板の裏面からはがれて基板保持台に
残ってしまうと、次にくる半導体基板に焦点ずれの影響
を与え、良品率を低下させるという問題点がある。また
、焦点ずれに影響を与えなくても、同じ基板保持台を長
期間使っていると小さな塵埃が付着し、この塵埃が半導
体基板裏面を汚染し、汚染された半導体基板が他の装置
を汚染するという悪循環を起こしてしまう問題がある。
If this dust is peeled off from the back surface of the semiconductor substrate and remains on the substrate holder, there is a problem in that it affects the defocusing of the next semiconductor substrate and reduces the yield rate. In addition, even if it does not affect the defocus, if the same substrate holder is used for a long period of time, small dust will adhere to it, and this dust will contaminate the back side of the semiconductor substrate, and the contaminated semiconductor substrate will contaminate other equipment. The problem is that this creates a vicious cycle.

本発明の目的は、上記問題点を除去し、露光された半導
体基板の良品率を向上させることのできる縮小投影露光
装置を提供することにある。
SUMMARY OF THE INVENTION An object of the present invention is to provide a reduction projection exposure apparatus that can eliminate the above-mentioned problems and improve the yield rate of exposed semiconductor substrates.

〔問題点を解決するための手段〕[Means for solving problems]

本発明の縮小投影露光装置は、XYステージに保持され
半導体基板を保持する基板保持台と、前記基板保持台を
交換する基板保持台交換機構と、交換された前記基板保
持台を洗浄する基板保持台洗浄機構とを含んで構成され
る。
The reduction projection exposure apparatus of the present invention includes a substrate holder that is held on an XY stage and holds a semiconductor substrate, a substrate holder exchange mechanism that replaces the substrate holder, and a substrate holder that cleans the replaced substrate holder. It is configured to include a table cleaning mechanism.

〔実施例〕〔Example〕

次に本発明の実施例について図面を参照して説明する。 Next, embodiments of the present invention will be described with reference to the drawings.

第1図は本発明の一実施例の上面図である。FIG. 1 is a top view of one embodiment of the present invention.

第11図において、半導体基板を真空吸着する基板保持
台1は、モータ3,4を有するX−Yステージ2上に保
持される。そして、露光が終り、半導体基板がはずされ
た基板保持台1は、基板保持交換機構を構成する搬送ア
ーム5と搬送ベルト6により洗浄槽8内に送られる。
In FIG. 11, a substrate holding table 1 for vacuum suctioning a semiconductor substrate is held on an X-Y stage 2 having motors 3 and 4. After exposure, the substrate holder 1 from which the semiconductor substrate has been removed is transported into a cleaning tank 8 by a transport arm 5 and a transport belt 6, which constitute a substrate holding and exchanging mechanism.

洗浄槽8内において基板保持台1は第2図(a)、(b
)に示す可動アーム11により保持されたのち、回転さ
せられながら、洗浄機構を構成する純水ノズル13から
の純水と洗浄ブラシ12により洗浄される。そして洗浄
された基板保持台1は可動アーム11の高速回転により
乾燥させられる。
In the cleaning tank 8, the substrate holding stand 1 is mounted as shown in FIGS.
) is held by a movable arm 11 shown in FIG. 2, and is rotated while being cleaned by pure water and a cleaning brush 12 from a deionized water nozzle 13 constituting a cleaning mechanism. The cleaned substrate holding table 1 is then dried by high-speed rotation of the movable arm 11.

洗浄を終了した基板保持台1は、搬送ベルト7で位置決
め板9まで搬送され、位置決めが行なわれる。そして、
洗浄され位置決めされた基板保持台IAは再び搬送アー
ム5によりX−Yステージ2上に運ばれ再び半導体基板
を保持する。
The substrate holding table 1 that has been cleaned is conveyed to the positioning plate 9 by the conveyor belt 7, and positioning is performed. and,
The cleaned and positioned substrate holding stand IA is again carried onto the XY stage 2 by the transfer arm 5 and holds the semiconductor substrate again.

