JPS63200541A - Mechanism for adjusting inclination of bonding tool - Google Patents

Abstract

PURPOSE:To make it unnecessary to adjust inclinations of front and back direction and left and right direction again and avoid the discrepancy of the tip surface of a bonding tool from a predetermined position by a method wherein, after a parallelism is measured, the necessary one of a left and right fixing member and a front and back fixing member is relieved and readjusted. CONSTITUTION:In order to make the tip 47 of a bonding tool 41 parallel to a stage, inclinations of front and back direction and left and right direction are adjusted. If a left and right adjusting screw 51 is tightened first, a 1st cylindrical surface 48 slides relatively to a 2nd cylindrical surface 49. At that time, the tool 41 held by a holder 42 which has the cylindrical surface 48 is turned to the left and right with the tip 47 as a center and moved to a position shown by a double-dot chain line. After the inclination of the left and right direction is adjusted like this, a fixing screw 53 is tightened to fix the inclination. Then a front and back adjusting screw 61 is tightened to adjust the inclination of the front and back direction in the same way and the inclination is fixed by a fixing screw 63. When the inclination of the only one direction of the tool 41 is to be adjusted again, only one of the screws 51 and 61 is relieved for readjustment. Unless the other screw is relieved, the other inclination is not influenced.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to tilt adjustment am of a bonding tool for TAB bonding an IC chip to a film carrier.

(Conventional technology) In recent years, in order to meet the demands of the times for electronic devices to be smaller and have higher performance, recently developed semiconductor technology has made IC (semiconductor integrated circuit) chips thinner, denser, and slimmer. is mounted on the board of electronic equipment. As a method of mounting the IC chip on the board in this way, the IC chip is attached to a film carrier, and this film carrier is mounted on the board.
There is a subjunctive method.

As this TAB connection method, there is a method as shown in FIG. 3, for example. In the figure, first, an IC chip 2 is placed on a stage 1, and a hole 3a of a film carrier 3 is aligned with this IC chip 2. Next, the electrode pads 4 of the IC chip 2 and the leads 5 of the film carrier 3 are pressed and heated by the tip surface 6a of the bonding tool 6.
Metal eutectic bond covering.

Here, since the connection between the electrode pad 4 and the lead 5 is performed with a high precision of several tens of micrometers, a high precision of several micrometers is required for the parallelism between the stage 1 and the bonding tool 3. .

If the bonding tool 6 is tilted with respect to the stage 1, the pressure applied to the leads 5 will be uneven. For this reason, a state in which the lead 5 and the electrode pad 4 are partially not connected, a so-called uneven contact state, may occur. Therefore, the film carrier 3 in which this uneven contact state is occurring
When mounted on the substrate of a thin electronic device, a problem arises in that the thin electronic device cannot accurately perform its functions.

In order to solve these problems, a bonding tool tilt adjustment mechanism as shown in FIGS. 4 to 6, for example, has been proposed. In the same figure, reference numeral 11 indicates TAB of an IC chip (not shown) on a film carrier (not shown).
This bonding tool 11 is held by a holder 12 and positioned on a stage (not shown). Holder 1
2 along the cylindrical surface 13a of the first slider 13 in the left-right direction (
Move the first slider 1 so that it rotates in the direction of the arrow in Figure 4).
It is attached to 3. The first slider 13 is attached to the second slider 14 so as to rotate along the cylindrical surface 14a of the second slider 14 about the tip end surface 11a in the front-rear direction (in the direction of arrow B in FIG. 5). First slider 13
and the second slider 14 are fixed by fixing screws 15.

To adjust the tip end surface 11a of the bonding tool 11 to be parallel to the stage, first, the first slider 13 and the second slider 14 are temporarily fixed using the fixing screws 15. Next, the bonding tool 11 is adjusted by the adjusting screw 16.
The inclination of the bonding tool 11 is adjusted by rotating the bonding tool 11 in the left-right direction and by rotating the adjustment eccentric cam 17 in the front-rear direction. In this way, the tip surface 11a is made parallel to the stage. When the tip surfaces 11a become parallel, the fixing screws 15 are temporarily tightened to fix the first slider 13 and the second slider 14.

