JPS6320430U - - Google Patents
Info
- Publication number
- JPS6320430U JPS6320430U JP11511286U JP11511286U JPS6320430U JP S6320430 U JPS6320430 U JP S6320430U JP 11511286 U JP11511286 U JP 11511286U JP 11511286 U JP11511286 U JP 11511286U JP S6320430 U JPS6320430 U JP S6320430U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chips
- collector
- utility
- scope
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11511286U JPS6320430U (US07935154-20110503-C00006.png) | 1986-07-25 | 1986-07-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11511286U JPS6320430U (US07935154-20110503-C00006.png) | 1986-07-25 | 1986-07-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6320430U true JPS6320430U (US07935154-20110503-C00006.png) | 1988-02-10 |
Family
ID=30998470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11511286U Pending JPS6320430U (US07935154-20110503-C00006.png) | 1986-07-25 | 1986-07-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6320430U (US07935154-20110503-C00006.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02295834A (ja) * | 1989-05-10 | 1990-12-06 | Mitsubishi Materials Corp | ウェーハ取り扱い装置 |
-
1986
- 1986-07-25 JP JP11511286U patent/JPS6320430U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02295834A (ja) * | 1989-05-10 | 1990-12-06 | Mitsubishi Materials Corp | ウェーハ取り扱い装置 |
