JPS63201369U - - Google Patents

Info

Publication number

JPS63201369U

JPS63201369U JP9355387U JP9355387U JPS63201369U JP S63201369 U JPS63201369 U JP S63201369U JP 9355387 U JP9355387 U JP 9355387U JP 9355387 U JP9355387 U JP 9355387U JP S63201369 U JPS63201369 U JP S63201369U

Authority

JP

Japan

Prior art keywords

protective film

polyimide resin

integrated circuit

hybrid integrated

solder

Prior art date

1987-06-17

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 229920001721 polyimide Polymers 0.000 claims description 2
• 239000009719 polyimide resin Substances 0.000 claims description 2
• 230000001681 protective effect Effects 0.000 claims description 2
• 229910000679 solder Inorganic materials 0.000 claims 1
• 239000004020 conductor Substances 0.000 description 2
• PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
• 239000008188 pellet Substances 0.000 description 1
• 239000000758 substrate Substances 0.000 description 1