By the way, in order to measure whether the parallelism is a highly precise surface of about several μm, the parallelism is measured using a parallelism adjustment gauge 19 placed on a stage 18, as shown in FIGS. 7 and 8. . The parallelism adjustment gauge 19 is made by adhering a polyimide film 21 to a feeler gauge 20 with an adhesive 22.

The parallelism adjustment gauge 19 is pressed by the bonding tool 24, and the parallelism is measured by the impression 23 left on the polyimide fill 21. After measuring the parallelism in this way, it may be necessary to adjust only one of the inclinations of the bonding tool 24 in the left-right direction or in the front-back direction. In such a case, the fixing screw 15 must be loosened again. However, when it is necessary to adjust the tilt in only one of the left-right or front-back directions,
When the fixing screw 15 is loosened, the tilt in other directions that have already been adjusted will also be affected and become out of order, posing a problem in that the tilt in the front-rear direction and the left-right direction must be adjusted again.

On the other hand, another bonding tool tilt adjustment mechanism as shown in FIG. 9 has also been proposed. As shown in FIG.
to adjust the left and right tilt. Further, the second holder 35 that holds the left and right adjustment screw 34 similarly holds a front and rear adjustment screw (not shown), and the front and back inclination is adjusted by this front and rear adjustment screw. This tilt adjustment mechanism is
When it is necessary to adjust the tilt in only one direction out of the front-rear direction or the left-right direction, the already adjusted tilt in the other direction is not affected. Therefore, the above-mentioned problem of having to make adjustments in the front-rear direction and left-right direction again is solved. However, with this tilt adjustment mechanism, it is not possible to rotate the bonding tool 31 around the tip surface 31a, so when adjusting the tilt, the tip surface 31a of the bonding tool 31 may shift from a predetermined position with respect to the stage. There is a problem with this.

(Problem to be Solved by the Invention) As described above, when it is necessary to adjust only one direction of the bonding tool in the left-right direction or front-back direction, even the already adjusted tilt in the other direction may be adjusted. There was a problem in that it became distorted due to the influence, and the inclination in the front-rear direction and left-right direction had to be adjusted again.

Further, when adjusting the inclination of the bonding tool, there is a problem in that the tip end surface deviates from a predetermined position.

Therefore, this invention was developed again in view of these problems.
There is no need to adjust the tilt in the front/back direction or left/right direction.
Another object of the present invention is to provide a bonding tool inclination adjustment mechanism that prevents the distal end surface of the bonding tool from shifting from a predetermined position.

[Structure of the Invention] (Means for Solving the Problems) In order to solve these problems, the present invention provides a bonding tool for TAB bonding an IC chip to a film carrier, and a bonding tool. a left-right adjustment means for adjusting the bonding tool in the left-right direction centering on the tip surface of the bonding tool; a left-right fixing member for fixing the movement of the bonding tool in the left-right direction; The structure includes a front-back adjustment means and a front-back fixing member that fixes the movement of the bonding tool in the front-back direction.

(Function) After adjusting the inclination of the bonding tool, a parallelism adjustment gauge is used to measure whether the parallelism of the tip end surface to the stage is highly accurate on the order of several μm. After measuring parallelism, if it becomes necessary to adjust only one of the horizontal or front-back tilts of the bonding tool,
Loosen and readjust only the necessary one of the left and right fixing members or the front and rear fixing members. At this time, even if only one of the left and right fixing members or the front and rear fixing members is loosened, the inclination adjustment of the bonding tool is not affected unless the other is loosened.

(Example) The present invention will be explained below based on the drawings.

FIG. 1 and FIG. 2 are diagrams showing a tilt adjustment mechanism of a bonding tool according to the present invention.

First, the configuration will be explained.

In FIG. 1(a), 41 is an IC chip (not shown)
This bonding tool 41 is held by a holder 42 and positioned at a predetermined position on a stage (not shown). The holder 42 is held on the first slider 46 by a holder presser screw 45 via a holder presser 43 and a presser spring 44 .

The holder 42 has a bonding tool 41 in the same figure.
A first cylindrical surface 48 is formed centered on the tip surface 47 of the
A second cylindrical surface 49 centered on a similar tip surface 47 is also formed on the slider 46, and the pair of first cylindrical surfaces 48 and second cylindrical surfaces 49 are in contact with each other.