このように本実施例においては、一度半導体基板を保持
した基板保持台1は常に洗浄されるため塵埃が付着−し
た状態で半導体基板を保持することはなくなる。従って
半導体基板に露光されるパターンに焦点ずれが起ること
は極めて少なくなる。
In this manner, in this embodiment, the substrate holding table 1 that once held the semiconductor substrate is constantly cleaned, so that the semiconductor substrate is no longer held with dust attached thereto. Therefore, the occurrence of defocusing in the pattern exposed on the semiconductor substrate is extremely reduced.

尚、基板保持台1の洗浄は第3図に示したように、洗浄
槽15中の洗浄液に搬送アーム16で基板保持台1を浸
し、超音波発振器14を用いて洗浄したのち、乾燥室1
7で乾燥する方法等を用いてもよい。
As shown in FIG. 3, the substrate holding table 1 is cleaned by immersing the substrate holding table 1 in the cleaning liquid in the cleaning tank 15 using the transfer arm 16, cleaning it using the ultrasonic oscillator 14, and then moving it to the drying chamber 1.
You may use the method of drying in step 7.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、半導体基板の露光終了ご
とに基板保持台を洗浄することにより、基板保持台上の
塵埃による半導体基板の露光時の焦点ずれをなくす効果
がある。また半導体基板裏面についてた塵埃が基板保持
台に移され、それ以降流れてきた半導体基板に影響を与
えることもなくなり、製品の良品率が飛躍的に向上する
As described above, the present invention has the effect of eliminating defocus during exposure of the semiconductor substrate due to dust on the substrate holder by cleaning the substrate holder every time the exposure of the semiconductor substrate is completed. In addition, the dust on the back surface of the semiconductor substrate is transferred to the substrate holding table, and it no longer affects the semiconductor substrates that have flowed thereafter, dramatically improving the quality of products.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例の上面図、第2図(a)、(
b)は本発明の一実施例の基板保持台洗浄機構を説明す
るための上面図及び正面図、第3図は基板保持台洗浄機
構の他の例の断面図である。 1・・・基板保持台、2・・・X−Yステージ、3,4
・・・モータ、5・・・搬送アーム、6,7・・・搬送
ベルト、8・・・洗浄槽、9・・・位置決め機構、11
・・・可動アーム、12・・・洗浄ブラシ、13・・・
純水ノズル、14・・・超音波発振器、15・・・洗浄
槽、16・・・搬送アーム、17・・・乾燥室。
Fig. 1 is a top view of an embodiment of the present invention, Fig. 2(a), (
b) is a top view and a front view for explaining a substrate holder cleaning mechanism according to an embodiment of the present invention, and FIG. 3 is a sectional view of another example of the substrate holder cleaning mechanism. 1... Substrate holding stand, 2... X-Y stage, 3, 4
...Motor, 5...Transport arm, 6, 7...Transport belt, 8...Cleaning tank, 9...Positioning mechanism, 11
...Movable arm, 12...Washing brush, 13...
Pure water nozzle, 14... Ultrasonic oscillator, 15... Cleaning tank, 16... Transfer arm, 17... Drying room.

Claims (1)

【特許請求の範囲】[Claims] XYステージに保持され半導体基板を保持する基板保持
台と、前記基板保持台を交換する基板保持台交換機構と
、交換された前記基板保持台を洗浄する基板保持台洗浄
機構とを含むことを特徴とする縮小投影露光装置。
A substrate holder that is held on an XY stage and holds a semiconductor substrate, a substrate holder exchange mechanism that replaces the substrate holder, and a substrate holder cleaning mechanism that cleans the replaced substrate holder. Reduction projection exposure equipment.
JP62038181A 1987-02-20 1987-02-20 Reduction stepper Granted JPS63204723A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62038181A JPS63204723A (en) 1987-02-20 1987-02-20 Reduction stepper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62038181A JPS63204723A (en) 1987-02-20 1987-02-20 Reduction stepper

Publications (2)

Publication Number Publication Date
JPS63204723A true JPS63204723A (en) 1988-08-24
JPH0519296B2 JPH0519296B2 (en) 1993-03-16

Family

ID=12518214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62038181A Granted JPS63204723A (en) 1987-02-20 1987-02-20 Reduction stepper

Country Status (1)

Country Link
JP (1) JPS63204723A (en)

Also Published As

Publication number Publication date
JPH0519296B2 (en) 1993-03-16

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