Therefore, the holder 42 is held by the first slider 46 so as to be rotatable in the left-right direction (direction of arrow C in FIG. 1<a>) centering on the distal end surface 47. A left-right adjustment block 50 is fixed to the front part of the holder 42, and a left-right adjustment screw 51, which is a ball screw, is attached to this left-right adjustment block 50. The left and right adjustment screw 51 is screwed into the first slider 46, and when the left and right adjustment screw 51 is screwed in, the pair of first cylindrical surfaces 48 and second cylindrical surfaces 49 vibrate relative to each other, that is, the holder 42 vibrates relative to each other. It slides relative to the first slider 46. Note that the holder 42, the first slider 46, the first cylindrical surface 48, the second cylindrical surface 49, the left-right adjustment block 50, and the left-right adjustment screw 51 constitute a left-right adjustment means 52 as a whole.

Further, on the right side of the left-right adjustment block 50, a holder fixing screw 53 serving as a left-right fixing member is screwed onto the first slider 46, and the pumping tool whose inclination in the left-right direction is adjusted.
A holder 42 that holds the slider 41 is fixed to a first slider 46.

In FIG. 1(b), the first slider 46 has a third cylindrical surface 54 formed at its upper portion, centered at the point 47 in the figure. The first slider 46 is held on the second slider 58 by a slider presser screw 57 via a slider presser plate 55 and a presser spring 56 .

Further, the second slider 58 is similarly formed with a fourth cylindrical surface 59 centered on the tip surface 47, and the pair of fourth cylindrical surfaces and third cylindrical surface 54 are in sliding contact.

A longitudinal adjustment block 60 is fixed to the first slider 46, and a longitudinal adjustment screw 61 of a ball screw is attached to this longitudinal adjustment block 60. This longitudinal adjustment screw 61 is screwed onto the second slider 58, and when this longitudinal adjustment screw 61 is tightened, the third cylindrical surface 54 changes to the fourth cylindrical surface 58.
9, that is, the first slider 4
6 slides relative to the second slider 58. Therefore, the first slider 46 is held rotatably relative to the second slider 58 in the front-rear direction (in the direction of the arrow in FIG. 1) centering on the distal end surface 47. Note that the first slider 46,
second slider 58, third cylindrical surface 54, fourth cylindrical surface 59,
The longitudinal adjustment block 60 and the longitudinal adjustment screw 61 constitute a longitudinal adjustment means 62 as a whole.

Further, on the left side of the longitudinal adjustment block 60 (see FIG. 1G) again, a slider fixing screw 63 serving as a longitudinal fixing member is screwed onto the second slider 58 to adjust the inclination in the longitudinal direction. A first holding the bonding tool 41
The slider 46 is fixed to a second slider 58.

Next, the action will be explained.

In order to make the tip surface 47 parallel to the stage, the inclination of the bonding tool 41 in the left-right direction and the front-back direction is adjusted. First, as shown in FIG. 2(a), when the left and right adjusting screw 51 is tightened, the first cylindrical surface 48 slides relative to the second cylindrical surface 49.

At this time, the holder 42 having the first cylindrical surface 48 is held = 11
- The held bonding tool 41 rotates in the left-right direction around its tip surface 47 and moves to position E shown by the two-dot chain line. When the horizontal inclination of the bonding tool 41 is adjusted in this manner, the holder fixing screw 53 is tightened to fix the inclination.

Next, as shown in FIG. 2(b), when the longitudinal adjustment screw 61 is tightened, the third cylindrical surface 54 slides relative to the fourth cylindrical surface 59, that is, the first slider 46 2 slides relative to the slider 58. At this time, the bonding tool 41 held by the first slider 46 having the third cylindrical surface 54 swings back and forth around the tip surface 47 and moves to position F shown by the two-dot chain line. In this way,
When the longitudinal inclination of the bonding tool 41 is adjusted, the slider fixing screw 63 is tightened to fix the inclination.

In this way, after adjusting the inclination of the bonding tool 41, the parallel melon 47 of the tip surface with respect to the stage is several μm.
A parallelism adjustment gauge (not shown) is used to measure whether the quality of the melon is high. After measuring the parallelism, if it becomes necessary to adjust only one of the inclinations of the bonding tool 41 in the left-right direction or the front-back direction, loosen only the necessary one of the left-right adjustment screw 51 or the front-rear adjustment screw 61. Readjust. At this time, even if only one of the left and right adjustment screws 51 or the front and back adjustment screws 61 is loosened, unless the other is loosened, the other tilt adjustment of the bonding tool 41 will not be affected, and the tilt in the left and right and front and rear directions will be adjusted again. There is no need to adjust.

Next, the bonding tool 41 connects the first cylindrical surface 48 and the second cylindrical surface 48.
By sliding relative to the cylindrical surface 49, it can be rotated in the left-right direction about its tip surface 47, and by sliding relative to the third cylindrical surface 54 and the fourth cylindrical surface 59, It can be rotated in the rtJ rearward direction about the distal end surface 47. Therefore, the tip end surface 47 will not deviate from a predetermined position relative to the stage. Furthermore, since the inclination adjustment mechanism of this bonding tool is constituted by the left-right adjustment means 52, the holder fixing screw 53, the front-rear adjustment means 62, and the slider fixing screw 63, this mechanism itself becomes compact and does not take up much space.

[Effects of the Invention] As explained above, according to the present invention, after adjusting the inclination of the bonding tool, it is necessary to adjust only one of the inclinations of the bonding tool in the left-right direction or the front-back direction. In this case, even if only one of the left and right fixing members or the front and rear fixing members is released, the tilt adjustment of the other will not be affected unless the other is released, and therefore,
There is no need to adjust the tilt in the left-right direction and front-back direction again.

Moreover, since the bonding tool can be rotated in the left-right direction and the front-back direction around its tip surface, the tip surface will not deviate from a predetermined position with respect to the stage. Roughly speaking, this tilt adjustment mechanism can be adjusted to 1 and does not take up much space.

[Brief explanation of the drawing]

1(a) to 2(b) are diagrams showing a tilt adjustment mechanism of a bonding tool according to the present invention, FIG. 1(a) is a front view of this tilt adjustment mechanism, and FIG. (b) is a side view of this inclination adjustment mechanism, Fig. 2 (a) is an explanatory view of the operation when adjusting the inclination of the bonding tool in the left and right direction, and Fig. 2 (b) is a side view of this inclination adjustment mechanism. FIG. 6 is an explanatory diagram of the operation when adjusting the inclination. FIG. 3 is an explanatory diagram showing the TAB connection method using a bonding tool. 4 to 6 are diagrams showing the inclination adjustment mechanism of a conventional bonding tool, FIG. 4 is a front view of this inclination adjustment mechanism, and FIG. 5 is a sectional view taken along the line v-v in FIG. 4. FIG. 6 is a sectional view taken along IV-IVl in FIG. 4. FIG. 7 is a perspective view showing a parallelism adjustment gauge placed on a stage, and FIG. 8 is an enlarged perspective view showing this parallelism adjustment gauge. FIG. 9 is a front view showing a portion of the tilt adjustment mechanism of Haku's conventional bonding tool. 41... Bonding tool 47... Tip surface 48... First cylindrical surface 49... Second cylindrical surface 52... Left and right adjusting means 53... Left and right fixing member 54... Third cylindrical surface 59...Fourth cylindrical surface 62...Anteroposterior adjustment means 63...Anteroposterior fixing member

Claims (2)

[Claims] (1) A bonding tool for TAB-connecting an IC chip to a film carrier, a left-right adjustment means for adjusting the bonding tool in the left-right direction around the tip surface of the bonding tool, and a left-right adjustment means for fixing the left-right movement of the bonding tool. A bonding tool comprising a fixing member, a longitudinal adjustment means for adjusting the bonding tool in the front-rear direction about the tip surface of the bonding tool, and a front-rear fixing member for fixing the movement of the bonding tool in the front-rear direction. Tilt adjustment mechanism. (2) The bonding tool inclination adjustment mechanism according to claim 1, wherein the left and right adjusting means and the front and back adjusting means are each formed by a cylindrical surface centered on the bonding tool tip surface.